used as adhesion-promoting additives or as means to improve adhesion

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CPC
G03F7/0751

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GPHYSICS G03Photography G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES G03F7/00Photomechanical

Current Industry

G03F7/0751used as adhesion-promoting additives or as means to improve adhesion

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Low temperature cure photoimageable dielectric compositions and met...
- Patent number 11,988,963
- Issue date May 21, 2024
- Daniel J Nawrocki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photoresist imaging and development for enhanced nozzle plate adhesion
- Patent number 11,926,157
- Issue date Mar 12, 2024
- Funai Electric Co., Ltd.
- Sean T. Weaver
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Thermosetting iodine- and silicon-containing material, composition...
- Patent number 11,914,295
- Issue date Feb 27, 2024
- Shin-Etsu Chemical Co., Ltd.
- Tsutomu Ogihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesion promoter and photosensitive resin composition containing same
- Patent number 11,886,117
- Issue date Jan 30, 2024
- SHANDONG SHENGQUAN NEW MATERIALS CO LTD.
- Diyuan Tang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Di-amine compound, and heat-resistant resin and resin composition u...
- Patent number 11,802,181
- Issue date Oct 31, 2023
- Toray Industries, Inc.
- Yuki Masuda
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Semiconductor resist composition, and method of forming patterns us...
- Patent number 11,789,361
- Issue date Oct 17, 2023
- Samsung SDI Co., Ltd.
- Kyung Soo Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoimageable compositions and processes for fabrication of relief...
- Patent number 11,635,688
- Issue date Apr 25, 2023
- KAYAKU ADVANCED MATERIALS, INC.
- Daniel J. Nawrocki
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Composition, film, near infrared cut filter, laminate, pattern form...
- Patent number 11,518,833
- Issue date Dec 6, 2022
- FUJIFILM Corporation
- Tokihiko Matsumura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesion promoters
- Patent number 11,500,290
- Issue date Nov 15, 2022
- International Business Machines Corporation
- Dario Goldfarb
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Dry film formulation
- Patent number 11,340,529
- Issue date May 24, 2022
- FUNAI ELECTRIC CO. LTD
- Sean T. Weaver
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photosensitive resin composition, photosensitive dry film, and patt...
- Patent number 11,187,982
- Issue date Nov 30, 2021
- Shin-Etsu Chemical Co., Ltd.
- Hitoshi Maruyama
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Resin and photosensitive resin composition
- Patent number 11,174,350
- Issue date Nov 16, 2021
- Toray Industries, Inc.
- Yuki Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-containing resist underlayer film-forming composition havin...
- Patent number 11,175,583
- Issue date Nov 16, 2021
- Nissan Chemical Industries, Ltd.
- Makoto Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor resist composition, and method of forming patterns us...
- Patent number 11,092,890
- Issue date Aug 17, 2021
- Samsung SDI Co., Ltd.
- Kyung Soo Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunable adhesion of EUV photoresist on oxide surface
- Patent number 11,022,887
- Issue date Jun 1, 2021
- International Business Machines Corporation
- Yongan Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to improve adhesion of photoresist on silicon substrate for...
- Patent number 10,964,541
- Issue date Mar 30, 2021
- International Business Machines Corporation
- Martin Glodde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition, film, near infrared cut filter, laminate, pattern form...
- Patent number 10,947,389
- Issue date Mar 16, 2021
- FUJIFILM Corporation
- Tokihiko Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Photosensitive compositions, color filter and microlens derived the...
- Patent number 10,915,019
- Issue date Feb 9, 2021
- PROMERUS, LLC
- Pramod F Kandanarachch
- G02 - OPTICS
Information Patent Grant
Cured film and method for producing same
- Patent number 10,908,500
- Issue date Feb 2, 2021
- Toray Industries, Inc.
- Yu Shoji
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesion layer for multi-layer photoresist
- Patent number 10,859,915
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Liu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Embossing lacquer and method for embossing, and substrate surface c...
- Patent number 10,809,622
- Issue date Oct 20, 2020
- Joanneum Research Forschungsgesellschaft mbH
- Dieter Nees
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Silane coupling agent and method of manufacturing wire grid pattern...
- Patent number 10,732,503
- Issue date Aug 4, 2020
- Samsung Display Co., Ltd.
- Min Hyuck Kang
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Polymide precursor resin composition
- Patent number 10,725,379
- Issue date Jul 28, 2020
- Hitachi Chemical DuPont Microsystems, Ltd.
- Keishi Ono
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Tunable adhesion of EUV photoresist on oxide surface
- Patent number 10,551,742
- Issue date Feb 4, 2020
- International Business Machines Corporation
- Yongan Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to improve adhesion of photoresist on silicon substrate for...
- Patent number 10,553,432
- Issue date Feb 4, 2020
- International Business Machines Corporation
- Martin Glodde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoresist compositions, intermediate products, and methods of man...
- Patent number 10,551,738
- Issue date Feb 4, 2020
- Samsung Electronics Co., Ltd.
- Jin Park
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Fluorine-containing composition, substrate for pattern formation, p...
- Patent number 10,466,591
- Issue date Nov 5, 2019
- Nikon Corporation
- Yusuke Kawakami
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Photosensitive resin composition, film adhesive, adhesive sheet, ad...
- Patent number 10,428,253
- Issue date Oct 1, 2019
- Hitachi Chemical Company, Ltd.
- Tomonori Minegishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Process for improving photoresist pillar adhesion during MRAM fabri...
- Patent number 10,424,726
- Issue date Sep 24, 2019
- Spin Memory, Inc.
- Elizabeth Dobisz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to improve adhesion of photoresist on silicon substrate for...
- Patent number 10,312,087
- Issue date Jun 4, 2019
- International Business Machines Corporation
- Martin Glodde
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURES INCLUDING A SiOCN PHOTORESIST ADHESION LAYER AND METAL-O...
- Publication number 20240361695
- Publication date Oct 31, 2024
- ASM IP HOLDING B.V.
- João Ricardo Antunes Afonso
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOS...
- Publication number 20240288772
- Publication date Aug 29, 2024
- Shin-Etsu Chemical Co., Ltd.
- Hitoshi Maruyama
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Pellicle Frame, Pellicle, Photomask with Pellicle, Exposure Method,...
- Publication number 20240184205
- Publication date Jun 6, 2024
- Shin-Etsu Chemical Co., Ltd.
- Akinori Nishimura
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
THERMOSETTING IODINE- AND SILICON-CONTAINING MATERIAL, COMPOSITION...
- Publication number 20230333472
- Publication date Oct 19, 2023
- Shin-Etsu Chemical Co., Ltd.
- Tsutomu OGIHARA
- C07 - ORGANIC CHEMISTRY
Information Patent Application
ADHESION PROMOTER AND PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SAME
- Publication number 20220373887
- Publication date Nov 24, 2022
- SHANDONG SHENGQUAN NEW MATERIALS CO LTD.
- Diyuan TANG
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Photoresist Imaging and Development for Enhanced Nozzle Plate Adhesion
- Publication number 20220281224
- Publication date Sep 8, 2022
- Funai Electric Co., Ltd.
- Sean T. WEAVER
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LOW TEMPERATURE CURE PHOTOIMAGEABLE DIELECTRIC COMPOSITIONS AND MET...
- Publication number 20220146936
- Publication date May 12, 2022
- Daniel J. Nawrocki
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR RESIST COMPOSITION, AND METHOD OF FORMING PATTERNS US...
- Publication number 20210325781
- Publication date Oct 21, 2021
- Samsung SDI Co., Ltd.
- Kyung Soo MOON
- C07 - ORGANIC CHEMISTRY
Information Patent Application
COMPOSITION, FILM, NEAR INFRARED CUT FILTER, LAMINATE, PATTERN FORM...
- Publication number 20210139708
- Publication date May 13, 2021
- FUJIFILM CORPORATION
- Tokihiko MATSUMURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESION LAYER FOR MULTI-LAYER PHOTORESIST
- Publication number 20210103218
- Publication date Apr 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING IODINE- AND SILICON-CONTAINING MATERIAL, COMPOSITION...
- Publication number 20200159120
- Publication date May 21, 2020
- Shin-Etsu Chemical Co., Ltd.
- Tsutomu OGIHARA
- C07 - ORGANIC CHEMISTRY
Information Patent Application
SPIN ON ADHESION PROMOTERS
- Publication number 20200150532
- Publication date May 14, 2020
- International Business Machines Corporation
- Dario GOLDFARB
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATT...
- Publication number 20200117089
- Publication date Apr 16, 2020
- Shin-Etsu Chemical Co., Ltd.
- Hitoshi Maruyama
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR RESIST COMPOSITION, AND METHOD OF FORMING PATTERNS US...
- Publication number 20200117085
- Publication date Apr 16, 2020
- Samsung SDI Co., Ltd.
- Kyung Soo MOON
- C07 - ORGANIC CHEMISTRY
Information Patent Application
METHOD TO IMPROVE ADHESION OF PHOTORESIST ON SILICON SUBSTRATE FOR...
- Publication number 20200090936
- Publication date Mar 19, 2020
- International Business Machines Corporation
- Martin Glodde
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
TUNABLE ADHESION OF EUV PHOTORESIST ON OXIDE SURFACE
- Publication number 20200073246
- Publication date Mar 5, 2020
- International Business Machines Corporation
- Yongan Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION HAVIN...
- Publication number 20200026191
- Publication date Jan 23, 2020
- Nissan Chemical Industries, Ltd.
- Makoto NAKAJIMA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DI-AMINE COMPOUND, AND HEAT-RESISTANT RESIN AND RESIN COMPOSITION U...
- Publication number 20190256655
- Publication date Aug 22, 2019
- TORAY INDUSTRIES, INC.
- Yuki MASUDA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PROCESS FOR IMPROVING PHOTORESIST PILLAR ADHESION DURING MRAM FABRI...
- Publication number 20190207100
- Publication date Jul 4, 2019
- Spin Transfer Technologies, Inc.
- Elizabeth Dobisz
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
TUNABLE ADHESION OF EUV PHOTORESIST ON OXIDE SURFACE
- Publication number 20190187565
- Publication date Jun 20, 2019
- International Business Machines Corporation
- Yongan Xu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PHOTORESIST COMPOSITIONS, INTERMEDIATE PRODUCTS, AND METHODS OF MAN...
- Publication number 20190179227
- Publication date Jun 13, 2019
- Samsung Electronics Co., Ltd.
- JIN PARK
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN AND PHOTOSENSITIVE RESIN COMPOSITION
- Publication number 20190081258
- Publication date Mar 14, 2019
- TORAY INDUSTRIES, INC.
- Yuki MASUDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SILANE COUPLING AGENT AND METHOD OF MANUFACTURING WIRE GRID PATTERN...
- Publication number 20180348635
- Publication date Dec 6, 2018
- SAMSUNG DISPLAY CO., LTD.
- Min Hyuck Kang
- G02 - OPTICS
Information Patent Application
METHOD TO IMPROVE ADHESION OF PHOTORESIST ON SILICON SUBSTRATE FOR...
- Publication number 20180337048
- Publication date Nov 22, 2018
- International Business Machines Corporation
- Martin Glodde
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION FOR THIN FILM TRANSISTORS, CURED F...
- Publication number 20180017867
- Publication date Jan 18, 2018
- TORAY INDUSTRIES, INC.
- Satoshi KAMEMOTO
- G02 - OPTICS
Information Patent Application
EMBOSSING LACQUER AND METHOD FOR EMBOSSING, AND SUBSTRATE SURFACE C...
- Publication number 20170343900
- Publication date Nov 30, 2017
- JOANNEUM RESEARCH FORSCHUNGSGESELLSCHAFT MBH
- Dieter NEES
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
RESIST PATTERN-FORMING METHOD
- Publication number 20170322492
- Publication date Nov 9, 2017
- JSR Corporation
- Yusuke ANNO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING INTERLAYER INSULATING...
- Publication number 20170255099
- Publication date Sep 7, 2017
- Tokyo Ohka Kogyo Co., Ltd.
- Kazuhide UNO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SURFACE TREATMENT AGENT AND SURFACE TREATMENT METHOD
- Publication number 20170088722
- Publication date Mar 30, 2017
- Tokyo Ohka Kogyo Co., Ltd.
- Daijiro MORI
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SILANE COUPLING AGENT AND METHOD OF MANUFACTURING WIRE GRID PATTERN...
- Publication number 20170090285
- Publication date Mar 30, 2017
- SAMSUNG DISPLAY CO., LTD.
- Min Hyuck Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

used as adhesion-promoting additives or as means to improve adhesion

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low temperature cure photoimageable dielectric compositions and met...

Photoresist imaging and development for enhanced nozzle plate adhesion

Thermosetting iodine- and silicon-containing material, composition...

Adhesion promoter and photosensitive resin composition containing same

Di-amine compound, and heat-resistant resin and resin composition u...

Semiconductor resist composition, and method of forming patterns us...

Photoimageable compositions and processes for fabrication of relief...

Composition, film, near infrared cut filter, laminate, pattern form...

Adhesion promoters

Dry film formulation

Photosensitive resin composition, photosensitive dry film, and patt...

Resin and photosensitive resin composition

Silicon-containing resist underlayer film-forming composition havin...

Semiconductor resist composition, and method of forming patterns us...

Tunable adhesion of EUV photoresist on oxide surface

Method to improve adhesion of photoresist on silicon substrate for...

Composition, film, near infrared cut filter, laminate, pattern form...

Photosensitive compositions, color filter and microlens derived the...

Cured film and method for producing same

Adhesion layer for multi-layer photoresist

Embossing lacquer and method for embossing, and substrate surface c...

Silane coupling agent and method of manufacturing wire grid pattern...

Polymide precursor resin composition

Tunable adhesion of EUV photoresist on oxide surface

Method to improve adhesion of photoresist on silicon substrate for...

Photoresist compositions, intermediate products, and methods of man...

Fluorine-containing composition, substrate for pattern formation, p...

Photosensitive resin composition, film adhesive, adhesive sheet, ad...

Process for improving photoresist pillar adhesion during MRAM fabri...

Method to improve adhesion of photoresist on silicon substrate for...

Patents Applicationslast 30 patents

STRUCTURES INCLUDING A SiOCN PHOTORESIST ADHESION LAYER AND METAL-O...

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOS...

Pellicle Frame, Pellicle, Photomask with Pellicle, Exposure Method,...

THERMOSETTING IODINE- AND SILICON-CONTAINING MATERIAL, COMPOSITION...

ADHESION PROMOTER AND PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SAME

Photoresist Imaging and Development for Enhanced Nozzle Plate Adhesion

LOW TEMPERATURE CURE PHOTOIMAGEABLE DIELECTRIC COMPOSITIONS AND MET...

SEMICONDUCTOR RESIST COMPOSITION, AND METHOD OF FORMING PATTERNS US...

COMPOSITION, FILM, NEAR INFRARED CUT FILTER, LAMINATE, PATTERN FORM...

ADHESION LAYER FOR MULTI-LAYER PHOTORESIST

THERMOSETTING IODINE- AND SILICON-CONTAINING MATERIAL, COMPOSITION...

SPIN ON ADHESION PROMOTERS

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATT...

SEMICONDUCTOR RESIST COMPOSITION, AND METHOD OF FORMING PATTERNS US...

METHOD TO IMPROVE ADHESION OF PHOTORESIST ON SILICON SUBSTRATE FOR...

TUNABLE ADHESION OF EUV PHOTORESIST ON OXIDE SURFACE

SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION HAVIN...

DI-AMINE COMPOUND, AND HEAT-RESISTANT RESIN AND RESIN COMPOSITION U...

PROCESS FOR IMPROVING PHOTORESIST PILLAR ADHESION DURING MRAM FABRI...

TUNABLE ADHESION OF EUV PHOTORESIST ON OXIDE SURFACE

PHOTORESIST COMPOSITIONS, INTERMEDIATE PRODUCTS, AND METHODS OF MAN...

RESIN AND PHOTOSENSITIVE RESIN COMPOSITION

SILANE COUPLING AGENT AND METHOD OF MANUFACTURING WIRE GRID PATTERN...

METHOD TO IMPROVE ADHESION OF PHOTORESIST ON SILICON SUBSTRATE FOR...

PHOTOSENSITIVE RESIN COMPOSITION FOR THIN FILM TRANSISTORS, CURED F...

EMBOSSING LACQUER AND METHOD FOR EMBOSSING, AND SUBSTRATE SURFACE C...

RESIST PATTERN-FORMING METHOD

PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING INTERLAYER INSULATING...

SURFACE TREATMENT AGENT AND SURFACE TREATMENT METHOD

SILANE COUPLING AGENT AND METHOD OF MANUFACTURING WIRE GRID PATTERN...