Use of materials for the substrate

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H05K1/03

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/03Use of materials for the substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device including waterproof structure
- Patent number 12,273,474
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Gidae Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Power module
- Patent number 12,273,995
- Issue date Apr 8, 2025
- AMOSENSE CO., LTD.
- Taejung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer resin substrate and method for producing same
- Patent number 12,269,238
- Issue date Apr 8, 2025
- Murata Manufacturing Co., Ltd.
- Yoshimasa Nishi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer substrate module with filter function
- Patent number 12,273,994
- Issue date Apr 8, 2025
- Murata Manufacturing Co., Ltd.
- Noriaki Okuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fiber sheet, and layered body, circuit board and electronic board u...
- Patent number 12,273,996
- Issue date Apr 8, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomohiro Fukao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Curable composition for inkjet, cured product and flexible printed...
- Patent number 12,264,249
- Issue date Apr 1, 2025
- Microcosm Technology Co., Ltd.
- Bo-Hung Lai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Trim element comprising a functional layer made of carbon material
- Patent number 12,263,795
- Issue date Apr 1, 2025
- Faurecia Interieur Industrie
- Godefroy Beau
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Machine-knittable conductive hybrid yarns
- Patent number 12,264,421
- Issue date Apr 1, 2025
- Propel, LLC
- Clare King
- D02 - YARNS MECHANICAL FINISHING OF YARNS OR ROPES WARPING OR BEAMING
Information Patent Grant
Systems, devices, and methods for robotic end effectors
- Patent number 12,263,580
- Issue date Apr 1, 2025
- Sanctuary Cognitive Systems Corporation
- Connor Richard Shannon
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Flexible printed wiring board and battery wiring module
- Patent number 12,267,950
- Issue date Apr 1, 2025
- Sumitomo Electric Printed Circuits, Inc.
- Shuji Hahakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and manufacturing method thereof
- Patent number 12,267,958
- Issue date Apr 1, 2025
- Murata Manufacturing Co., Ltd.
- Hiromitsu Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluororesin composition, fluororesin sheet, laminate and substrate...
- Patent number 12,267,954
- Issue date Apr 1, 2025
- Daikin Industries, Ltd.
- Hirokazu Komori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Curable compositions
- Patent number 12,258,445
- Issue date Mar 25, 2025
- AGC Multi Material America, Inc.
- Laibao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 12,262,481
- Issue date Mar 25, 2025
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extension structure of flexible substrates with conductive wires th...
- Patent number 12,262,479
- Issue date Mar 25, 2025
- UNEO INC.
- Chih-Sheng Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-resin composite, surface treatment method, and substrate of c...
- Patent number 12,251,862
- Issue date Mar 18, 2025
- Nanjing University
- Wei Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Prepreg, laminate, and production methods therefor, as well as prin...
- Patent number 12,256,490
- Issue date Mar 18, 2025
- Resonac Corporation
- Mari Shimizu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Substrate structure and cutting method thereof
- Patent number 12,250,776
- Issue date Mar 11, 2025
- Unimicron Technology Corp.
- Jeng-Ting Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded substrate and bonded substrate manufacturing method
- Patent number 12,249,547
- Issue date Mar 11, 2025
- NGK Insulators, Ltd.
- Takashi Ebigase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric substrate and method of forming the same
- Patent number 12,250,767
- Issue date Mar 11, 2025
- VERSIV COMPOSITES LIMITED
- Jennifer Adamchuk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin sheet
- Patent number 12,247,124
- Issue date Mar 11, 2025
- Lintec Corporation
- Yasutaka Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and electronic device
- Patent number 12,245,364
- Issue date Mar 4, 2025
- Shinko Electric Industries Co., Ltd.
- Tatsuaki Denda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable device and display panel and sensor and electronic device
- Patent number 12,245,368
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Yeongjun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems, devices, and methods for robotic end effectors
- Patent number 12,240,102
- Issue date Mar 4, 2025
- Sanctuary Cognitive Systems Corporation
- Connor Richard Shannon
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Methods and systems for fabricating 3D multielectrode arrays with 3...
- Patent number 12,245,369
- Issue date Mar 4, 2025
- University of Oregon
- Timothy Gardner
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Information handling system and peripheral printed circuit board ha...
- Patent number 12,245,372
- Issue date Mar 4, 2025
- Dell Products L.P.
- Peng Lip Goh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High-frequency electronic component and module
- Patent number 12,245,365
- Issue date Mar 4, 2025
- Murata Manufacturing Co., Ltd.
- Hirofumi Oie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and method of forming the same
- Patent number 12,243,813
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite printed wiring board and method of manufacturing composit...
- Patent number 12,238,861
- Issue date Feb 25, 2025
- Mitsubishi Electric Corporation
- Tatsuya Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-clad laminated plate, resin-clad copper foil, and circuit su...
