Use of materials for the substrate

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H05K1/03

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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H05K1/03Use of materials for the substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Patterned conductive article
- Patent number 12,363,825
- Issue date Jul 15, 2025
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porous liquid crystal polymer sheet, metal layer-attached porous li...
- Patent number 12,359,127
- Issue date Jul 15, 2025
- Murata Manufacturing Co., Ltd.
- Yuki Rokusha
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Copper-clad laminate, printed wiring board, semiconductor package a...
- Patent number 12,363,826
- Issue date Jul 15, 2025
- Resonac Corporation
- Yoshikatsu Shiraokawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Biaxially stretched film, film with cured resin layer, and metal la...
- Patent number 12,359,059
- Issue date Jul 15, 2025
- Mitsubishi Chemical Corporation
- Taiki Tsuruoka
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Composites for high-frequency printed circuit boards and methods of...
- Patent number 12,356,544
- Issue date Jul 8, 2025
- Corning Incorporated
- Dayue Jiang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Component-incorporated substrate and method for manufacturing same
- Patent number 12,356,556
- Issue date Jul 8, 2025
- Fujikura Ltd.
- Masahiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing same
- Patent number 12,356,542
- Issue date Jul 8, 2025
- MATERIAL CONCEPT, INC.
- Junichi Koike
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polyimide resin precursor, polyimide resin, metal-clad laminated bo...
- Patent number 12,351,684
- Issue date Jul 8, 2025
- Arisawa MFG. Co., Ltd.
- Yoshinori Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated assembly comprising radio-frequency interface board
- Patent number 12,356,539
- Issue date Jul 8, 2025
- AGC GLASS EUROPE
- Mohsen Yousefbeiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recyclable electronic device
- Patent number 12,349,286
- Issue date Jul 1, 2025
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Stephan Harkema
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body including titanium alloy at bonding boundary
- Patent number 12,347,744
- Issue date Jul 1, 2025
- Kabushiki Kaisha Toshiba
- Seiichi Suenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, film with resin, metal foil with resin, metal-cl...
- Patent number 12,344,738
- Issue date Jul 1, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kosuke Okuno
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Low cost, low loss material for microwave or antenna printed circui...
- Patent number 12,347,927
- Issue date Jul 1, 2025
- Hughes Network Systems, L.L.C.
- Bingqian Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitors in through glass vias
- Patent number 12,349,282
- Issue date Jul 1, 2025
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive band for biosensing garments
- Patent number 12,342,877
- Issue date Jul 1, 2025
- HONEYWELL SAFETY PRODUCTS USA, INC.
- Aldjia Begriche
- D02 - YARNS MECHANICAL FINISHING OF YARNS OR ROPES WARPING OR BEAMING
Information Patent Grant
Wiring board
- Patent number 12,349,269
- Issue date Jul 1, 2025
- Toray Industries, Inc.
- Ryutaro Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,349,273
- Issue date Jul 1, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanism for assembling force sensor patch into earphone device
- Patent number 12,339,178
- Issue date Jun 24, 2025
- PixArt Imaging Inc.
- Chih-Ming Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, lens driving device, and camera module including the...
- Patent number 12,336,092
- Issue date Jun 17, 2025
- LG Innotek Co., Ltd
- Na Kyung Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-containing fabrics and membranes, and method of manufacturing...
- Patent number 12,336,097
- Issue date Jun 17, 2025
- Imperial College Innovations Limited
- Anthony Edward George Cass
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liquid metal fusion with conductive inks and pastes
- Patent number 12,336,115
- Issue date Jun 17, 2025
- Universidade de Coimbra
- Mahmoud Tavakoli
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dielectric, copper clad laminate, circuit board, method for manufac...
- Patent number 12,336,096
- Issue date Jun 17, 2025
- Nippon Pillar Packing Co., Ltd.
- Manami Noda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer ceramic capacitor and board having the same
- Patent number 12,334,262
- Issue date Jun 17, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Moon Soo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for selective metallisation of inorganic dielectrics or semi...
- Patent number 12,336,114
- Issue date Jun 17, 2025
- Valstybinis Moksliniu Tyrimu Institutas Fiziniu Ir Technologijos Mokslu Centras
- Karolis Ratautas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Resin composition, cured product, prepreg, metal foil-clad laminate...
- Patent number 12,325,770
- Issue date Jun 10, 2025
- Mitsubishi Gas Chemical Company, Inc.
- Yuji Nakashima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Integrated circuit packages having electrical and optical connectiv...
- Patent number 12,326,604
- Issue date Jun 10, 2025
- Corning Incorporated
- Lars Martin Otfried Brusberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 12,328,814
- Issue date Jun 10, 2025
- TANAZAWA HAKKOSHA CO., LTD.
- Keiichiro Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact thin film surface mountable coupler having wide-band perfor...
- Patent number 12,327,903
- Issue date Jun 10, 2025
- KYOCERA AVX Components Corporation
- Michael Marek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting resin composition, cured product, and printed wiring...
- Patent number 12,319,865
- Issue date Jun 3, 2025
- TAIYO HOLDINGS CO., LTD.
- Yoshikazu Daigo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Copper clad laminate film and electronic device including same
- Patent number 12,324,094
- Issue date Jun 3, 2025
- Toray Advanced Materials Korea Inc.
- Jong Hun Cheon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION, PREPREG OBTAINED USING SAME, RESIN-COATED FILM,...
- Publication number 20250230279
- Publication date Jul 17, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Hiroaki UMEHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG, LAMINATE, AND PRODUCTION METHODS THEREFOR, AS WELL AS PRIN...
- Publication number 20250234456
- Publication date Jul 17, 2025
- Resonac Corporation
- Mari SHIMIZU
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METALLIZED RESIN FILM, PRINTED WIRING BOARD, CURRENT COLLECTOR FILM...
- Publication number 20250230550
- Publication date Jul 17, 2025
- Kaneka Corporation
- Takashi Itoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIELECTRIC AND METHOD FOR PRODUCING SAME
- Publication number 20250230289
- Publication date Jul 17, 2025
- DAIKIN INDUSTRIES, LTD.
- Yuki UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITION, FLUORORESIN SHEET, AND METHOD FOR PRODUCING SAME
- Publication number 20250230298
- Publication date Jul 17, 2025
- DAIKIN INDUSTRIES, LTD.
- Yuki UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-CLAD LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, A...
- Publication number 20250234458
- Publication date Jul 17, 2025
- Resonac Corporation
- Takayo KITAJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS CLOTH, PREPREG, AND PRINTED WIRING BOARD
- Publication number 20250234457
- Publication date Jul 17, 2025
- Asahi Kasei Kabushiki Kaisha
- Amane HIROSE
- D03 - WEAVING
Information Patent Application
GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...
- Publication number 20250227841
- Publication date Jul 10, 2025
- TOPPAN Holdings Inc.
- Masashi SAWADAISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...
- Publication number 20250227842
- Publication date Jul 10, 2025
- TOPPAN Holdings Inc.
- Masashi SAWADAISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, PREPREG, FILM WITH RESIN, SHEET OF METAL FOIL WI...
- Publication number 20250223423
- Publication date Jul 10, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Akito HASHIMOTO
- B32 - LAYERED PRODUCTS
Information Patent Application
FABRIC TOUCH DEVICE
- Publication number 20250224845
- Publication date Jul 10, 2025
- WUYI UNIVERSITY
- Fei WANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Wearable Device for Sports Headwear
- Publication number 20250227839
- Publication date Jul 10, 2025
- HEAD IMPACT TRAUMA LIMITED
- David Euan Murray BOWEN
- A42 - HEADWEAR
Information Patent Application
PHOTOSENSITIVE MULTILAYER RESIN FILM, PRINTED WIRING BOARD, SEMICON...
- Publication number 20250227853
- Publication date Jul 10, 2025
- Resonac Corporation
- Ryo YUKIOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COVERLAY FILM, PRINTED WIRING BOARD, METHOD FOR MANUFACTURING COVER...
- Publication number 20250220822
- Publication date Jul 3, 2025
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Takuma HITOTSUMATSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND PREPARATION METHOND THEREFOR
- Publication number 20250220825
- Publication date Jul 3, 2025
- TRIPLE WIN TECHNOLOGY (SHENZHEN) CO.LTD.
- YUN-YEN LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250220813
- Publication date Jul 3, 2025
- KYOCERA CORPORATION
- Hiroaki SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYIMIDE PRECURSOR COMPOSITION FOR FLEXIBLE WIRING BOARDS, POLYIMI...
- Publication number 20250215153
- Publication date Jul 3, 2025
- UBE Corporation
- Kosuke YAMAJI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE TYPE SENSOR, WAFER TYPE SENSOR AND SUBSTRATE PROCESSING M...
- Publication number 20250218883
- Publication date Jul 3, 2025
- SEMES CO., LTD.
- Yong Jun SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYNDIOTACTIC POLYSTYRENE LOW-DIELECTRIC SHEET MOULDING
- Publication number 20250220811
- Publication date Jul 3, 2025
- Toyobo Co., Ltd.
- Yuki MAEDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ELECTRONIC TEXTILES AND SYSTEMS AND PROCESSES ASSOCIATED THEREWITH
- Publication number 20250215639
- Publication date Jul 3, 2025
- Purdue Research Foundation
- Chi Hwan Lee
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Application
THERMAL-ENHANCED POWER MODULE WITH SEPARATE HEAT SPREADERS
- Publication number 20250210449
- Publication date Jun 26, 2025
- Monolithic Power Systems, Inc.
- Xin Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMART YARN AND METHOD FOR MANUFACTURING A YARN CONTAINING AN ELECTR...
- Publication number 20250207302
- Publication date Jun 26, 2025
- Siren Care, Inc.
- Jie Fu
- A41 - WEARING APPAREL
Information Patent Application
SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20250212321
- Publication date Jun 26, 2025
- Dyi-Chung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250212324
- Publication date Jun 26, 2025
- TOPPAN Holdings Inc.
- Tomoyuki Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATE, METAL FOIL-CLAD...
- Publication number 20250206919
- Publication date Jun 26, 2025
- Mitsubishi Gas Chemical Company, Inc.
- Tatsuro TAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laminate for a Printed Circuit Board
- Publication number 20250212325
- Publication date Jun 26, 2025
- Ticona LLC
- Xiaowei Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRIAZOLE COMPOUND, METHOD FOR SYNTHESIZING SAID TRIAZOLE COMPOUND,...
- Publication number 20250206764
- Publication date Jun 26, 2025
- SHIKOKU CHEMICALS CORPORATION
- Koji TAKASAKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION...
- Publication number 20250197634
- Publication date Jun 19, 2025
- TORAY INDUSTRIES, INC.
- Yuki Katsurada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CERAMIC WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20250203768
- Publication date Jun 19, 2025
- KYOCERA CORPORATION
- Makoto YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250203785
- Publication date Jun 19, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHUNG-HO WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Use of materials for the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Patterned conductive article

