Use of materials for the substrate

Industry

CPC
H05K1/03

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/03Use of materials for the substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Mechanism for assembling force sensor patch into earphone device
- Patent number 12,339,178
- Issue date Jun 24, 2025
- PixArt Imaging Inc.
- Chih-Ming Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, lens driving device, and camera module including the...
- Patent number 12,336,092
- Issue date Jun 17, 2025
- LG Innotek Co., Ltd
- Na Kyung Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-containing fabrics and membranes, and method of manufacturing...
- Patent number 12,336,097
- Issue date Jun 17, 2025
- Imperial College Innovations Limited
- Anthony Edward George Cass
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liquid metal fusion with conductive inks and pastes
- Patent number 12,336,115
- Issue date Jun 17, 2025
- Universidade de Coimbra
- Mahmoud Tavakoli
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dielectric, copper clad laminate, circuit board, method for manufac...
- Patent number 12,336,096
- Issue date Jun 17, 2025
- Nippon Pillar Packing Co., Ltd.
- Manami Noda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer ceramic capacitor and board having the same
- Patent number 12,334,262
- Issue date Jun 17, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Moon Soo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for selective metallisation of inorganic dielectrics or semi...
- Patent number 12,336,114
- Issue date Jun 17, 2025
- Valstybinis Moksliniu Tyrimu Institutas Fiziniu Ir Technologijos Mokslu Centras
- Karolis Ratautas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Resin composition, cured product, prepreg, metal foil-clad laminate...
- Patent number 12,325,770
- Issue date Jun 10, 2025
- Mitsubishi Gas Chemical Company, Inc.
- Yuji Nakashima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Integrated circuit packages having electrical and optical connectiv...
- Patent number 12,326,604
- Issue date Jun 10, 2025
- Corning Incorporated
- Lars Martin Otfried Brusberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 12,328,814
- Issue date Jun 10, 2025
- TANAZAWA HAKKOSHA CO., LTD.
- Keiichiro Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact thin film surface mountable coupler having wide-band perfor...
- Patent number 12,327,903
- Issue date Jun 10, 2025
- KYOCERA AVX Components Corporation
- Michael Marek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting resin composition, cured product, and printed wiring...
- Patent number 12,319,865
- Issue date Jun 3, 2025
- TAIYO HOLDINGS CO., LTD.
- Yoshikazu Daigo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Copper clad laminate film and electronic device including same
- Patent number 12,324,094
- Issue date Jun 3, 2025
- Toray Advanced Materials Korea Inc.
- Jong Hun Cheon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Auxetic stretchable substrate with flexible joint structure and met...
- Patent number 12,324,095
- Issue date Jun 3, 2025
- Korea Institute of Science and Technology
- Seungjun Chung
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Maleimide resin composition, prepreg, resin film, laminated board,...
- Patent number 12,324,105
- Issue date Jun 3, 2025
- Resonac Corporation
- Chihiro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film and flexible printed circuit board
- Patent number 12,312,510
- Issue date May 27, 2025
- MEKTEC CORPORATION
- Hisae Oba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Preparation method for copper clad laminate having low dielectric c...
- Patent number 12,311,646
- Issue date May 27, 2025
- JIANGMEN DEZHONGTAI ENGINEERING PLASTICS TECHNOLOGY CO., LTD.
- Yonghua Liang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Glass core wiring substrate incorporating high-frequency filter, hi...
- Patent number 12,317,411
- Issue date May 27, 2025
- TOPPAN INC.
- Susumu Maniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulating layer for multilayer printed circuit board, multilayer p...
- Patent number 12,313,973
- Issue date May 27, 2025
- LG Chem, Ltd.
- Jeong Wook Mun
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Laminate, single-sided metal-clad laminated sheet, and multi-layer...
- Patent number 12,309,919
- Issue date May 20, 2025
- Kaneka Corporation
- Kanji Shimoosako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 12,309,920
- Issue date May 20, 2025
- Ibiden Co., Ltd.
- Shogo Fukui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display panel and display device including the same
- Patent number 12,309,925
- Issue date May 20, 2025
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure for display device
- Patent number 12,302,507
- Issue date May 13, 2025
- AUO CORPORATION
- Chi-Sheng Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temporary carrier and method for manufacturing coreless substrate t...
- Patent number 12,302,508
- Issue date May 13, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact ceramic package with rear cavities
- Patent number 12,295,097
- Issue date May 6, 2025
- Waymo LLC
- Shashank Sharma
- G01 - MEASURING TESTING
Information Patent Grant
Multilayer board and manufacturing method thereof
- Patent number 12,295,098
- Issue date May 6, 2025
- AZOTEK CO., LTD.
- Hung-Jung Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Component carrier with partially metallized hole using anti-plating...
- Patent number 12,295,108
- Issue date May 6, 2025
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Jiangfeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stray inductance busbar structure for power module
- Patent number 12,294,312
- Issue date May 6, 2025
- ZHENGHAI GROUP CO., LTD.
- Xianye Mao
