Use of materials for the substrate

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H05K1/03

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/03Use of materials for the substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Cured product and production method of same, and resin sheet and re...
- Patent number 12,227,631
- Issue date Feb 18, 2025
- Ajinomoto Co., Inc.
- Hiroyuki Sakauchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Component carriers connected by staggered interconnect elements
- Patent number 12,232,263
- Issue date Feb 18, 2025
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,232,255
- Issue date Feb 18, 2025
- LG Innotek Co., Ltd
- Yong Suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabric with embedded electrical components
- Patent number 12,232,270
- Issue date Feb 18, 2025
- Apple Inc.
- Daniel D. Sunshine
- D03 - WEAVING
Information Patent Grant
Flexible hybrid electronic substrate and electronic textile includi...
- Patent number 12,232,256
- Issue date Feb 18, 2025
- Industrial Technology Research Institute
- I-Hung Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Benzoxazine resin, composition thereof and copper clad laminate mad...
- Patent number 12,227,637
- Issue date Feb 18, 2025
- A.C.R. TECH CO., LTD.
- Shih-Hao Liao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition, resin sheet, multilayer printed wiring board, an...
- Patent number 12,221,523
- Issue date Feb 11, 2025
- Mitsubishi Gas Chemical Company, Inc.
- Yune Kumazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulating film, metal-clad laminate member, and rewiring layer
- Patent number 12,221,536
- Issue date Feb 11, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Cheng Ping Lin
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic component and method for producing electronic component
- Patent number 12,224,097
- Issue date Feb 11, 2025
- Murata Manufacturing Co., Ltd.
- Kouhei Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Motor vehicle lighting module comprising a ceramic substrate
- Patent number 12,225,662
- Issue date Feb 11, 2025
- Valeo Vision
- Alexandre Val
- F21 - LIGHTING
Information Patent Grant
Printed circuit board dielectric molding, machining and electrolyti...
- Patent number 12,219,698
- Issue date Feb 4, 2025
- INFINITUM ELECTRIC INC.
- Edward C. Carignan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Fluorine resin surface modification method, surface-modified fluori...
- Patent number 12,215,210
- Issue date Feb 4, 2025
- Ushio Denki Kabushiki Kaisha
- Akihiro Shimamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removable and low insertion force connector system
- Patent number 12,219,706
- Issue date Feb 4, 2025
- Intel Corporation
- Jonathan W. Thibado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier
- Patent number 12,219,701
- Issue date Feb 4, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,219,700
- Issue date Feb 4, 2025
- LG Innotek Co., Ltd
- Yong Suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass carrier having protection structure and manufacturing method...
- Patent number 12,218,017
- Issue date Feb 4, 2025
- Unimicron Technology Corp.
- Wen Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 12,213,248
- Issue date Jan 28, 2025
- Ibiden Co., Ltd.
- Shigeto Iyoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, film with resin, sheet of metal foil wi...
- Patent number 12,209,160
- Issue date Jan 28, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Nii
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing dielectric sheet, method for manufacturing...
- Patent number 12,213,249
- Issue date Jan 28, 2025
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Component carrier having a double dielectric layer and method of ma...
- Patent number 12,207,399
- Issue date Jan 21, 2025
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal component and ceramic substrate
- Patent number 12,207,400
- Issue date Jan 21, 2025
- Shinko Electric Industries Co., Ltd.
- Ayako Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Beveled overburden for vias and method of making the same
- Patent number 12,207,405
- Issue date Jan 21, 2025
- Corning Incorporated
- Dhananjay Joshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Film, wiring board, and method for manufacturing wiring board
- Patent number 12,202,941
- Issue date Jan 21, 2025
- FUJIFILM Corporation
- Shohei Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive garment fastening product
- Patent number 12,201,167
- Issue date Jan 21, 2025
- Prym Intimates Group Limited
- Heenatikumbure Kavisekara Mudiyanselage Anjana Piushan Kavisekara
- A41 - WEARING APPAREL
Information Patent Grant
Embedded smart module
- Patent number 12,207,401
- Issue date Jan 21, 2025
- National Taipel University of Technology
- Syang-Peng Rwei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,200,859
- Issue date Jan 14, 2025
- TOPPAN INC.
- Jun Onohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, cured product, sheet lamination material, resin...
- Patent number 12,195,636
- Issue date Jan 14, 2025
- Ajinomoto Co., Inc.
- Kenji Kawai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Substrate and manufacturing method thereof
- Patent number 12,199,027
- Issue date Jan 14, 2025
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper metallization for through-glass vias on thin glass
- Patent number 12,200,875
- Issue date Jan 14, 2025
- Industrial Technology Research Institute
- Yiu-Hsiang Chang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring structure, display substrate and display device
- Patent number 12,193,154
- Issue date Jan 7, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Zhifeng Zhan
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
STRETCHABLE, FABRIC SENSOR, WEARABLE ELECTRONIC DEVICE INCLUDING TH...
- Publication number 20250063654
- Publication date Feb 20, 2025
- Yale University
- LINA SANCHEZ-BOTERO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Conformal Wearable Battery
- Publication number 20250063669
- Publication date Feb 20, 2025
- Inventus Power, Inc.
- Timothy James Vallaro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250063653
- Publication date Feb 20, 2025
- InnoLux Corporation
- Roger HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20250063671
- Publication date Feb 20, 2025
- LX Semicon Co., Ltd.
- Nam Tae CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLAME-RETARDANT COMPOSITION
- Publication number 20250051645
- Publication date Feb 13, 2025
- Chang Chun Plastics Co., Ltd.
- An-Pang TU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250056721
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Cheng-Jia LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20250056713
- Publication date Feb 13, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Ho-Jae LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER CLAD LAMINATE AND USES OF THE SAME
- Publication number 20250056720
- Publication date Feb 13, 2025
- TAIWAN UNION TECHNOLOGY CORPORATION
- Jui-Hsiang TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEX...
- Publication number 20250056728
- Publication date Feb 13, 2025
- NIPPON MEKTRON, LTD.
- Akihiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE, METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, WIRI...
- Publication number 20250056719
- Publication date Feb 13, 2025
- KYOCERA CORPORATION
- Koutarou NAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250056718
- Publication date Feb 13, 2025
- IBIDEN CO., LTD.
- Atsushi ISHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURABLE POLYMER, CURABLE COMPOSITION, PREPREG, MULTILAYER BODY, MET...
- Publication number 20250043043
- Publication date Feb 6, 2025
- AGC Inc.
- Kazumi HASHIMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MODIFIED POLYPHENYLENE ETHER RESIN, PREPARATION METHOD THEREOF, AND...
- Publication number 20250043075
- Publication date Feb 6, 2025
- NAN YA PLASTICS CORPORATION
- Cheng-Chung Lee
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ELECTRONIC MODULE, ELECTRONIC EQUIPMENT, IMAGING SENSOR MODULE, IMA...
- Publication number 20250047966
- Publication date Feb 6, 2025
- Canon Kabushiki Kaisha
- Yuya Okada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250048542
- Publication date Feb 6, 2025
- Murata Manufacturing Co., Ltd.
- Nobuo IKEMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED BODY, CERAMIC COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING...
- Publication number 20250048563
- Publication date Feb 6, 2025
- Kabushiki Kaisha Toshiba
- Maki YONETSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRATHIN COMPOSITE DIELECTRICS FOR USE IN PRINTED CIRCUIT BOARDS
- Publication number 20250048548
- Publication date Feb 6, 2025
- AVISHTECH, INC.
- Tarun Amla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIBER WEAVE IN A PRINTED CIRCUIT BOARD SUBSTRATE
- Publication number 20250048549
- Publication date Feb 6, 2025
- Dell Products L.P.
- Sanjay Kumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal-ceramic substrate and method for producing a metal ceramic su...
- Publication number 20250048556
- Publication date Feb 6, 2025
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20250046694
- Publication date Feb 6, 2025
- Innolux Corporation
- Ying-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYIMIDE FILM, HIGH-FREQUENCY CIRCUIT SUBSTRATE, AND FLEXIBLE ELEC...
- Publication number 20250043077
- Publication date Feb 6, 2025
- UBE Corporation
- Kosuke Yamaji
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LIQUID COMPOSITION, PREPREG, METAL SUBSTRATE WITH RESIN, WIRING BOA...
- Publication number 20250043102
- Publication date Feb 6, 2025
- AGC Inc.
- Hiromichi KAMO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURABLE POLYMER, CURABLE COMPOSITION, PREPREG, MULTILAYER BODY, MET...
- Publication number 20250043050
- Publication date Feb 6, 2025
- AGC Inc.
- Kazumi HASHIMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
WIRING SUBSTRATE
- Publication number 20250048562
- Publication date Feb 6, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTIL...
- Publication number 20250040059
- Publication date Jan 30, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Tomoyuki KAWAHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILM AND LAMINATE
- Publication number 20250034424
- Publication date Jan 30, 2025
- FUJIFILM CORPORATION
- Miyoko HARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
3D-SHAPED MODULE WITH INTEGRATED DEVICES AND METHOD
- Publication number 20250040037
- Publication date Jan 30, 2025
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Stephan Harkema
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLID COMPOSITION, CIRCUIT BOARD, AND METHOD FOR PRODUCING SOLID CO...
- Publication number 20250040043
- Publication date Jan 30, 2025
- DAIKIN INDUSTRIES, LTD.
- Kyouhei SAWAKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN
- Publication number 20250040044
- Publication date Jan 30, 2025
- James S. Honan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION, RESIN COMPOSITION FOR PRINTED WIRI...
- Publication number 20250034385
- Publication date Jan 30, 2025
- DAICEL CORPORATION
- Daisuke ITO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Use of materials for the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cured product and production method of same, and resin sheet and re...

