Use of materials for the substrate

Industry

CPC
H05K1/03

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/03Use of materials for the substrate

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Multilayer resin substrate and electronic component
- Patent number 12,289,826
- Issue date Apr 29, 2025
- Murata Manufacturing Co., Ltd.
- Takako Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed board and electronic device
- Patent number 12,289,827
- Issue date Apr 29, 2025
- Kioxia Corporation
- Yuta Tsubouchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, resin-equipped film, resin- equipped me...
- Patent number 12,286,500
- Issue date Apr 29, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Taichi Nakashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Loss-dissipation flexible copper clad laminate, manufacturing metho...
- Patent number 12,286,511
- Issue date Apr 29, 2025
- CPC CORPORATION, TAIWAN
- Ching-Hsuan Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for preparing liquid crystal polymer film, liquid crystal po...
- Patent number 12,286,577
- Issue date Apr 29, 2025
- JIANGMEN DEZHONGTAI ENGINEERING PLASTICS TECHNOLOGY CO., LTD.
- Yonghua Liang
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Grant
Glass cloth, prepreg, and printed wiring board
- Patent number 12,286,731
- Issue date Apr 29, 2025
- Nitto Boseki Co., LTD
- Hiroyuki Kawanishi
- D03 - WEAVING
Information Patent Grant
Laminate, laminate with buildup layer, laminate with metal foil, an...
- Patent number 12,284,755
- Issue date Apr 22, 2025
- SEKISUI KASEI CO., LTD.
- Koichiro Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for manufacturing thermoplastic liquid crystal polymer film...
- Patent number 12,280,550
- Issue date Apr 22, 2025
- Kuraray Co., Ltd.
- Takahiro Nakashima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Inhomogeneous dielectric medium high-speed stripline trace system
- Patent number 12,284,751
- Issue date Apr 22, 2025
- Dell Products L.P.
- Arun Reddy Chada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing wiring board, wiring board, method for man...
- Patent number 12,284,767
- Issue date Apr 22, 2025
- Fujikura Ltd.
- Kazutoshi Koshimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic-cladded copper plate and method for manufacturing ceramic-c...
- Patent number 12,284,766
- Issue date Apr 22, 2025
- BYD Company Limited
- Wei Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Resin composition, prepreg, film with resin, metal foil with resin,...
- Patent number 12,275,846
- Issue date Apr 15, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Jun Yasumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 12,279,368
- Issue date Apr 15, 2025
- Ibiden Co., Ltd.
- Satoru Kawai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring board and display device
- Patent number 12,279,378
- Issue date Apr 15, 2025
- Kyocera Corporation
- Nobuyuki Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including waterproof structure
- Patent number 12,273,474
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Gidae Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Power module
- Patent number 12,273,995
- Issue date Apr 8, 2025
- AMOSENSE CO., LTD.
- Taejung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer resin substrate and method for producing same
- Patent number 12,269,238
- Issue date Apr 8, 2025
- Murata Manufacturing Co., Ltd.
- Yoshimasa Nishi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer substrate module with filter function
- Patent number 12,273,994
- Issue date Apr 8, 2025
- Murata Manufacturing Co., Ltd.
- Noriaki Okuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fiber sheet, and layered body, circuit board and electronic board u...
- Patent number 12,273,996
- Issue date Apr 8, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomohiro Fukao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Curable composition for inkjet, cured product and flexible printed...
- Patent number 12,264,249
- Issue date Apr 1, 2025
- Microcosm Technology Co., Ltd.
- Bo-Hung Lai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Trim element comprising a functional layer made of carbon material
- Patent number 12,263,795
- Issue date Apr 1, 2025
- Faurecia Interieur Industrie
- Godefroy Beau
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Flexible printed wiring board and battery wiring module
- Patent number 12,267,950
- Issue date Apr 1, 2025
- Sumitomo Electric Printed Circuits, Inc.
- Shuji Hahakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and manufacturing method thereof
- Patent number 12,267,958
- Issue date Apr 1, 2025
- Murata Manufacturing Co., Ltd.
- Hiromitsu Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems, devices, and methods for robotic end effectors
- Patent number 12,263,580
- Issue date Apr 1, 2025
- Sanctuary Cognitive Systems Corporation
- Connor Richard Shannon
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Machine-knittable conductive hybrid yarns
- Patent number 12,264,421
- Issue date Apr 1, 2025
- Propel, LLC
- Clare King
- D02 - YARNS MECHANICAL FINISHING OF YARNS OR ROPES WARPING OR BEAMING
Information Patent Grant
Fluororesin composition, fluororesin sheet, laminate and substrate...
- Patent number 12,267,954
- Issue date Apr 1, 2025
- Daikin Industries, Ltd.
- Hirokazu Komori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Curable compositions
- Patent number 12,258,445
- Issue date Mar 25, 2025
- AGC Multi Material America, Inc.
- Laibao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 12,262,481
- Issue date Mar 25, 2025
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extension structure of flexible substrates with conductive wires th...
- Patent number 12,262,479
- Issue date Mar 25, 2025
- UNEO INC.
- Chih-Sheng Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-resin composite, surface treatment method, and substrate of c...
- Patent number 12,251,862