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Multilayer resin substrate and electronic component
- Patent number 12,289,826
- Issue date Apr 29, 2025
- Murata Manufacturing Co., Ltd.
- Takako Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed board and electronic device
- Patent number 12,289,827
- Issue date Apr 29, 2025
- Kioxia Corporation
- Yuta Tsubouchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THERMAL-ENHANCED POWER MODULE WITH SEPARATE HEAT SPREADERS
- Publication number 20250210449
- Publication date Jun 26, 2025
- Monolithic Power Systems, Inc.
- Xin Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMART YARN AND METHOD FOR MANUFACTURING A YARN CONTAINING AN ELECTR...
- Publication number 20250207302
- Publication date Jun 26, 2025
- Siren Care, Inc.
- Jie Fu
- A41 - WEARING APPAREL
Information Patent Application
SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20250212321
- Publication date Jun 26, 2025
- Dyi-Chung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250212324
- Publication date Jun 26, 2025
- TOPPAN Holdings Inc.
- Tomoyuki Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATE, METAL FOIL-CLAD...
- Publication number 20250206919
- Publication date Jun 26, 2025
- Mitsubishi Gas Chemical Company, Inc.
- Tatsuro TAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laminate for a Printed Circuit Board
- Publication number 20250212325
- Publication date Jun 26, 2025
- Ticona LLC
- Xiaowei Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRIAZOLE COMPOUND, METHOD FOR SYNTHESIZING SAID TRIAZOLE COMPOUND,...
- Publication number 20250206764
- Publication date Jun 26, 2025
- SHIKOKU CHEMICALS CORPORATION
- Koji TAKASAKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20250203768
- Publication date Jun 19, 2025
- KYOCERA CORPORATION
- Makoto YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION...
- Publication number 20250197634
- Publication date Jun 19, 2025
- TORAY INDUSTRIES, INC.
- Yuki Katsurada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250203785
- Publication date Jun 19, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHUNG-HO WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME
- Publication number 20250203751
- Publication date Jun 19, 2025
- AMOGREENTECH CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20250203770
- Publication date Jun 19, 2025
- Chipbond Technology Corporation
- Ting-Yi Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT PACKAGE FOR USE WITH PRINTED CIRCUIT BOARDS
- Publication number 20250203772
- Publication date Jun 19, 2025
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Louis Diamond
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VOLTAGE-ISOLATED IC PACKAGES WITH EXTENSIONS FOR CORE PLACEMENT
- Publication number 20250201466
- Publication date Jun 19, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Vijay Mangtani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND ME...
- Publication number 20250203752
- Publication date Jun 19, 2025
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING A PRINTED CIRCUIT BO...
- Publication number 20250203771
- Publication date Jun 19, 2025
- ROBERT BOSCH GmbH
- Charles-Edouard De Gryse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20250203769
- Publication date Jun 19, 2025
- Nichia Corporation.
- Atsushi HOSOKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION
- Publication number 20250203773
- Publication date Jun 19, 2025
- Micron Technology, Inc.
- Kelvin Aik Boo TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME
- Publication number 20250191841
- Publication date Jun 12, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Moon Soo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, PREPREG, LAMINATED BOARD, RESIN FILM, PRINTED WI...
- Publication number 20250188263
- Publication date Jun 12, 2025
- Resonac Corporation
- Naoyoshi SATO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250194001
- Publication date Jun 12, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Moon JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250194004
- Publication date Jun 12, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Mi Sun Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE ELASTIC MATERIAL, METHOD FOR PREPARING THE S...
- Publication number 20250194005
- Publication date Jun 12, 2025
- MIDAS H&T INC.
- Un Yong JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE...
- Publication number 20250188256
- Publication date Jun 12, 2025
- Mitsubishi Gas Chemical Company, Inc.
- Syouichi ITOH
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION AND ARTICLE MADE THEREFROM
- Publication number 20250188262
- Publication date Jun 12, 2025
- Elite Electronic Material (kunShan) Co., Ltd.
- Jun DU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
WIRING BOARD
- Publication number 20250185162
- Publication date Jun 5, 2025
- KYOCERA CORPORATION
- Hiroaki SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION TH...
- Publication number 20250185156
- Publication date Jun 5, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC-TO-INORGANIC BONDING METHODS AND STRUCTURES
- Publication number 20250185163
- Publication date Jun 5, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Oliver Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS CLOTH TREATMENT LIQUID AND SURFACE TREATED GLASS CLOTH
- Publication number 20250178955
- Publication date Jun 5, 2025
- Shin-Etsu Chemical Co., Ltd.
- Shigeki YASUDA
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
Metal-ceramic substrate and method of manufacturing a metal-ceramic...
- Publication number 20250185166
- Publication date Jun 5, 2025
- Rogers Germany GmbH
- Tilo Welker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Use of materials for the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Mechanism for assembling force sensor patch into earphone device

