Use of materials for the substrate

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H05K1/03

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/03Use of materials for the substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Laminate, single-sided metal-clad laminated sheet, and multi-layer...
- Patent number 12,309,919
- Issue date May 20, 2025
- Kaneka Corporation
- Kanji Shimoosako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 12,309,920
- Issue date May 20, 2025
- Ibiden Co., Ltd.
- Shogo Fukui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display panel and display device including the same
- Patent number 12,309,925
- Issue date May 20, 2025
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure for display device
- Patent number 12,302,507
- Issue date May 13, 2025
- AUO CORPORATION
- Chi-Sheng Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temporary carrier and method for manufacturing coreless substrate t...
- Patent number 12,302,508
- Issue date May 13, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact ceramic package with rear cavities
- Patent number 12,295,097
- Issue date May 6, 2025
- Waymo LLC
- Shashank Sharma
- G01 - MEASURING TESTING
Information Patent Grant
Multilayer board and manufacturing method thereof
- Patent number 12,295,098
- Issue date May 6, 2025
- AZOTEK CO., LTD.
- Hung-Jung Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Component carrier with partially metallized hole using anti-plating...
- Patent number 12,295,108
- Issue date May 6, 2025
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Jiangfeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stray inductance busbar structure for power module
- Patent number 12,294,312
- Issue date May 6, 2025
- ZHENGHAI GROUP CO., LTD.
- Xianye Mao
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Multilayer resin substrate and electronic component
- Patent number 12,289,826
- Issue date Apr 29, 2025
- Murata Manufacturing Co., Ltd.
- Takako Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed board and electronic device
- Patent number 12,289,827
- Issue date Apr 29, 2025
- Kioxia Corporation
- Yuta Tsubouchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, resin-equipped film, resin- equipped me...
- Patent number 12,286,500
- Issue date Apr 29, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Taichi Nakashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Loss-dissipation flexible copper clad laminate, manufacturing metho...
- Patent number 12,286,511
- Issue date Apr 29, 2025
- CPC CORPORATION, TAIWAN
- Ching-Hsuan Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for preparing liquid crystal polymer film, liquid crystal po...
- Patent number 12,286,577
- Issue date Apr 29, 2025
- JIANGMEN DEZHONGTAI ENGINEERING PLASTICS TECHNOLOGY CO., LTD.
- Yonghua Liang
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Grant
Glass cloth, prepreg, and printed wiring board
- Patent number 12,286,731
- Issue date Apr 29, 2025
- Nitto Boseki Co., LTD
- Hiroyuki Kawanishi
- D03 - WEAVING
Information Patent Grant
Laminate, laminate with buildup layer, laminate with metal foil, an...
- Patent number 12,284,755
- Issue date Apr 22, 2025
- SEKISUI KASEI CO., LTD.
- Koichiro Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for manufacturing thermoplastic liquid crystal polymer film...
- Patent number 12,280,550
- Issue date Apr 22, 2025
- Kuraray Co., Ltd.
- Takahiro Nakashima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Inhomogeneous dielectric medium high-speed stripline trace system
- Patent number 12,284,751
- Issue date Apr 22, 2025
- Dell Products L.P.
- Arun Reddy Chada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing wiring board, wiring board, method for man...
- Patent number 12,284,767
- Issue date Apr 22, 2025
- Fujikura Ltd.
- Kazutoshi Koshimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic-cladded copper plate and method for manufacturing ceramic-c...
- Patent number 12,284,766
- Issue date Apr 22, 2025
- BYD Company Limited
- Wei Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Resin composition, prepreg, film with resin, metal foil with resin,...
- Patent number 12,275,846
- Issue date Apr 15, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Jun Yasumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 12,279,368
- Issue date Apr 15, 2025
- Ibiden Co., Ltd.
- Satoru Kawai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring board and display device
- Patent number 12,279,378
- Issue date Apr 15, 2025
- Kyocera Corporation
- Nobuyuki Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including waterproof structure
- Patent number 12,273,474
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Gidae Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Power module
- Patent number 12,273,995
- Issue date Apr 8, 2025
- AMOSENSE CO., LTD.
- Taejung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate module with filter function
- Patent number 12,273,994
- Issue date Apr 8, 2025
- Murata Manufacturing Co., Ltd.
- Noriaki Okuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fiber sheet, and layered body, circuit board and electronic board u...
- Patent number 12,273,996
- Issue date Apr 8, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomohiro Fukao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer resin substrate and method for producing same
- Patent number 12,269,238
- Issue date Apr 8, 2025
- Murata Manufacturing Co., Ltd.
- Yoshimasa Nishi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Trim element comprising a functional layer made of carbon material
- Patent number 12,263,795
- Issue date Apr 1, 2025
- Faurecia Interieur Industrie
- Godefroy Beau
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Curable composition for inkjet, cured product and flexible printed...
