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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/85205
Ultrasonic bonding
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Patents Grants
last 30 patents
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Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
Patent number
12,143,077
Issue date
Nov 12, 2024
Skyworks Solutions, Inc.
Peter J. Zampardi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and methods for tool mark free stitch bonding
Patent number
12,142,595
Issue date
Nov 12, 2024
Skyworks Solutions, Inc.
Aldrin Quinones Garing
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wire bonding device, wire cutting method and non-transitory compute...
Patent number
12,107,067
Issue date
Oct 1, 2024
Shinkawa Ltd.
Hiroaki Yoshino
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and fabrication method of the semiconductor de...
Patent number
12,074,129
Issue date
Aug 27, 2024
Rohm Co., Ltd.
Takukazu Otsuka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming wire interconnect structures and related wire bo...
Patent number
12,057,431
Issue date
Aug 6, 2024
Kulicke and Soffa Industries, Inc.
Basil Milton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package with surface contact wire extensions
Patent number
12,040,260
Issue date
Jul 16, 2024
Texas Instruments Incorporated
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package, method of forming a chip package and method of formin...
Patent number
12,033,972
Issue date
Jul 9, 2024
Infineon Technologies AG
Joachim Mahler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for fabricating the same
Patent number
12,027,490
Issue date
Jul 2, 2024
Infineon Technologies AG
Richard Knipper
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stud bump for wirebonding high voltage isolation barrier connection
Patent number
11,973,052
Issue date
Apr 30, 2024
Texas Instruments Incorporated
Chien-Chang Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for fabricating the same
Patent number
11,908,830
Issue date
Feb 20, 2024
Infineon Technologies AG
Richard Knipper
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
Patent number
11,881,476
Issue date
Jan 23, 2024
Semtech Corporation
Changjun Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-segment wire-bond
Patent number
11,869,868
Issue date
Jan 9, 2024
Semiconductor Components Industries, LLC
Elmer Cunanan Bayron
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
Patent number
11,848,258
Issue date
Dec 19, 2023
Texas Instruments Incorporated
Nazila Dadvand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor apparatus, power module, and manufacturing method of...
Patent number
11,848,298
Issue date
Dec 19, 2023
Mitsubishi Electric Corporation
Yosuke Nakata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for bonding insulated coating wire, connection structure, me...
Patent number
11,791,304
Issue date
Oct 17, 2023
Kaijo Corporation
Akio Sugito
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for electrically connecting contact surfaces of electronic...
Patent number
11,791,309
Issue date
Oct 17, 2023
HERAEUS MATERIALS SINGAPORE PTE. LTD.
Yean Mee Pun
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package structure and method for fabricating the same
Patent number
11,749,617
Issue date
Sep 5, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Harry-Hak-Lay Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and wire bonding method
Patent number
11,749,634
Issue date
Sep 5, 2023
Kioxia Corporation
Kazuya Maruyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,699,641
Issue date
Jul 11, 2023
Rohm Co., Ltd.
Hiroaki Matsubara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Trench insulated gate bipolar transistor packaging structure and me...
Patent number
11,688,698
Issue date
Jun 27, 2023
Gree Electric Appliances, Inc. of Zhuhai
Saichang Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor chip, method for producing a power semiconducto...
Patent number
11,664,335
Issue date
May 30, 2023
Semikron Elektronik GmbH & Co., KG
Wolfgang-Michael Schulz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and fabrication method of the semiconductor de...
Patent number
11,658,140
Issue date
May 23, 2023
Rohm Co., Ltd.
Takukazu Otsuka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultrasonic bonding apparatus, ultrasonic bonding inspection method...
Patent number
11,631,653
Issue date
Apr 18, 2023
Mitsubishi Electric Corporation
Minoru Egusa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
11,626,352
Issue date
Apr 11, 2023
Rohm Co., Ltd.
Motoharu Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and power amplifier module
Patent number
11,621,678
Issue date
Apr 4, 2023
Murata Manufacturing Co., Ltd.
Isao Obu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bonding method for semiconductor package
Patent number
11,594,503
Issue date
Feb 28, 2023
Samsung Electronics Co., Ltd.
Hosoo Han
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Ultrasonic bonding apparatus, ultrasonic bonding inspection method...
Patent number
11,569,197
Issue date
Jan 31, 2023
Mitsubishi Electric Corporation
Minoru Egusa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic package for integrated circuits and related methods
Patent number
11,538,717
Issue date
Dec 27, 2022
Texas Instruments Incorporated
Kurt Peter Wachtler
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Multi-segment wire-bond
Patent number
11,515,284
Issue date
Nov 29, 2022
Semiconductor Components Industries, LLC
Elmer Cunanan Bayron
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for optimizing looping parameters and looping t...
Patent number
11,495,570
Issue date
Nov 8, 2022
Kulicke and Soffa Industries, Inc.
Ivy Wei Qin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING SEMICONDUCTOR MODULE
Publication number
20240387443
Publication date
Nov 21, 2024
Fuji Electric Co., Ltd.