Circuit board, lens driving device, and camera module including the...

Metal-containing fabrics and membranes, and method of manufacturing...

Liquid metal fusion with conductive inks and pastes

Dielectric, copper clad laminate, circuit board, method for manufac...

Multilayer ceramic capacitor and board having the same

Method for selective metallisation of inorganic dielectrics or semi...

Resin composition, cured product, prepreg, metal foil-clad laminate...

Integrated circuit packages having electrical and optical connectiv...

Printed wiring board and method for manufacturing printed wiring board

Compact thin film surface mountable coupler having wide-band perfor...

Thermosetting resin composition, cured product, and printed wiring...

Copper clad laminate film and electronic device including same

Auxetic stretchable substrate with flexible joint structure and met...

Maleimide resin composition, prepreg, resin film, laminated board,...

Adhesive film and flexible printed circuit board

Preparation method for copper clad laminate having low dielectric c...

Glass core wiring substrate incorporating high-frequency filter, hi...

Insulating layer for multilayer printed circuit board, multilayer p...

Laminate, single-sided metal-clad laminated sheet, and multi-layer...

Wiring substrate

Display panel and display device including the same

Circuit board structure for display device

Temporary carrier and method for manufacturing coreless substrate t...

Compact ceramic package with rear cavities

Multilayer board and manufacturing method thereof

Component carrier with partially metallized hole using anti-plating...

Low stray inductance busbar structure for power module

Multilayer resin substrate and electronic component

Printed board and electronic device

Patents Applicationslast 30 patents

THERMAL-ENHANCED POWER MODULE WITH SEPARATE HEAT SPREADERS

SMART YARN AND METHOD FOR MANUFACTURING A YARN CONTAINING AN ELECTR...

SUBSTRATE AND MANUFACTURING METHOD THEREOF

WIRING BOARD

RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATE, METAL FOIL-CLAD...

Laminate for a Printed Circuit Board

TRIAZOLE COMPOUND, METHOD FOR SYNTHESIZING SAID TRIAZOLE COMPOUND,...

CERAMIC WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION...

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME

FLEXIBLE CIRCUIT BOARD

TRANSPARENT PACKAGE FOR USE WITH PRINTED CIRCUIT BOARDS

VOLTAGE-ISOLATED IC PACKAGES WITH EXTENSIONS FOR CORE PLACEMENT

PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND ME...

PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING A PRINTED CIRCUIT BO...

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION

MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME

RESIN COMPOSITION, PREPREG, LAMINATED BOARD, RESIN FILM, PRINTED WI...

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

ANISOTROPIC CONDUCTIVE ELASTIC MATERIAL, METHOD FOR PREPARING THE S...

RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE...

RESIN COMPOSITION AND ARTICLE MADE THEREFROM

WIRING BOARD

METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION TH...

ORGANIC-TO-INORGANIC BONDING METHODS AND STRUCTURES

GLASS CLOTH TREATMENT LIQUID AND SURFACE TREATED GLASS CLOTH

Metal-ceramic substrate and method of manufacturing a metal-ceramic...