- Patent number 12,264,249
- Issue date Apr 1, 2025
- Microcosm Technology Co., Ltd.
- Bo-Hung Lai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
ALTERNATIVE FOR FR-4 MATERIAL
- Publication number 20250168976
- Publication date May 22, 2025
- Papershell AB
- Anders BREITHOLTZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE
- Publication number 20250168988
- Publication date May 22, 2025
- Unimicron Technology Corp.
- Jeng-Ting LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATE, PRI...
- Publication number 20250163267
- Publication date May 22, 2025
- Masashi OJI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CORE SUBSTRATE FOR WIRING BOARDS AND METHOD FOR PRODUCING SAME, AND...
- Publication number 20250168975
- Publication date May 22, 2025
- Resonac Corporation
- Masataka NISHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUORORESIN LONG FILM, METAL-CLAD LAMINATE AND SUBSTRATE FOR CIRCUIT
- Publication number 20250168974
- Publication date May 22, 2025
- DAIKIN INDUSTRIES, LTD.
- Kenzo TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...
- Publication number 20250168977
- Publication date May 22, 2025
- The Trustees of the University of Pennsylvania
- Alan T. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION AND USES OF THE SAME
- Publication number 20250163269
- Publication date May 22, 2025
- TAIWAN UNION TECHNOLOGY CORPORATION
- TSUNG-HSIEN LIN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DIPHENYL(METH)ACRYLAMIDE-CONTAINING THERMOSETTING RESIN COMPOSITION...
- Publication number 20250163200
- Publication date May 22, 2025
- Nippon Soda Co., Ltd.
- Taiki YAMATE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MODIFIED BISMALEIMIDE PREPOLYMER, RESIN COMPOSITION AND USE OF RESI...
- Publication number 20250163222
- Publication date May 22, 2025
- SHENGYI TECHNOLOGY (SUZHOU) CO., LTD
- Xiangxiu CHEN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLYIMIDE PRECURSOR FOR DISPLAY SUBSTRATE, POLYIMIDE FILM FOR DISPL...
- Publication number 20250163218
- Publication date May 22, 2025
- UBE Corporation
- Taiga ADACHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20250159803
- Publication date May 15, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Youngwoong Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE-ATTACHED METAL SUBSTRATE AND LAMINATE
- Publication number 20250154395
- Publication date May 15, 2025
- ZACROS Corporation
- Tadahiro NOMURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20250159801
- Publication date May 15, 2025
- Chipbond Technology Corporation
- Kung-Tzu Tu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250157910
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING-ATTACHED ADHESIVE SUBSTRATE, STACKED DEVICE, GLASS STACKED B...
- Publication number 20250159795
- Publication date May 15, 2025
- AGC Inc.
- Kenji FUJITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
GLASS CLOTH, PREPREG AND PRINTED WIRING BOARD
- Publication number 20250146191
- Publication date May 8, 2025
- Asahi Kasei Kabushiki Kaisha
- Amane HIROSE
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Application
ECO-FRIENDLY PRINTED CIRCUIT BOARD FOR HIGH TEMPERATURE AND LOW TEM...
- Publication number 20250151193
- Publication date May 8, 2025
- SANDISK TECHNOLOGIES, INC.
- Vigneshwarram Kumaresan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20250151195
- Publication date May 8, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250142724
- Publication date May 1, 2025
- KYOCERA CORPORATION
- Toshifumi HIGASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPOLYMER, METHOD OF PREPARING THE SAME, RESIN COMPOSITION, AND PRO...
- Publication number 20250136805
- Publication date May 1, 2025
- Elite Electronic Material (Zhongshan) Co., Ltd.
- Xinwen WANG
- B32 - LAYERED PRODUCTS
Information Patent Application
BACK-TO-BACK SOLID STATE LIGHTING DEVICES AND ASSOCIATED METHODS
- Publication number 20250140774
- Publication date May 1, 2025
- Micron Technology, Inc.
- Cem Basceri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION AND PRODUCT THEREOF
- Publication number 20250136804
- Publication date May 1, 2025
- Elite Electronic Material (Zhongshan) Co., Ltd.
- Zhilong HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER COMPONENT SUBMOUNT AND MANUFACTURING METHOD THEREOF
- Publication number 20250142730
- Publication date May 1, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Jia-Zheng Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RESIN COMPOSITION, PREPREG, FILM WITH RESIN, SHEET OF METAL FOIL WI...
- Publication number 20250129245
- Publication date Apr 24, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Masafumi HONMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD DIELECTRIC MOLDING, MACHINING AND WIRE INSERTION
- Publication number 20250133654
- Publication date Apr 24, 2025
- INFINITUM ELECTRIC INC.
- Edward C. CARIGNAN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
POROUS FILM AND COPPER CLAD LAMINATE
- Publication number 20250129212
- Publication date Apr 24, 2025
- Industrial Technology Research Institute
- Li-Ting HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20250125239
- Publication date Apr 17, 2025
- Shinko Electric Industries Co., Ltd.
- Yuji YUKIIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250126718
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROPARTICLE-FILLED LAMINATE MATERIAL
- Publication number 20250126708
- Publication date Apr 17, 2025
- Dell Products L.P.
- Sandor T. FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250126709
- Publication date Apr 17, 2025
- IBIDEN CO., LTD.
- Tomoyuki IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Use of materials for the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Laminate, single-sided metal-clad laminated sheet, and multi-layer...

