used to support diced chips prior to mounting

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H01L2221/68354

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68354used to support diced chips prior to mounting

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integration of microdevices into system substrate
- Patent number 12,211,860
- Issue date Jan 28, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing display device and display device
- Patent number 12,198,970
- Issue date Jan 14, 2025
- Japan Display Inc.
- Kazuyuki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package structure and clamp...
- Patent number 12,176,240
- Issue date Dec 24, 2024
- Advanced Semiconductor Engineering, Inc.
- Yun Di Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package structure
- Patent number 12,176,261
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,170,264
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-LED manufacturing device
- Patent number 12,154,816
- Issue date Nov 26, 2024
- HARDRAM CO., LTD.
- Sung Wook Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pickup apparatus and method of using the same
- Patent number 12,142,499
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of electronic element module
- Patent number 12,132,144
- Issue date Oct 29, 2024
- PlayNitride Display Co., Ltd.
- Bo-Wei Wu
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method for selectively releasing a light-emitting diode chip and me...
- Patent number 12,125,735
- Issue date Oct 22, 2024
- ASTI GLOBAL INC., TAIWAN
- Te-Fu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED, and manufacturing method therefor
- Patent number 12,125,830
- Issue date Oct 22, 2024
- LG Electronics Inc.
- Wonseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated light emitting diodes for selective fluidic assembly
- Patent number 12,119,432
- Issue date Oct 15, 2024
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing optoelectronic devices
- Patent number 12,112,968
- Issue date Oct 8, 2024
- Osram Opto Semiconductors GmbH
- Ralph Wagner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in embedded wafer-level ball-grid array package
- Patent number 12,094,843
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device structure and display apparatus
- Patent number 12,087,612
- Issue date Sep 10, 2024
- Industrial Technology Research Institute
- Ming-Hsien Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of placing a micro device to a receiver substrate
- Patent number 12,080,685
- Issue date Sep 3, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet alignment method for micro-semiconductor chip and display trans...
- Patent number 12,080,585
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display device, and substrate for manufact...
- Patent number 12,080,580
- Issue date Sep 3, 2024
- LG Electronics Inc.
- Hyunwoo Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an optoelectronic light emitting device
- Patent number 12,074,145
- Issue date Aug 27, 2024
- Osram Opto Semiconductors GmbH
- Simeon Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processed stacked dies
- Patent number 12,068,278
- Issue date Aug 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for repairing vacancies resulting from mass trans...
- Patent number 12,068,430
- Issue date Aug 20, 2024
- Xerox Corporation
- Evgeniy Bart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interbonded components, method for detaching components from interb...
- Patent number 12,059,881
- Issue date Aug 13, 2024
- Osram Opto Semiconductors GmbH
- Alexander Pfeuffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microdevice transfer setup and integration of micro-devices into sy...
- Patent number 12,062,638
- Issue date Aug 13, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid tethers for micro-transfer printing
- Patent number 12,057,340
- Issue date Aug 6, 2024
- X-CELEPRINT LIMITED
- Ruggero Loi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip transferring method and the apparatus thereof
- Patent number 12,057,337
- Issue date Aug 6, 2024
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High throughput microprinting process
- Patent number 12,051,612
- Issue date Jul 30, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-LED transfer method and display panel
- Patent number 12,033,882
- Issue date Jul 9, 2024
- BOE Technology Group Co., Ltd.
- Lili Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of components onto compact devices using...
- Patent number 12,009,247
- Issue date Jun 11, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing optoelectronic semiconductor devices and optoe...
- Patent number 11,990,574
- Issue date May 21, 2024
- Osram Opto Semiconductors GmbH
- Choo Kean Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced info POP and method of forming thereof
- Patent number 11,955,460
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of LED display
- Patent number 11,942,352
- Issue date Mar 26, 2024
- Industry-Academic Cooperation Foundation, Yonsei University
- Dahl Young Khang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE AND SEPARATION METHOD
- Publication number 20250038036
- Publication date Jan 30, 2025
