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H01L2224/05096

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05096Uniform arrangement

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Devices and methods related to stack structures including passivati...
- Patent number 11,804,460
- Issue date Oct 31, 2023
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,456,265
- Issue date Sep 27, 2022
- Renesas Electronics Corporation
- Takashi Tonegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,431,378
- Issue date Aug 30, 2022
- Renesas Electronics Corporation
- Ryuichi Oikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 11,410,946
- Issue date Aug 9, 2022
- Mitsubishi Electric Corporation
- Daisuke Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked through-silicon vias for multi-device packages
- Patent number 11,398,415
- Issue date Jul 26, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for forming the same
- Patent number 11,282,802
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack structures in electronic devices including passivation layers...
- Patent number 11,257,774
- Issue date Feb 22, 2022
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 11,158,591
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Chan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 11,011,482
- Issue date May 18, 2021
- Samsung Electronics Co., Ltd.
- Doo Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip-size package with redistribution layer
- Patent number 10,998,267
- Issue date May 4, 2021
- Mediatek Inc.
- Yan-Liang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,892,227
- Issue date Jan 12, 2021
- Samsung Electronics Co., Ltd.
- Hyoung Joon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,886,230
- Issue date Jan 5, 2021
- Samsung Electronics Co., Ltd.
- Hyoung Joon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,818,621
- Issue date Oct 27, 2020
- Samsung Electronics Co., Ltd.
- Doo Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallisation for semiconductor device
- Patent number 10,748,847
- Issue date Aug 18, 2020
- Nexperia B.V.
- Paul Huiskamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 10,734,339
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Chan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,714,437
- Issue date Jul 14, 2020
- Samsung Electronics Co., Ltd.
- Doo Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for preventing crack in pad region and fabrica...
- Patent number 10,636,703
- Issue date Apr 28, 2020
- MagnaChip Semiconductor, Ltd.
- Jong-yeul Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,600,748
- Issue date Mar 24, 2020
- Samsung Electronics Co., Ltd.
- Doo Hwan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and ball bonder
- Patent number 10,497,662
- Issue date Dec 3, 2019
- ABLIC Inc.
- Tomomitsu Risaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for forming the same
- Patent number 10,475,758
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper structures with intermetallic coating for integrated circuit...
- Patent number 10,461,052
- Issue date Oct 29, 2019
- Monolithic Power Systems, Inc.
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of fabrication thereof
- Patent number 10,325,834
- Issue date Jun 18, 2019
- Infineon Technologies Dresden GmbH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 10,276,524
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Chan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waterproof structure of pad, waterproof pad, and method for forming...
- Patent number 10,069,236
- Issue date Sep 4, 2018
- Huawei Technologies Co., Ltd.
- Jun Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 10,024,907
- Issue date Jul 17, 2018
- TOSHIBA MEMORY CORPORATION
- Shinya Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip and integrated circuit wafer with guard ring
- Patent number 10,026,699
- Issue date Jul 17, 2018
- Synaptics Japan GK
- Atsushi Obuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip-scale package with redistribution layer
- Patent number 9,953,954
- Issue date Apr 24, 2018
- Mediatek Inc.
- Yan-Liang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underbump metallization structure
- Patent number 9,859,235
- Issue date Jan 2, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device allowing metal layer routing formed directly u...
- Patent number 9,847,294
- Issue date Dec 19, 2017
- Mediatek Inc.
- Chun-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of fabrication thereof
- Patent number 9,773,719
- Issue date Sep 26, 2017
- Infineon Technologies Dresden GmbH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220375887
- Publication date Nov 24, 2022
- KIOXIA Corporation
- Shinya WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...
- Publication number 20220336396
- Publication date Oct 20, 2022
- Skyworks Solutions, Inc.
- Jiro YOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
- Publication number 20200357762
- Publication date Nov 12, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Chan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200343207
- Publication date Oct 29, 2020
- RENESAS ELECTRONICS CORPORATION
- Takashi TONEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20200335460
- Publication date Oct 22, 2020
- Samsung Electronics Co., Ltd.
- Doo Hwan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200112335
- Publication date Apr 9, 2020
- RENESAS ELECTRONICS CORPORATION
- Ryuichi OIKAWA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
- Publication number 20190221534
- Publication date Jul 18, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Chan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND BALL BONDER
- Publication number 20180294243
- Publication date Oct 11, 2018
- SII Semiconductor Corporation
- Tomomitsu RISAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Fabrication Thereof
- Publication number 20170365539
- Publication date Dec 21, 2017
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
- Publication number 20170330848
- Publication date Nov 16, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Chan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER STRUCTURES WITH INTERMETALLIC COATING FOR INTEGRATED CIRCUIT...
- Publication number 20170330853
- Publication date Nov 16, 2017
- Monolithic Power Systems, Inc.
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE SCALE INTEGRATED CIRCUIT CHIP AND LARGE SCALE INTEGRATED CIRC...
- Publication number 20170278805
- Publication date Sep 28, 2017
- Synaptics Japan GK
- Atsushi OBUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20170278812
- Publication date Sep 28, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Doo Hwan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL CHIP-SCALE PACKAGE WITH REDISTRIBUTION LAYER
- Publication number 20170162540
- Publication date Jun 8, 2017
- MEDIATEK INC.
- Yan-Liang JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160372431
- Publication date Dec 22, 2016
- MEDIATEK INC.
- Chun-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FOR PREVENTING CRACK IN PAD REGION AND FABRICA...
- Publication number 20160260634
- Publication date Sep 8, 2016
- Magnachip Semiconductor, Ltd.
- Jong-yeul JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150357297
- Publication date Dec 10, 2015
- SEIKO INSTRUMENTS INC.
- Sukehiro YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE WITH DENSE VIA ARRAY
- Publication number 20150214165
- Publication date Jul 30, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Han TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Pad Structure
- Publication number 20150031200
- Publication date Jan 29, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140321223
- Publication date Oct 30, 2014
- Yoshiro RIHO
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140273453
- Publication date Sep 18, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Jun Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semicondutor Packages and Methods of Fabrication Thereof
- Publication number 20140145319
- Publication date May 29, 2014
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Waterproof Structure of Pad, Waterproof Pad, and Method for Forming...
- Publication number 20140045372
- Publication date Feb 13, 2014
- Huawei Technologies Co., Ltd
- Jun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT SUPPORT PILLAR STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICE...
- Publication number 20140015127
- Publication date Jan 16, 2014
- AGERE SYSTEMS LLC
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130328188
- Publication date Dec 12, 2013
- Elpida Memory, Inc.
- Seiya Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL SOLDER BUMP SUPPORT STRUCTURE
- Publication number 20130320528
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Pad Resistant to Antenna Effect and Method
- Publication number 20130277860
- Publication date Oct 24, 2013
- Wu-Te Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20130256877
- Publication date Oct 3, 2013
- Samsung Electronics Co., Ltd.
- YoungLyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE WITH DENSE VIA ARRAY
- Publication number 20130256893
- Publication date Oct 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Han TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING PENETRATION ELECTRODE PENETRATING THROU...
- Publication number 20130181345
- Publication date Jul 18, 2013
- Elpida Memory, Inc.
- Yoshiharu Kanegae
- H01 - BASIC ELECTRIC ELEMENTS