Wiring substrate

Display panel and display device including the same

Circuit board structure for display device

Temporary carrier and method for manufacturing coreless substrate t...

Compact ceramic package with rear cavities

Multilayer board and manufacturing method thereof

Component carrier with partially metallized hole using anti-plating...

Low stray inductance busbar structure for power module

Multilayer resin substrate and electronic component

Printed board and electronic device

Resin composition, prepreg, resin-equipped film, resin- equipped me...

Loss-dissipation flexible copper clad laminate, manufacturing metho...

Method for preparing liquid crystal polymer film, liquid crystal po...

Glass cloth, prepreg, and printed wiring board

Laminate, laminate with buildup layer, laminate with metal foil, an...

Methods for manufacturing thermoplastic liquid crystal polymer film...

Inhomogeneous dielectric medium high-speed stripline trace system

Method for manufacturing wiring board, wiring board, method for man...

Ceramic-cladded copper plate and method for manufacturing ceramic-c...

Resin composition, prepreg, film with resin, metal foil with resin,...

Printed wiring board

Wiring board and display device

Electronic device including waterproof structure

Power module

Multilayer substrate module with filter function

Fiber sheet, and layered body, circuit board and electronic board u...

Multilayer resin substrate and method for producing same

Trim element comprising a functional layer made of carbon material

Curable composition for inkjet, cured product and flexible printed...

Patents Applicationslast 30 patents

ALTERNATIVE FOR FR-4 MATERIAL

SUBSTRATE STRUCTURE

THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATE, PRI...

CORE SUBSTRATE FOR WIRING BOARDS AND METHOD FOR PRODUCING SAME, AND...

FLUORORESIN LONG FILM, METAL-CLAD LAMINATE AND SUBSTRATE FOR CIRCUIT

Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...

RESIN COMPOSITION AND USES OF THE SAME

DIPHENYL(METH)ACRYLAMIDE-CONTAINING THERMOSETTING RESIN COMPOSITION...

MODIFIED BISMALEIMIDE PREPOLYMER, RESIN COMPOSITION AND USE OF RESI...

POLYIMIDE PRECURSOR FOR DISPLAY SUBSTRATE, POLYIMIDE FILM FOR DISPL...

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

ADHESIVE-ATTACHED METAL SUBSTRATE AND LAMINATE

FLEXIBLE CIRCUIT BOARD

CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME

WIRING-ATTACHED ADHESIVE SUBSTRATE, STACKED DEVICE, GLASS STACKED B...

GLASS CLOTH, PREPREG AND PRINTED WIRING BOARD

ECO-FRIENDLY PRINTED CIRCUIT BOARD FOR HIGH TEMPERATURE AND LOW TEM...

WIRING SUBSTRATE

WIRING BOARD

COPOLYMER, METHOD OF PREPARING THE SAME, RESIN COMPOSITION, AND PRO...

BACK-TO-BACK SOLID STATE LIGHTING DEVICES AND ASSOCIATED METHODS

RESIN COMPOSITION AND PRODUCT THEREOF

POWER COMPONENT SUBMOUNT AND MANUFACTURING METHOD THEREOF

RESIN COMPOSITION, PREPREG, FILM WITH RESIN, SHEET OF METAL FOIL WI...

PRINTED CIRCUIT BOARD DIELECTRIC MOLDING, MACHINING AND WIRE INSERTION

POROUS FILM AND COPPER CLAD LAMINATE

INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME

PRINTED CIRCUIT BOARD

MICROPARTICLE-FILLED LAMINATE MATERIAL

PRINTED WIRING BOARD