- Nichia Corporation.
- Hiroaki KAGEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250014937
- Publication date Jan 9, 2025
- Resonac Corporation
- Motoo AOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER DEVICE AND TRANSFER METHOD
- Publication number 20250014936
- Publication date Jan 9, 2025
- TORAY ENGINEERING CO., LTD.
- Koichi KAZAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN OPTOELECTRONIC ASSEMBLY
- Publication number 20250006543
- Publication date Jan 2, 2025
- ams-OSRAM International GmbH
- Daniel Leisen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ARRANGEMENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240420988
- Publication date Dec 19, 2024
- EPISTAR CORPORATION
- Chien-Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECEPTOR SUBSTRATE, METHOD FOR MANUFACTURING RECEPTOR SUBSTRATE, TR...
- Publication number 20240404865
- Publication date Dec 5, 2024
- Shin-Etsu Chemical Co., Ltd.
- Hiroshi Yamaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSED STACKED DIES
- Publication number 20240404990
- Publication date Dec 5, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-ELEMENT, ALIGNMENT SYSTEM AND ASSEMBLING METHOD
- Publication number 20240404864
- Publication date Dec 5, 2024
- TOHOKU-MICROTEC CO., LTD.
- Makoto MOTOYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR PRODUCING AND PREPARING ELECTRONIC COMPONENTS
- Publication number 20240387270
- Publication date Nov 21, 2024
- EV GROUP E. THALLNER GMBH
- Jurgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICKUP APPARATUS AND METHOD OF USING THE SAME
- Publication number 20240387206
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20240363585
- Publication date Oct 31, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPA...
- Publication number 20240363599
- Publication date Oct 31, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Can WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISSOLVING ADHESIVE BASE STRUCTURE TO RELEASE ELECTRONIC COMPONENT
- Publication number 20240347369
- Publication date Oct 17, 2024
- INFINEON TECHNOLOGIES AG
- Frank SINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THROUGHPUT MICROPRINTING PROCESS
- Publication number 20240347368
- Publication date Oct 17, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR REPAIRING VACANCIES RESULTING FROM MASS TRANS...
- Publication number 20240339560
- Publication date Oct 10, 2024
- Xerox Corporation
- Evgeniy Bart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TRANSFERRING METHOD AND THE APPARATUS THEREOF
- Publication number 20240339345
- Publication date Oct 10, 2024
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING...
- Publication number 20240332056
- Publication date Oct 3, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TRANSFER OF MICRO DEVICES
- Publication number 20240234190
- Publication date Jul 11, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUPPORT ASSEMBLY AND METHOD FOR MANUFACTUR...
- Publication number 20240234191
- Publication date Jul 11, 2024
- CHONGQING KONKA OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Guangchao DAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
End-Point Detection for Backside Metal Thickness Control
- Publication number 20240203798
- Publication date Jun 20, 2024
- HRL LABORATORIES, LLC
- Florian G. HERRAULT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER METHOD FOR OPTOELECTRONIC SEMICONDUCTOR COMPONENT
- Publication number 20240186173
- Publication date Jun 6, 2024
- ams-OSRAM International GmbH
- Alexander Pfeuffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20240153936
- Publication date May 9, 2024
- SEOUL SEMICONDUCTOR CO., LTD.
- Motonobu TAKEYA
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
TRANSFER OF MICRO DEVICES
- Publication number 20240136215
- Publication date Apr 25, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE TESTING CIRCUIT, LIGHT-EMITTING DIODE TESTING...
- Publication number 20240120437
- Publication date Apr 11, 2024
- EPISTAR CORPORATION
- Chia-Chen TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR FABRICATING DISPLAY PANEL AND FABRICATING METHOD THEREOF
- Publication number 20240120230
- Publication date Apr 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- Tae Hee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SUCTION ASSISTANCE DEVICE
- Publication number 20240112943
- Publication date Apr 4, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PROCESSING OF SINGULATED DIES AND METHODS FOR USING T...
- Publication number 20240096683
- Publication date Mar 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Carriers and Methods of Making and Using
- Publication number 20240055292
- Publication date Feb 15, 2024
- UTAC Headquarters Pte. Ltd.
- Roel Adeva Robles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE, MICRO DEVICE ALIGNMENT APPARATUS, AND ALIGNMENT METHO...
- Publication number 20240038569
- Publication date Feb 1, 2024
- POINT ENGINEERING CO., LTD.
- Bum Mo AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Screen, Method for Manufacturing Same, and Display Terminal
- Publication number 20240030205
- Publication date Jan 25, 2024
- Huawei Technologies Co., Ltd
- Haohui Long
- H01 - BASIC ELECTRIC ELEMENTS

used to support diced chips prior to mounting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integration of microdevices into system substrate

Method of manufacturing display device and display device

Method for manufacturing semiconductor package structure and clamp...

Method of fabricating package structure

Integrated circuit packages and methods of forming the same

Micro-LED manufacturing device

Pickup apparatus and method of using the same

Manufacturing method of electronic element module

Method for selectively releasing a light-emitting diode chip and me...

Display device using micro LED, and manufacturing method therefor

Encapsulated light emitting diodes for selective fluidic assembly

Method for producing optoelectronic devices

Antenna in embedded wafer-level ball-grid array package

Micro device structure and display apparatus

Method of placing a micro device to a receiver substrate

Wet alignment method for micro-semiconductor chip and display trans...

Method for manufacturing display device, and substrate for manufact...

Method for manufacturing an optoelectronic light emitting device

Processed stacked dies

System and method for repairing vacancies resulting from mass trans...

Interbonded components, method for detaching components from interb...

Microdevice transfer setup and integration of micro-devices into sy...

Hybrid tethers for micro-transfer printing

Chip transferring method and the apparatus thereof

High throughput microprinting process

Micro-LED transfer method and display panel

Heterogeneous integration of components onto compact devices using...

Method for producing optoelectronic semiconductor devices and optoe...

Advanced info POP and method of forming thereof

Manufacturing method of LED display

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE AND SEPARATION METHOD

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

TRANSFER DEVICE AND TRANSFER METHOD

METHOD FOR PRODUCING AN OPTOELECTRONIC ASSEMBLY

SEMICONDUCTOR DEVICE ARRANGEMENT AND METHOD OF MANUFACTURING THE SAME

RECEPTOR SUBSTRATE, METHOD FOR MANUFACTURING RECEPTOR SUBSTRATE, TR...

PROCESSED STACKED DIES

MICRO-ELEMENT, ALIGNMENT SYSTEM AND ASSEMBLING METHOD

METHOD AND DEVICE FOR PRODUCING AND PREPARING ELECTRONIC COMPONENTS

PICKUP APPARATUS AND METHOD OF USING THE SAME

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPA...

DISSOLVING ADHESIVE BASE STRUCTURE TO RELEASE ELECTRONIC COMPONENT

HIGH THROUGHPUT MICROPRINTING PROCESS

SYSTEM AND METHOD FOR REPAIRING VACANCIES RESULTING FROM MASS TRANS...

CHIP TRANSFERRING METHOD AND THE APPARATUS THEREOF

HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING...

TRANSFER OF MICRO DEVICES

METHOD FOR MANUFACTURING SUPPORT ASSEMBLY AND METHOD FOR MANUFACTUR...

End-Point Detection for Backside Metal Thickness Control

TRANSFER METHOD FOR OPTOELECTRONIC SEMICONDUCTOR COMPONENT

DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF

TRANSFER OF MICRO DEVICES

LIGHT-EMITTING DIODE TESTING CIRCUIT, LIGHT-EMITTING DIODE TESTING...

APPARATUS FOR FABRICATING DISPLAY PANEL AND FABRICATING METHOD THEREOF

DIE SUCTION ASSISTANCE DEVICE

APPARATUS FOR PROCESSING OF SINGULATED DIES AND METHODS FOR USING T...

Semiconductor Device Carriers and Methods of Making and Using

MICRO DEVICE, MICRO DEVICE ALIGNMENT APPARATUS, AND ALIGNMENT METHO...

Display Screen, Method for Manufacturing Same, and Display Terminal