- Patent number 12,233,621
- Issue date Feb 25, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Kitai
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD
- Publication number 20250120016
- Publication date Apr 10, 2025
- KYOCERA CORPORATION
- Hiroaki SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSETTING COMPOSITIONS, CURED COMPOSITIONS, AND PREPREGS AND LA...
- Publication number 20250115751
- Publication date Apr 10, 2025
- Isola USA Corp.
- Teck Kai Wong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, MET...
- Publication number 20250113439
- Publication date Apr 3, 2025
- Kabushiki Kaisha Toshiba
- Yukihisa MATSUMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FOLDABLE COVER AND DISPLAY FOR AN ELECTRONIC DEVICE
- Publication number 20250110529
- Publication date Apr 3, 2025
- Apple Inc.
- Christopher D. Jones
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MODULAR FLEXIBLE SMART MULTI ELECTRODE AIR IONIZER
- Publication number 20250108924
- Publication date Apr 3, 2025
- B/E Aerospace, Inc.
- SRINIVAS MAGAJI GUNDU
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
GLASS COMPOSITION, GLASS FIBER INCLUDING THE SAME, AND ELECTRONIC P...
- Publication number 20250109057
- Publication date Apr 3, 2025
- FULLTECH FIBER GLASS CORP.
- Hsien-Chung HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOLDABLE PHOTOVOLTAIC SOLAR PANEL ASSEMBLY FOR GENERATING AND SUPPL...
- Publication number 20250112588
- Publication date Apr 3, 2025
- ASTRADYNE S.R.L.
- Alessia GLODER
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SYSTEMS, METHODS, AND DEVICES FOR CONFIGURING ONE OR MORE MATERIAL...
- Publication number 20250113445
- Publication date Apr 3, 2025
- Meta Platforms Technologies, LLC
- Wenyang Pan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE MATERIAL, APPLICATIONS THEREOF, AND METHOD FOR PRODUCING...
- Publication number 20250109279
- Publication date Apr 3, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- KAZUKI AITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
GLASS CLOTH, PREPREG, AND PRINTED WIRING BOARD
- Publication number 20250109530
- Publication date Apr 3, 2025
- NITTO BOSEKI CO., LTD.
- Hiroyuki KAWANISHI
- D03 - WEAVING
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE HAVING THERMAL IS...
- Publication number 20250112144
- Publication date Apr 3, 2025
- Intel Corporation
- Mohamed R. Saber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDU...
- Publication number 20250113434
- Publication date Apr 3, 2025
- Intel Corporation
- Bai NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION AND PRINTED CIRCUIT BOARD COMPRISING SAME
- Publication number 20250101217
- Publication date Mar 27, 2025
- LG CHEM, LTD.
- Jun Wuk PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES
- Publication number 20250105132
- Publication date Mar 27, 2025
- Intel Corporation
- Pratyush MISHRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOTWIN LINER FOR THROUGH GLASS VIAS
- Publication number 20250106982
- Publication date Mar 27, 2025
- Intel Corporation
- Sashi S. KANDANUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLY(ESTER-IMIDE) POLYMERS AND USES THEREOF
- Publication number 20250101182
- Publication date Mar 27, 2025
- SOLVAY SPECIALTY POLYMERS USA, LLC
- Chad Powell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION
- Publication number 20250106983
- Publication date Mar 27, 2025
- Intel Corporation
- Bohan SHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES
- Publication number 20250106997
- Publication date Mar 27, 2025
- Intel Corporation
- Ehsan ZAMANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED BODY AND CERAMIC CIRCUIT BOARD USING SAME
- Publication number 20250098065
- Publication date Mar 20, 2025
- Kabushiki Kaisha Toshiba
- Sachiko FUJISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING FIBER WEAVE EFFECT IN A PRINTED CIRCUIT BOARD
- Publication number 20250098074
- Publication date Mar 20, 2025
- Dell Products L.P.
- Bhyrav M. Mutnury
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION
- Publication number 20250084205
- Publication date Mar 13, 2025
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki IGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...
- Publication number 20250089154
- Publication date Mar 13, 2025
- Skyworks Solutions, Inc.
- Shaul BRANCHEVSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20250089160
- Publication date Mar 13, 2025
- Murata Manufacturing Co., Ltd.
- Tomoki YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW STRESS THROUGH GLASS VIAS (TGVS)
- Publication number 20250089156
- Publication date Mar 13, 2025
- Intel Corporation
- Mohamed R. SABER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN LAMINATED GLASS ASSEMBLY WITH ELECTRIC CIRCUITRY
- Publication number 20250089161
- Publication date Mar 13, 2025
- Fuyao Glass America Inc.
- Yue Shao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250089165
- Publication date Mar 13, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seong Hun NA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250081340
- Publication date Mar 6, 2025
- Samsung Electro-Mechanics Co., Ltd.
- In Gun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREOF
- Publication number 20250071893
- Publication date Feb 27, 2025
- AMOSENSE CO., LTD.
- Jihyung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD SUBSTRATE, PRINTED WIRING BOARD, AND MULTILAYE...
- Publication number 20250071894
- Publication date Feb 27, 2025
- Sumitomo Electric Industries, Ltd.
- Hiroshi UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT TAPE AND FLEXIBLE CIRCUIT BOARD THEREOF
- Publication number 20250071895
- Publication date Feb 27, 2025
- Chipbond Technology Corporation
- Chih-Hsiung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Use of materials for the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device including waterproof structure