Uniform arrangement

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Devices and methods related to stack structures including passivati...

Semiconductor device and method of manufacturing the same

Semiconductor device

Semiconductor apparatus

Stacked through-silicon vias for multi-device packages

Semiconductor device structure and method for forming the same

Stack structures in electronic devices including passivation layers...

Bond pad structure for bonding improvement

Fan-out semiconductor package

Wafer-level chip-size package with redistribution layer

Fan-out semiconductor package

Fan-out semiconductor package

Fan-out semiconductor package

Metallisation for semiconductor device

Bond pad structure for bonding improvement

Fan-out semiconductor package

Semiconductor device for preventing crack in pad region and fabrica...

Fan-out semiconductor package

Semiconductor device and ball bonder

Semiconductor device structure and method for forming the same

Copper structures with intermetallic coating for integrated circuit...

Semiconductor packages and methods of fabrication thereof

Bond pad structure for bonding improvement

Waterproof structure of pad, waterproof pad, and method for forming...

Semiconductor device and manufacturing method of semiconductor device

Integrated circuit chip and integrated circuit wafer with guard ring

Wafer-level chip-scale package with redistribution layer

Underbump metallization structure

Semiconductor device allowing metal layer routing formed directly u...

Semiconductor packages and methods of fabrication thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...

BOND PAD STRUCTURE FOR BONDING IMPROVEMENT

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

FAN-OUT SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

BOND PAD STRUCTURE FOR BONDING IMPROVEMENT

SEMICONDUCTOR DEVICE AND BALL BONDER

Semiconductor Packages and Methods of Fabrication Thereof

BOND PAD STRUCTURE FOR BONDING IMPROVEMENT

COPPER STRUCTURES WITH INTERMETALLIC COATING FOR INTEGRATED CIRCUIT...

LARGE SCALE INTEGRATED CIRCUIT CHIP AND LARGE SCALE INTEGRATED CIRC...

FAN-OUT SEMICONDUCTOR PACKAGE

WAFER-LEVEL CHIP-SCALE PACKAGE WITH REDISTRIBUTION LAYER

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE FOR PREVENTING CRACK IN PAD REGION AND FABRICA...

SEMICONDUCTOR DEVICE

BONDING PAD STRUCTURE WITH DENSE VIA ARRAY

Bump Pad Structure

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semicondutor Packages and Methods of Fabrication Thereof

Waterproof Structure of Pad, Waterproof Pad, and Method for Forming...

CONTACT SUPPORT PILLAR STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

COAXIAL SOLDER BUMP SUPPORT STRUCTURE

Chip Pad Resistant to Antenna Effect and Method

SEMICONDUCTOR PACKAGE

BONDING PAD STRUCTURE WITH DENSE VIA ARRAY

SEMICONDUCTOR DEVICE HAVING PENETRATION ELECTRODE PENETRATING THROU...