Ultrasonic frequency [f] 50 Khz=<f< 75 KHz

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CPC
H01L2924/20303

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/20303Ultrasonic frequency [f] 50 Khz=<f< 75 KHz

Industries

Patents Grantslast 30 patents

Information Patent Grant
Connecting device and circuit chip connecting method using connecti...
- Patent number 10,756,045
- Issue date Aug 25, 2020
- Samsung Display Co., Ltd.
- Seung Hwa Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,312,216
- Issue date Jun 4, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,297,568
- Issue date May 21, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum coated copper bond wire and method of making the same
- Patent number 9,966,355
- Issue date May 8, 2018
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 9,905,530
- Issue date Feb 27, 2018
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 9,633,981
- Issue date Apr 25, 2017
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
OLED device in contact with a conductor
- Patent number 9,362,525
- Issue date Jun 7, 2016
- Koninklijke Philips Electronics N.V.
- Jeroen Henri Antoine Maria Van Buul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum coated copper ribbon
- Patent number 9,214,444
- Issue date Dec 15, 2015
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Ribbon bonding in an electronic package
- Patent number 8,685,789
- Issue date Apr 1, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon bonding in an electronic package
- Patent number 8,685,791
- Issue date Apr 1, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacting a device with a conductor
- Patent number 8,679,867
- Issue date Mar 25, 2014
- Koninklijke Philips N.V.
- Jeroen Henri Antoine Maria Van Buul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for controlling the generation of ultrasonic wire...
- Patent number 8,020,746
- Issue date Sep 20, 2011
- Technische Universitaet Berlin
- Ute Geissler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ribbon bonding in an electronic package
- Patent number 7,745,253
- Issue date Jun 29, 2010
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding simulation
- Patent number 7,085,699
- Issue date Aug 1, 2006
- Texas Instruments Incorporated
- Manjula N. Variyam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 6,897,570
- Issue date May 24, 2005
- Renesas Technology, Corporation
- Takashi Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic vibration mode for wire bonding
- Patent number 6,685,083
- Issue date Feb 3, 2004
- Micron Technology, Inc.
- Tongbi Jiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnections to copper IC's
- Patent number 6,620,720
- Issue date Sep 16, 2003
- Agere Systems Inc.
- Ralph Salvatore Moyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to improve the reliability of thermosonic gold to aluminum w...
- Patent number 6,593,222
- Issue date Jul 15, 2003
- Lattice Corporation
- Richard C. Smoak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic vibration mode for wire bonding
- Patent number 6,367,685
- Issue date Apr 9, 2002
- Tongbi Jiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic vibration mode for wire bonding
- Patent number 6,244,498
- Issue date Jun 12, 2001
- Micron Semiconductor, Inc.
- Tongbi Jiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 6,112,969
- Issue date Sep 5, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Hiroshi Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method, wire bonding apparatus and semiconductor devic...
- Patent number 6,105,848
- Issue date Aug 22, 2000
- Mitsubishi Denki Kabushki Kaisha
- Hiroshi Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic bonding method and ultrasonic bonding apparatus
- Patent number 5,884,835
- Issue date Mar 23, 1999
- Hitachi, Ltd.
- Ryoichi Kajiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding method, wire bonding apparatus and semiconductor devic...
- Patent number 5,838,071
- Issue date Nov 17, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Hiroshi Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOSFET and method of preparing the same
- Patent number 5,831,338
- Issue date Nov 3, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Atsunobu Kawamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and testing apparatus of a bonded portion
- Patent number 5,323,952
- Issue date Jun 28, 1994
- Hitachi, Ltd.
- Mituo Kato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of bonding a microelectronic device
- Patent number 5,302,550
- Issue date Apr 12, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Jitsuho Hirota
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device with a copper wires ball bonded to aluminum el...
- Patent number 5,229,646
- Issue date Jul 20, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Kiyoaki Tsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method
- Patent number 5,115,960
- Issue date May 26, 1992
- Kabushiki Kaisha Toshiba
- Yasuhiko Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing semiconductor device
- Patent number 5,116,783
- Issue date May 26, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Kiyoaki Tsumura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONNECTING DEVICE AND CIRCUIT CHIP CONNECTING METHOD USING CONNECTI...
- Publication number 20180211933
- Publication date Jul 26, 2018
- SAMSUNG DISPLAY CO., LTD.
- Seung Hwa HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180182733
- Publication date Jun 28, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180026006
- Publication date Jan 25, 2018
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20170179072
- Publication date Jun 22, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20160254252
- Publication date Sep 1, 2016
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OLED DEVICE IN CONTACT WITH A CONDUCTOR
- Publication number 20140167023
- Publication date Jun 19, 2014
- Koninklijke Philips N.V.
- JEROEN HENRI ANTOINE MARIA VAN BUUL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIBBON BONDING IN AN ELECTRONIC PACKAGE
- Publication number 20130134577
- Publication date May 30, 2013
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACTING A DEVICE WITH A CONDUCTOR
- Publication number 20110156091
- Publication date Jun 30, 2011
- Koninklijke Philips Electronics N.V.
- Jeroem Henri Antoine Maria Van Buul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIBBON BONDING IN AN ELECTRONIC PACKAGE
- Publication number 20100214754
- Publication date Aug 26, 2010
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20100167468
- Publication date Jul 1, 2010
- Renesas Technology Corp.
- Hirohisa Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR CONTROLLING THE GENERATION OF ULTRASONIC WIRE...
- Publication number 20100025453
- Publication date Feb 4, 2010
- Technische Universitaet Berlin
- Ute Geissler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE WIRE BONDING
- Publication number 20080191367
- Publication date Aug 14, 2008
- STATS ChipPAC, Ltd.
- Taehun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING WIRE LOOP AND METHOD AND APPARATUS FOR...
- Publication number 20070290372
- Publication date Dec 20, 2007
- Samsung Electronics Co., Ltd.
- Won-Chul LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20070187823
- Publication date Aug 16, 2007
- Naotaka Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20070178623
- Publication date Aug 2, 2007
- RENESAS TECHNOLOGY CORP.
- Hirohisa Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIBBON BONDING IN AN ELECTRONIC PACKAGE
- Publication number 20070141755
- Publication date Jun 21, 2007
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding method and device of performing the same
- Publication number 20070023487
- Publication date Feb 1, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Jun-young Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ribbon bonding in an electronic package
- Publication number 20050269694
- Publication date Dec 8, 2005
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding simulation
- Publication number 20050133566
- Publication date Jun 23, 2005
- Manjula N. Variyam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20050001314
- Publication date Jan 6, 2005
- Naotaka Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ribbon bonding
- Publication number 20040217488
- Publication date Nov 4, 2004
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing same
- Publication number 20030230809
- Publication date Dec 18, 2003
- Hitachi, Ltd
- Takashi Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to improve the reliability of thermosonic gold to aluminum w...
- Publication number 20030049923
- Publication date Mar 13, 2003
- Richard C. Smoak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel ultrasonic vibration mode for wire bonding
- Publication number 20020096554
- Publication date Jul 25, 2002
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS

Ultrasonic frequency [f] 50 Khz=<f< 75 KHz

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connecting device and circuit chip connecting method using connecti...

Systems and methods for bonding semiconductor elements

Systems and methods for bonding semiconductor elements

Aluminum coated copper bond wire and method of making the same

Systems and methods for bonding semiconductor elements

Systems and methods for bonding semiconductor elements

OLED device in contact with a conductor

Aluminum coated copper ribbon

Ribbon bonding in an electronic package

Ribbon bonding in an electronic package

Contacting a device with a conductor

Method and device for controlling the generation of ultrasonic wire...

Ribbon bonding in an electronic package

Wire bonding simulation

Semiconductor device and method of manufacturing same

Ultrasonic vibration mode for wire bonding

Interconnections to copper IC&#x00027;s

Method to improve the reliability of thermosonic gold to aluminum w...

Ultrasonic vibration mode for wire bonding

Ultrasonic vibration mode for wire bonding

Wire bonding apparatus

Wire bonding method, wire bonding apparatus and semiconductor devic...

Ultrasonic bonding method and ultrasonic bonding apparatus

Wire bonding method, wire bonding apparatus and semiconductor devic...

Power MOSFET and method of preparing the same

Bonding apparatus and testing apparatus of a bonded portion

Method of bonding a microelectronic device

Semiconductor device with a copper wires ball bonded to aluminum el...

Wire bonding method

Method of producing semiconductor device

Patents Applicationslast 30 patents

CONNECTING DEVICE AND CIRCUIT CHIP CONNECTING METHOD USING CONNECTI...

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

OLED DEVICE IN CONTACT WITH A CONDUCTOR

RIBBON BONDING IN AN ELECTRONIC PACKAGE

CONTACTING A DEVICE WITH A CONDUCTOR

RIBBON BONDING IN AN ELECTRONIC PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD AND DEVICE FOR CONTROLLING THE GENERATION OF ULTRASONIC WIRE...

SEMICONDUCTOR PACKAGE WIRE BONDING

SEMICONDUCTOR DEVICE HAVING WIRE LOOP AND METHOD AND APPARATUS FOR...

Semiconductor device

Method of manufacturing semiconductor device

RIBBON BONDING IN AN ELECTRONIC PACKAGE

Wire bonding method and device of performing the same

Ribbon bonding in an electronic package

Wire bonding simulation

Semiconductor device

Ribbon bonding

Semiconductor device and method of manufacturing same

Method to improve the reliability of thermosonic gold to aluminum w...

Novel ultrasonic vibration mode for wire bonding

Interconnections to copper IC's