- Issue date Mar 18, 2025
- Nanjing University
- Wei Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD
- Publication number 20250142724
- Publication date May 1, 2025
- KYOCERA CORPORATION
- Toshifumi HIGASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPOLYMER, METHOD OF PREPARING THE SAME, RESIN COMPOSITION, AND PRO...
- Publication number 20250136805
- Publication date May 1, 2025
- Elite Electronic Material (Zhongshan) Co., Ltd.
- Xinwen WANG
- B32 - LAYERED PRODUCTS
Information Patent Application
BACK-TO-BACK SOLID STATE LIGHTING DEVICES AND ASSOCIATED METHODS
- Publication number 20250140774
- Publication date May 1, 2025
- Micron Technology, Inc.
- Cem Basceri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION AND PRODUCT THEREOF
- Publication number 20250136804
- Publication date May 1, 2025
- Elite Electronic Material (Zhongshan) Co., Ltd.
- Zhilong HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER COMPONENT SUBMOUNT AND MANUFACTURING METHOD THEREOF
- Publication number 20250142730
- Publication date May 1, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Jia-Zheng Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RESIN COMPOSITION, PREPREG, FILM WITH RESIN, SHEET OF METAL FOIL WI...
- Publication number 20250129245
- Publication date Apr 24, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Masafumi HONMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD DIELECTRIC MOLDING, MACHINING AND WIRE INSERTION
- Publication number 20250133654
- Publication date Apr 24, 2025
- INFINITUM ELECTRIC INC.
- Edward C. CARIGNAN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
POROUS FILM AND COPPER CLAD LAMINATE
- Publication number 20250129212
- Publication date Apr 24, 2025
- Industrial Technology Research Institute
- Li-Ting HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20250125239
- Publication date Apr 17, 2025
- Shinko Electric Industries Co., Ltd.
- Yuji YUKIIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250126718
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROPARTICLE-FILLED LAMINATE MATERIAL
- Publication number 20250126708
- Publication date Apr 17, 2025
- Dell Products L.P.
- Sandor T. FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250126709
- Publication date Apr 17, 2025
- IBIDEN CO., LTD.
- Tomoyuki IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...
- Publication number 20250125270
- Publication date Apr 17, 2025
- ABSOLICS INC.
- Chae Mook LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20250120016
- Publication date Apr 10, 2025
- KYOCERA CORPORATION
- Hiroaki SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSETTING COMPOSITIONS, CURED COMPOSITIONS, AND PREPREGS AND LA...
- Publication number 20250115751
- Publication date Apr 10, 2025
- Isola USA Corp.
- Teck Kai Wong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MODULAR FLEXIBLE SMART MULTI ELECTRODE AIR IONIZER
- Publication number 20250108924
- Publication date Apr 3, 2025
- B/E Aerospace, Inc.
- SRINIVAS MAGAJI GUNDU
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, MET...
- Publication number 20250113439
- Publication date Apr 3, 2025
- Kabushiki Kaisha Toshiba
- Yukihisa MATSUMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FOLDABLE COVER AND DISPLAY FOR AN ELECTRONIC DEVICE
- Publication number 20250110529
- Publication date Apr 3, 2025
- Apple Inc.
- Christopher D. Jones
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
GLASS COMPOSITION, GLASS FIBER INCLUDING THE SAME, AND ELECTRONIC P...
- Publication number 20250109057
- Publication date Apr 3, 2025
- FULLTECH FIBER GLASS CORP.
- Hsien-Chung HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOLDABLE PHOTOVOLTAIC SOLAR PANEL ASSEMBLY FOR GENERATING AND SUPPL...
- Publication number 20250112588
- Publication date Apr 3, 2025
- ASTRADYNE S.R.L.
- Alessia GLODER
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SYSTEMS, METHODS, AND DEVICES FOR CONFIGURING ONE OR MORE MATERIAL...
- Publication number 20250113445
- Publication date Apr 3, 2025
- Meta Platforms Technologies, LLC
- Wenyang Pan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE MATERIAL, APPLICATIONS THEREOF, AND METHOD FOR PRODUCING...
- Publication number 20250109279
- Publication date Apr 3, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- KAZUKI AITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
GLASS CLOTH, PREPREG, AND PRINTED WIRING BOARD
- Publication number 20250109530
- Publication date Apr 3, 2025
- NITTO BOSEKI CO., LTD.
- Hiroyuki KAWANISHI
- D03 - WEAVING
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE HAVING THERMAL IS...
- Publication number 20250112144
- Publication date Apr 3, 2025
- Intel Corporation
- Mohamed R. Saber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDU...
- Publication number 20250113434
- Publication date Apr 3, 2025
- Intel Corporation
- Bai NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION AND PRINTED CIRCUIT BOARD COMPRISING SAME
- Publication number 20250101217
- Publication date Mar 27, 2025
- LG CHEM, LTD.
- Jun Wuk PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NANOTWIN LINER FOR THROUGH GLASS VIAS
- Publication number 20250106982
- Publication date Mar 27, 2025
- Intel Corporation
- Sashi S. KANDANUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES
- Publication number 20250105132
- Publication date Mar 27, 2025
- Intel Corporation
- Pratyush MISHRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLY(ESTER-IMIDE) POLYMERS AND USES THEREOF
- Publication number 20250101182
- Publication date Mar 27, 2025
- SOLVAY SPECIALTY POLYMERS USA, LLC
- Chad Powell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION
- Publication number 20250106983
- Publication date Mar 27, 2025
- Intel Corporation
- Bohan SHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Use of materials for the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multilayer resin substrate and electronic component