Daisuke INOUE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL
Publication number
20240379613
Publication date
Nov 14, 2024
SHINKAWA LTD.
Hiroshi MUNAKATA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...
Publication number
20240363583
Publication date
Oct 31, 2024
KULICKE AND SOFFA INDUSTRIES, INC.
Basil Milton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WEDGE TOOL AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240335901
Publication date
Oct 10, 2024
Mitsubishi Electric Corporation
Erubi SUZUKI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20240312976
Publication date
Sep 19, 2024
KIOXIA Corporation
Keiichi NIWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BALL BONDING FOR SEMICONDUCTOR DEVICES
Publication number
20240290746
Publication date
Aug 29, 2024
TEXAS INSTRUMENTS INCORPORATED
Ye ZHUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STUD BUMP FOR WIREBONDING HIGH VOLTAGE ISOLATION BARRIER CONNECTION
Publication number
20240274570
Publication date
Aug 15, 2024
TEXAS INSTRUMENTS INCORPORATED
Chien-Chang Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
Publication number
20240178125
Publication date
May 30, 2024
TEXAS INSTRUMENTS INCORPORATED
Masamitsu Matsuura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
Publication number
20240153853
Publication date
May 9, 2024
TEXAS INSTRUMENTS INCORPORATED
Nazila Dadvand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ULTRASONIC TRANSDUCER OPERABLE AT MULTIPLE RESONANT FREQUENCIES
Publication number
20240116126
Publication date
Apr 11, 2024
ASMPT SINGAPORE PTE. LTD
Tsz Kit YU
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR
Publication number
20240105667
Publication date
Mar 28, 2024
TANAKA DENSHI KOGYO K.K.
Shuichi MITOMA
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240105561
Publication date
Mar 28, 2024
Kabushiki Kaisha Toshiba
Fumiyoshi KAWASHIRO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
Publication number
20230361050
Publication date
Nov 9, 2023
Taiwan Semiconductor Manufacturing company Ltd.
HARRY-HAK-LAY CHUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Publication number
20230299038
Publication date
Sep 21, 2023
Kabushiki Kaisha Toshiba
Tomohiro Iguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...
Publication number
20230282613
Publication date
Sep 7, 2023
SHINKAWA LTD.
Toshihiko Toyama
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20230260952
Publication date
Aug 17, 2023
Mitsubishi Electric Corporation
Hideki YAMAGUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF THE SEMICONDUCTOR DE...
Publication number
20230253352
Publication date
Aug 10, 2023
ROHM CO., LTD.
Takukazu OTSUKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20230207432
Publication date
Jun 29, 2023
ROHM CO., LTD.
Motoharu Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BONDING DEVICE, WIRE CUTTING METHOD AND NON-TRANSITORY COMPUTE...
Publication number
20230163097
Publication date
May 25, 2023
SHINKAWA LTD.
Hiroaki YOSHINO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...
Publication number
20230154888
Publication date
May 18, 2023
KULICKE AND SOFFA INDUSTRIES, INC.
Jon W. Brunner
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20230115289
Publication date
Apr 13, 2023
Mitsubishi Electric Corporation
Koji YAMAZAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20230116738
Publication date
Apr 13, 2023
Rohm Co., Ltd.
Katsutoki SHIRAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-SEGMENT WIRE-BOND
Publication number
20230098210
Publication date
Mar 30, 2023
Semiconductor Components Industries, LLC
Elmer Cunanan BAYRON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STUD BUMP FOR WIREBONDING HIGH VOLTAGE ISOLATION BARRIER CONNECTION
Publication number
20220352111
Publication date
Nov 3, 2022
TEXAS INSTRUMENTS INCORPORATED
Chien-Chang Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
Publication number
20220328423
Publication date
Oct 13, 2022
Taiwan Semiconductor Manufacturing company Ltd.
HARRY-HAK-LAY CHUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR APPARATUS, POWER MODULE, AND MANUFACTURING METHOD OF...
Publication number
20220238476
Publication date
Jul 28, 2022
Mitsubishi Electric Corporation
Yosuke Nakata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PROCESSOR CHIP AND MEMORY CHIP
Publication number
20220216193
Publication date
Jul 7, 2022
Samsung Electronics Co., Ltd.
Kil-Soo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
Publication number
20220208665
Publication date
Jun 30, 2022
TEXAS INSTRUMENTS INCORPORATED
Nazila Dadvand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE WITH SURFACE CONTACT WIRE EXTENSIONS
Publication number
20220208660
Publication date
Jun 30, 2022
TEXAS INSTRUMENTS INCORPORATED
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE, ELECTRONIC APPARATUS, AND METHOD FOR MANUFAC...
Publication number
20220208718
Publication date
Jun 30, 2022
Sony Semiconductor Solutions Corporation
YASUSHI OTSUKA
H01 - BASIC ELECTRIC ELEMENTS