Component carriers connected by staggered interconnect elements

Circuit board

Fabric with embedded electrical components

Flexible hybrid electronic substrate and electronic textile includi...

Benzoxazine resin, composition thereof and copper clad laminate mad...

Resin composition, resin sheet, multilayer printed wiring board, an...

Insulating film, metal-clad laminate member, and rewiring layer

Electronic component and method for producing electronic component

Motor vehicle lighting module comprising a ceramic substrate

Printed circuit board dielectric molding, machining and electrolyti...

Fluorine resin surface modification method, surface-modified fluori...

Removable and low insertion force connector system

Component carrier

Circuit board

Glass carrier having protection structure and manufacturing method...

Printed wiring board

Resin composition, prepreg, film with resin, sheet of metal foil wi...

Method for manufacturing dielectric sheet, method for manufacturing...

Component carrier having a double dielectric layer and method of ma...

Metal component and ceramic substrate

Beveled overburden for vias and method of making the same

Film, wiring board, and method for manufacturing wiring board

Conductive garment fastening product

Embedded smart module

Circuit board

Resin composition, cured product, sheet lamination material, resin...

Substrate and manufacturing method thereof

Copper metallization for through-glass vias on thin glass

Wiring structure, display substrate and display device

Patents Applicationslast 30 patents

STRETCHABLE, FABRIC SENSOR, WEARABLE ELECTRONIC DEVICE INCLUDING TH...

Conformal Wearable Battery

ELECTRONIC DEVICE

METHOD FOR MANUFACTURING CIRCUIT BOARD

FLAME-RETARDANT COMPOSITION

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD

COPPER CLAD LAMINATE AND USES OF THE SAME

FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEX...

CERAMIC SUBSTRATE, METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, WIRI...

PRINTED WIRING BOARD

CURABLE POLYMER, CURABLE COMPOSITION, PREPREG, MULTILAYER BODY, MET...

MODIFIED POLYPHENYLENE ETHER RESIN, PREPARATION METHOD THEREOF, AND...

ELECTRONIC MODULE, ELECTRONIC EQUIPMENT, IMAGING SENSOR MODULE, IMA...

CIRCUIT MODULE AND MANUFACTURING METHOD THEREFOR

BONDED BODY, CERAMIC COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING...

ULTRATHIN COMPOSITE DIELECTRICS FOR USE IN PRINTED CIRCUIT BOARDS

FIBER WEAVE IN A PRINTED CIRCUIT BOARD SUBSTRATE

Metal-ceramic substrate and method for producing a metal ceramic su...

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

POLYIMIDE FILM, HIGH-FREQUENCY CIRCUIT SUBSTRATE, AND FLEXIBLE ELEC...

LIQUID COMPOSITION, PREPREG, METAL SUBSTRATE WITH RESIN, WIRING BOA...

CURABLE POLYMER, CURABLE COMPOSITION, PREPREG, MULTILAYER BODY, MET...

WIRING SUBSTRATE

METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTIL...

FILM AND LAMINATE

3D-SHAPED MODULE WITH INTEGRATED DEVICES AND METHOD

SOLID COMPOSITION, CIRCUIT BOARD, AND METHOD FOR PRODUCING SOLID CO...

ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN

THERMOSETTING RESIN COMPOSITION, RESIN COMPOSITION FOR PRINTED WIRI...