Printed board and electronic device

Resin composition, prepreg, resin-equipped film, resin- equipped me...

Loss-dissipation flexible copper clad laminate, manufacturing metho...

Method for preparing liquid crystal polymer film, liquid crystal po...

Glass cloth, prepreg, and printed wiring board

Laminate, laminate with buildup layer, laminate with metal foil, an...

Methods for manufacturing thermoplastic liquid crystal polymer film...

Inhomogeneous dielectric medium high-speed stripline trace system

Method for manufacturing wiring board, wiring board, method for man...

Ceramic-cladded copper plate and method for manufacturing ceramic-c...

Resin composition, prepreg, film with resin, metal foil with resin,...

Printed wiring board

Wiring board and display device

Electronic device including waterproof structure

Power module

Multilayer resin substrate and method for producing same

Multilayer substrate module with filter function

Fiber sheet, and layered body, circuit board and electronic board u...

Curable composition for inkjet, cured product and flexible printed...

Trim element comprising a functional layer made of carbon material

Flexible printed wiring board and battery wiring module

Electronic component and manufacturing method thereof

Systems, devices, and methods for robotic end effectors

Machine-knittable conductive hybrid yarns

Fluororesin composition, fluororesin sheet, laminate and substrate...

Curable compositions

Electrical devices with electrodes on softening polymers and method...

Extension structure of flexible substrates with conductive wires th...

Metal-resin composite, surface treatment method, and substrate of c...

Patents Applicationslast 30 patents

WIRING BOARD

COPOLYMER, METHOD OF PREPARING THE SAME, RESIN COMPOSITION, AND PRO...

BACK-TO-BACK SOLID STATE LIGHTING DEVICES AND ASSOCIATED METHODS

RESIN COMPOSITION AND PRODUCT THEREOF

POWER COMPONENT SUBMOUNT AND MANUFACTURING METHOD THEREOF

RESIN COMPOSITION, PREPREG, FILM WITH RESIN, SHEET OF METAL FOIL WI...

PRINTED CIRCUIT BOARD DIELECTRIC MOLDING, MACHINING AND WIRE INSERTION

POROUS FILM AND COPPER CLAD LAMINATE

INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME

PRINTED CIRCUIT BOARD

MICROPARTICLE-FILLED LAMINATE MATERIAL

PRINTED WIRING BOARD

MANUFACTURING METHOD OF PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...

WIRING BOARD

THERMOSETTING COMPOSITIONS, CURED COMPOSITIONS, AND PREPREGS AND LA...

MODULAR FLEXIBLE SMART MULTI ELECTRODE AIR IONIZER

CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, MET...

FOLDABLE COVER AND DISPLAY FOR AN ELECTRONIC DEVICE

GLASS COMPOSITION, GLASS FIBER INCLUDING THE SAME, AND ELECTRONIC P...

FOLDABLE PHOTOVOLTAIC SOLAR PANEL ASSEMBLY FOR GENERATING AND SUPPL...

SYSTEMS, METHODS, AND DEVICES FOR CONFIGURING ONE OR MORE MATERIAL...

COMPOSITE MATERIAL, APPLICATIONS THEREOF, AND METHOD FOR PRODUCING...

GLASS CLOTH, PREPREG, AND PRINTED WIRING BOARD

INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE HAVING THERMAL IS...

THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDU...

RESIN COMPOSITION AND PRINTED CIRCUIT BOARD COMPRISING SAME

NANOTWIN LINER FOR THROUGH GLASS VIAS

POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES

POLY(ESTER-IMIDE) POLYMERS AND USES THEREOF

STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION