Use of materials for the substrate

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CPC
H05K1/03

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/03Use of materials for the substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonded substrate and bonded substrate manufacturing method
- Patent number 12,249,547
- Issue date Mar 11, 2025
- NGK Insulators, Ltd.
- Takashi Ebigase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure and cutting method thereof
- Patent number 12,250,776
- Issue date Mar 11, 2025
- Unimicron Technology Corp.
- Jeng-Ting Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric substrate and method of forming the same
- Patent number 12,250,767
- Issue date Mar 11, 2025
- VERSIV COMPOSITES LIMITED
- Jennifer Adamchuk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin sheet
- Patent number 12,247,124
- Issue date Mar 11, 2025
- Lintec Corporation
- Yasutaka Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and electronic device
- Patent number 12,245,364
- Issue date Mar 4, 2025
- Shinko Electric Industries Co., Ltd.
- Tatsuaki Denda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable device and display panel and sensor and electronic device
- Patent number 12,245,368
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Yeongjun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems, devices, and methods for robotic end effectors
- Patent number 12,240,102
- Issue date Mar 4, 2025
- Sanctuary Cognitive Systems Corporation
- Connor Richard Shannon
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Methods and systems for fabricating 3D multielectrode arrays with 3...
- Patent number 12,245,369
- Issue date Mar 4, 2025
- University of Oregon
- Timothy Gardner
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Information handling system and peripheral printed circuit board ha...
- Patent number 12,245,372
- Issue date Mar 4, 2025
- Dell Products L.P.
- Peng Lip Goh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High-frequency electronic component and module
- Patent number 12,245,365
- Issue date Mar 4, 2025
- Murata Manufacturing Co., Ltd.
- Hirofumi Oie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and method of forming the same
- Patent number 12,243,813
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite printed wiring board and method of manufacturing composit...
- Patent number 12,238,861
- Issue date Feb 25, 2025
- Mitsubishi Electric Corporation
- Tatsuya Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-clad laminated plate, resin-clad copper foil, and circuit su...
- Patent number 12,233,621
- Issue date Feb 25, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Kitai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flexible pressure sensors and user interfaces
- Patent number 12,232,548
- Issue date Feb 25, 2025
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- A41 - WEARING APPAREL
Information Patent Grant
Circuit board with bridge chiplets
- Patent number 12,238,872
- Issue date Feb 25, 2025
- Advanced Micro Devices, Inc.
- Robert N. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,238,852
- Issue date Feb 25, 2025
- Avary Holding (Shenzhen) Co., Limited.
- Ying Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cured product and production method of same, and resin sheet and re...
- Patent number 12,227,631
- Issue date Feb 18, 2025
- Ajinomoto Co., Inc.
- Hiroyuki Sakauchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Component carriers connected by staggered interconnect elements
- Patent number 12,232,263
- Issue date Feb 18, 2025
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,232,255
- Issue date Feb 18, 2025
- LG Innotek Co., Ltd
- Yong Suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabric with embedded electrical components
- Patent number 12,232,270
- Issue date Feb 18, 2025
- Apple Inc.
- Daniel D. Sunshine
- D03 - WEAVING
Information Patent Grant
Flexible hybrid electronic substrate and electronic textile includi...
- Patent number 12,232,256
- Issue date Feb 18, 2025
- Industrial Technology Research Institute
- I-Hung Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Benzoxazine resin, composition thereof and copper clad laminate mad...
- Patent number 12,227,637
- Issue date Feb 18, 2025
- A.C.R. TECH CO., LTD.
- Shih-Hao Liao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition, resin sheet, multilayer printed wiring board, an...
- Patent number 12,221,523
- Issue date Feb 11, 2025
- Mitsubishi Gas Chemical Company, Inc.
- Yune Kumazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulating film, metal-clad laminate member, and rewiring layer
- Patent number 12,221,536
- Issue date Feb 11, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Cheng Ping Lin
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic component and method for producing electronic component
- Patent number 12,224,097
- Issue date Feb 11, 2025
- Murata Manufacturing Co., Ltd.
- Kouhei Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Motor vehicle lighting module comprising a ceramic substrate
- Patent number 12,225,662
- Issue date Feb 11, 2025
- Valeo Vision
- Alexandre Val
- F21 - LIGHTING
Information Patent Grant
Printed circuit board dielectric molding, machining and electrolyti...
- Patent number 12,219,698
- Issue date Feb 4, 2025
- INFINITUM ELECTRIC INC.
- Edward C. Carignan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Removable and low insertion force connector system
- Patent number 12,219,706
- Issue date Feb 4, 2025
- Intel Corporation
- Jonathan W. Thibado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluorine resin surface modification method, surface-modified fluori...
- Patent number 12,215,210
- Issue date Feb 4, 2025
- Ushio Denki Kabushiki Kaisha
- Akihiro Shimamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier
- Patent number 12,219,701
- Issue date Feb 4, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250081340
- Publication date Mar 6, 2025
- Samsung Electro-Mechanics Co., Ltd.
- In Gun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREOF
- Publication number 20250071893
- Publication date Feb 27, 2025
- AMOSENSE CO., LTD.
- Jihyung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD SUBSTRATE, PRINTED WIRING BOARD, AND MULTILAYE...
- Publication number 20250071894
- Publication date Feb 27, 2025
- Sumitomo Electric Industries, Ltd.
- Hiroshi UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION
- Publication number 20250066609
- Publication date Feb 27, 2025
- Nan Ya Plastics Corporation
- Te-Chao Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT TAPE AND FLEXIBLE CIRCUIT BOARD THEREOF
- Publication number 20250071895
- Publication date Feb 27, 2025
- Chipbond Technology Corporation
- Chih-Hsiung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250071902
- Publication date Feb 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seung Eun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE RESIN COMPOSITION
- Publication number 20250066651
- Publication date Feb 27, 2025
- TOYOBO MC Corporation
- Hiroyuki MIEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE, FABRIC SENSOR, WEARABLE ELECTRONIC DEVICE INCLUDING TH...
- Publication number 20250063654
- Publication date Feb 20, 2025
- Yale University
- LINA SANCHEZ-BOTERO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Conformal Wearable Battery
- Publication number 20250063669
- Publication date Feb 20, 2025
- Inventus Power, Inc.
- Timothy James Vallaro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250063653
- Publication date Feb 20, 2025
- InnoLux Corporation
- Roger HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20250063671
- Publication date Feb 20, 2025
- LX Semicon Co., Ltd.
- Nam Tae CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLAME-RETARDANT COMPOSITION
- Publication number 20250051645
- Publication date Feb 13, 2025
- Chang Chun Plastics Co., Ltd.
- An-Pang TU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250056721
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Cheng-Jia LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20250056713
- Publication date Feb 13, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Ho-Jae LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER CLAD LAMINATE AND USES OF THE SAME
- Publication number 20250056720
- Publication date Feb 13, 2025
- TAIWAN UNION TECHNOLOGY CORPORATION
- Jui-Hsiang TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEX...
- Publication number 20250056728
- Publication date Feb 13, 2025
- NIPPON MEKTRON, LTD.
- Akihiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE, METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, WIRI...
- Publication number 20250056719
- Publication date Feb 13, 2025
- KYOCERA CORPORATION
- Koutarou NAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250056718
- Publication date Feb 13, 2025
- IBIDEN CO., LTD.
- Atsushi ISHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURABLE POLYMER, CURABLE COMPOSITION, PREPREG, MULTILAYER BODY, MET...
- Publication number 20250043043
- Publication date Feb 6, 2025
- AGC Inc.
- Kazumi HASHIMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MODIFIED POLYPHENYLENE ETHER RESIN, PREPARATION METHOD THEREOF, AND...
- Publication number 20250043075
- Publication date Feb 6, 2025
- NAN YA PLASTICS CORPORATION
- Cheng-Chung Lee
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ELECTRONIC MODULE, ELECTRONIC EQUIPMENT, IMAGING SENSOR MODULE, IMA...
- Publication number 20250047966
- Publication date Feb 6, 2025
- Canon Kabushiki Kaisha
- Yuya Okada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250048542
- Publication date Feb 6, 2025
- Murata Manufacturing Co., Ltd.
- Nobuo IKEMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED BODY, CERAMIC COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING...
- Publication number 20250048563
- Publication date Feb 6, 2025
- Kabushiki Kaisha Toshiba
- Maki YONETSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRATHIN COMPOSITE DIELECTRICS FOR USE IN PRINTED CIRCUIT BOARDS
- Publication number 20250048548
- Publication date Feb 6, 2025
- AVISHTECH, INC.
- Tarun Amla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIBER WEAVE IN A PRINTED CIRCUIT BOARD SUBSTRATE
- Publication number 20250048549
- Publication date Feb 6, 2025
- Dell Products L.P.
- Sanjay Kumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal-ceramic substrate and method for producing a metal ceramic su...
- Publication number 20250048556
- Publication date Feb 6, 2025
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURABLE POLYMER, CURABLE COMPOSITION, PREPREG, MULTILAYER BODY, MET...
- Publication number 20250043050
- Publication date Feb 6, 2025
- AGC Inc.
- Kazumi HASHIMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
WIRING SUBSTRATE
- Publication number 20250048562
- Publication date Feb 6, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20250046694
- Publication date Feb 6, 2025
- Innolux Corporation
- Ying-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID COMPOSITION, PREPREG, METAL SUBSTRATE WITH RESIN, WIRING BOA...
- Publication number 20250043102
- Publication date Feb 6, 2025
- AGC Inc.
- Hiromichi KAMO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Use of materials for the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonded substrate and bonded substrate manufacturing method

Substrate structure and cutting method thereof

Dielectric substrate and method of forming the same

Resin sheet

Wiring board and electronic device

Stretchable device and display panel and sensor and electronic device

Systems, devices, and methods for robotic end effectors

Methods and systems for fabricating 3D multielectrode arrays with 3...

Information handling system and peripheral printed circuit board ha...

High-frequency electronic component and module

Connection structure and method of forming the same

Composite printed wiring board and method of manufacturing composit...

Copper-clad laminated plate, resin-clad copper foil, and circuit su...

Flexible pressure sensors and user interfaces

Circuit board with bridge chiplets

Circuit board and method for manufacturing the same

Cured product and production method of same, and resin sheet and re...

Component carriers connected by staggered interconnect elements

Circuit board

Fabric with embedded electrical components

Flexible hybrid electronic substrate and electronic textile includi...

Benzoxazine resin, composition thereof and copper clad laminate mad...

Resin composition, resin sheet, multilayer printed wiring board, an...

Insulating film, metal-clad laminate member, and rewiring layer

Electronic component and method for producing electronic component

Motor vehicle lighting module comprising a ceramic substrate

Printed circuit board dielectric molding, machining and electrolyti...

Removable and low insertion force connector system

Fluorine resin surface modification method, surface-modified fluori...

Component carrier

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD

CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREOF

PRINTED WIRING BOARD SUBSTRATE, PRINTED WIRING BOARD, AND MULTILAYE...

RESIN COMPOSITION

FLEXIBLE CIRCUIT TAPE AND FLEXIBLE CIRCUIT BOARD THEREOF

PRINTED CIRCUIT BOARD

ADHESIVE RESIN COMPOSITION

STRETCHABLE, FABRIC SENSOR, WEARABLE ELECTRONIC DEVICE INCLUDING TH...

Conformal Wearable Battery

ELECTRONIC DEVICE

METHOD FOR MANUFACTURING CIRCUIT BOARD

FLAME-RETARDANT COMPOSITION

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD

COPPER CLAD LAMINATE AND USES OF THE SAME

FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEX...

CERAMIC SUBSTRATE, METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, WIRI...

PRINTED WIRING BOARD

CURABLE POLYMER, CURABLE COMPOSITION, PREPREG, MULTILAYER BODY, MET...

MODIFIED POLYPHENYLENE ETHER RESIN, PREPARATION METHOD THEREOF, AND...

ELECTRONIC MODULE, ELECTRONIC EQUIPMENT, IMAGING SENSOR MODULE, IMA...

CIRCUIT MODULE AND MANUFACTURING METHOD THEREFOR

BONDED BODY, CERAMIC COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING...

ULTRATHIN COMPOSITE DIELECTRICS FOR USE IN PRINTED CIRCUIT BOARDS

FIBER WEAVE IN A PRINTED CIRCUIT BOARD SUBSTRATE

Metal-ceramic substrate and method for producing a metal ceramic su...

CURABLE POLYMER, CURABLE COMPOSITION, PREPREG, MULTILAYER BODY, MET...

WIRING SUBSTRATE

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

LIQUID COMPOSITION, PREPREG, METAL SUBSTRATE WITH RESIN, WIRING BOA...