Power module

Multilayer resin substrate and method for producing same

Multilayer substrate module with filter function

Fiber sheet, and layered body, circuit board and electronic board u...

Curable composition for inkjet, cured product and flexible printed...

Trim element comprising a functional layer made of carbon material

Machine-knittable conductive hybrid yarns

Systems, devices, and methods for robotic end effectors

Flexible printed wiring board and battery wiring module

Electronic component and manufacturing method thereof

Fluororesin composition, fluororesin sheet, laminate and substrate...

Curable compositions

Electrical devices with electrodes on softening polymers and method...

Extension structure of flexible substrates with conductive wires th...

Metal-resin composite, surface treatment method, and substrate of c...

Prepreg, laminate, and production methods therefor, as well as prin...

Substrate structure and cutting method thereof

Bonded substrate and bonded substrate manufacturing method

Dielectric substrate and method of forming the same

Resin sheet

Wiring board and electronic device

Stretchable device and display panel and sensor and electronic device

Systems, devices, and methods for robotic end effectors

Methods and systems for fabricating 3D multielectrode arrays with 3...

Information handling system and peripheral printed circuit board ha...

High-frequency electronic component and module

Connection structure and method of forming the same

Composite printed wiring board and method of manufacturing composit...

Copper-clad laminated plate, resin-clad copper foil, and circuit su...

Patents Applicationslast 30 patents

WIRING BOARD

THERMOSETTING COMPOSITIONS, CURED COMPOSITIONS, AND PREPREGS AND LA...

CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, MET...

FOLDABLE COVER AND DISPLAY FOR AN ELECTRONIC DEVICE

MODULAR FLEXIBLE SMART MULTI ELECTRODE AIR IONIZER

GLASS COMPOSITION, GLASS FIBER INCLUDING THE SAME, AND ELECTRONIC P...

FOLDABLE PHOTOVOLTAIC SOLAR PANEL ASSEMBLY FOR GENERATING AND SUPPL...

SYSTEMS, METHODS, AND DEVICES FOR CONFIGURING ONE OR MORE MATERIAL...

COMPOSITE MATERIAL, APPLICATIONS THEREOF, AND METHOD FOR PRODUCING...

GLASS CLOTH, PREPREG, AND PRINTED WIRING BOARD

INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE HAVING THERMAL IS...

THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDU...

RESIN COMPOSITION AND PRINTED CIRCUIT BOARD COMPRISING SAME

POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES

NANOTWIN LINER FOR THROUGH GLASS VIAS

POLY(ESTER-IMIDE) POLYMERS AND USES THEREOF

STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION

ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES

BONDED BODY AND CERAMIC CIRCUIT BOARD USING SAME

MITIGATING FIBER WEAVE EFFECT IN A PRINTED CIRCUIT BOARD

RESIN COMPOSITION

DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...

MULTILAYER SUBSTRATE

LOW STRESS THROUGH GLASS VIAS (TGVS)

ULTRA-THIN LAMINATED GLASS ASSEMBLY WITH ELECTRIC CIRCUITRY

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREOF

PRINTED WIRING BOARD SUBSTRATE, PRINTED WIRING BOARD, AND MULTILAYE...

FLEXIBLE CIRCUIT TAPE AND FLEXIBLE CIRCUIT BOARD THEREOF