Porous liquid crystal polymer sheet, metal layer-attached porous li...

Copper-clad laminate, printed wiring board, semiconductor package a...

Biaxially stretched film, film with cured resin layer, and metal la...

Composites for high-frequency printed circuit boards and methods of...

Component-incorporated substrate and method for manufacturing same

Wiring board and method for manufacturing same

Polyimide resin precursor, polyimide resin, metal-clad laminated bo...

Laminated assembly comprising radio-frequency interface board

Recyclable electronic device

Bonded body including titanium alloy at bonding boundary

Resin composition, film with resin, metal foil with resin, metal-cl...

Low cost, low loss material for microwave or antenna printed circui...

Capacitors in through glass vias

Conductive band for biosensing garments

Wiring board

Printed circuit board

Mechanism for assembling force sensor patch into earphone device

Circuit board, lens driving device, and camera module including the...

Metal-containing fabrics and membranes, and method of manufacturing...

Liquid metal fusion with conductive inks and pastes

Dielectric, copper clad laminate, circuit board, method for manufac...

Multilayer ceramic capacitor and board having the same

Method for selective metallisation of inorganic dielectrics or semi...

Resin composition, cured product, prepreg, metal foil-clad laminate...

Integrated circuit packages having electrical and optical connectiv...

Printed wiring board and method for manufacturing printed wiring board

Compact thin film surface mountable coupler having wide-band perfor...

Thermosetting resin composition, cured product, and printed wiring...

Copper clad laminate film and electronic device including same

Patents Applicationslast 30 patents

RESIN COMPOSITION, PREPREG OBTAINED USING SAME, RESIN-COATED FILM,...

PREPREG, LAMINATE, AND PRODUCTION METHODS THEREFOR, AS WELL AS PRIN...

METALLIZED RESIN FILM, PRINTED WIRING BOARD, CURRENT COLLECTOR FILM...

DIELECTRIC AND METHOD FOR PRODUCING SAME

COMPOSITION, FLUORORESIN SHEET, AND METHOD FOR PRODUCING SAME

METAL-CLAD LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, A...

GLASS CLOTH, PREPREG, AND PRINTED WIRING BOARD

GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...

GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...

RESIN COMPOSITION, PREPREG, FILM WITH RESIN, SHEET OF METAL FOIL WI...

FABRIC TOUCH DEVICE

Wearable Device for Sports Headwear

PHOTOSENSITIVE MULTILAYER RESIN FILM, PRINTED WIRING BOARD, SEMICON...

COVERLAY FILM, PRINTED WIRING BOARD, METHOD FOR MANUFACTURING COVER...

RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND PREPARATION METHOND THEREFOR

WIRING BOARD

POLYIMIDE PRECURSOR COMPOSITION FOR FLEXIBLE WIRING BOARDS, POLYIMI...

SUBSTRATE TYPE SENSOR, WAFER TYPE SENSOR AND SUBSTRATE PROCESSING M...

SYNDIOTACTIC POLYSTYRENE LOW-DIELECTRIC SHEET MOULDING

ELECTRONIC TEXTILES AND SYSTEMS AND PROCESSES ASSOCIATED THEREWITH

THERMAL-ENHANCED POWER MODULE WITH SEPARATE HEAT SPREADERS

SMART YARN AND METHOD FOR MANUFACTURING A YARN CONTAINING AN ELECTR...

SUBSTRATE AND MANUFACTURING METHOD THEREOF

WIRING BOARD

RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATE, METAL FOIL-CLAD...

Laminate for a Printed Circuit Board

TRIAZOLE COMPOUND, METHOD FOR SYNTHESIZING SAID TRIAZOLE COMPOUND,...

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION...

CERAMIC WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF