used to support diced chips prior to mounting

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H01L2221/68354

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68354used to support diced chips prior to mounting

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display apparatus and manufacturing method thereof
- Patent number 12,368,145
- Issue date Jul 22, 2025
- Seoul Semiconductor Co., Ltd.
- Motonobu Takeya
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method for manufacturing display device, and transfer substrate for...
- Patent number 12,362,220
- Issue date Jul 15, 2025
- LG Electronics Inc.
- Jungsub Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED and method of manufacturing same
- Patent number 12,362,335
- Issue date Jul 15, 2025
- LG Electronics Inc.
- Chilkeun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display projector systems and devices for augmented-reality
- Patent number 12,355,022
- Issue date Jul 8, 2025
- Meta Platforms Technologies, LLC
- Rajendra D. Pendse
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microdevice integration into system substrate
- Patent number 12,349,527
- Issue date Jul 1, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Massive parallel assembly method
- Patent number 12,327,751
- Issue date Jun 10, 2025
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for selecting semiconductor components
- Patent number 12,322,636
- Issue date Jun 3, 2025
- AMS-OSRAM INTERNATIONAL GMBH
- Alexander Pfeuffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of components onto compact devices using...
- Patent number 12,308,275
- Issue date May 20, 2025
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Display apparatus and manufacturing method thereof
- Patent number 12,300,685
- Issue date May 13, 2025
- Seoul Semiconductor Co., Ltd.
- Motonobu Takeya
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Infrared debond damage mitigation by copper fill pattern
- Patent number 12,300,615
- Issue date May 13, 2025
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,293,985
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode testing circuit, light-emitting diode testing...
- Patent number 12,288,831
- Issue date Apr 29, 2025
- Epistar Corporation
- Chia-Chen Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode substrate and manufacturing method thereof, di...
- Patent number 12,249,529
- Issue date Mar 11, 2025
- BOE Technology Group Co., Ltd.
- Haixu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer for electronic components
- Patent number 12,249,530
- Issue date Mar 11, 2025
- Japan Display Inc.
- Kenichi Takemasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet alignment method for micro-semiconductor chip and display trans...
- Patent number 12,230,528
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluidic assembly encapsulating light emitting diodes
- Patent number 12,230,743
- Issue date Feb 18, 2025
- ehux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating control circuits with light emissive circuits with diss...
- Patent number 12,224,271
- Issue date Feb 11, 2025
- Meta Platforms Technologies, LLC
- Rajendra D. Pendse
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integration of microdevices into system substrate
- Patent number 12,211,860
- Issue date Jan 28, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing display device and display device
- Patent number 12,198,970
- Issue date Jan 14, 2025
- Japan Display Inc.
- Kazuyuki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package structure and clamp...
- Patent number 12,176,240
- Issue date Dec 24, 2024
- Advanced Semiconductor Engineering, Inc.
- Yun Di Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package structure
- Patent number 12,176,261
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,170,264
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-LED manufacturing device
- Patent number 12,154,816
- Issue date Nov 26, 2024
- HARDRAM CO., LTD.
- Sung Wook Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pickup apparatus and method of using the same
- Patent number 12,142,499
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of electronic element module
- Patent number 12,132,144
- Issue date Oct 29, 2024
- PlayNitride Display Co., Ltd.
- Bo-Wei Wu
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method for selectively releasing a light-emitting diode chip and me...
- Patent number 12,125,735
- Issue date Oct 22, 2024
- ASTI GLOBAL INC., TAIWAN
- Te-Fu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED, and manufacturing method therefor
- Patent number 12,125,830
- Issue date Oct 22, 2024
- LG Electronics Inc.
- Wonseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated light emitting diodes for selective fluidic assembly
- Patent number 12,119,432
- Issue date Oct 15, 2024
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing optoelectronic devices
- Patent number 12,112,968
- Issue date Oct 8, 2024
- Osram Opto Semiconductors GmbH
- Ralph Wagner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in embedded wafer-level ball-grid array package
- Patent number 12,094,843
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT-EMITTING ELEMENT ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING...
- Publication number 20250239477
- Publication date Jul 24, 2025
- AUO Corporation
- Kuan-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ARRANGEMENT
- Publication number 20250218850
- Publication date Jul 3, 2025
- EPISTAR CORPORATION
- Chang-Tai HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING DISPLAY DEVICE
- Publication number 20250218848
- Publication date Jul 3, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jae Gwang UM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR DEVICE MANUFAC...
- Publication number 20250201616
- Publication date Jun 19, 2025
- KIOXIA Corporation
- Yuusuke TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF LIGHT-EMITTING DIODE SUBSTRATE, DISPLAY DEVICE
- Publication number 20250183089
- Publication date Jun 5, 2025
- BOE TECHNOLOGY GROUP CO., LTD.
- Haixu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ATTACHING DEVICE, CHIP PROCESSING SYSTEM, AND CHIP PROCESSING...
- Publication number 20250183222
- Publication date Jun 5, 2025
- TOKYO ELECTRON LIMITED
- Yasutaka Mizomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20250167171
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20250167172
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20250160096
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20250160095
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC MICRODEVICE
- Publication number 20250160088
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO HEATER MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250149372
- Publication date May 8, 2025
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING ELEMENT TRANSFER STAMP AND METHOD FOR MANUFACTURING...
- Publication number 20250125168
- Publication date Apr 17, 2025
- LG Display Co., Ltd.
- Bong Seok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PROJECTOR SYSTEMS AND DEVICES FOR AUGMENTED-REALITY
- Publication number 20250125322
- Publication date Apr 17, 2025
- Meta Platforms Technologies, LLC
- Rajendra D. Pendse
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATION OF MICRODEVICES INTO SYSTEM SUBSTRATE
- Publication number 20250126887
- Publication date Apr 17, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE TRANSFER METHOD AND APPARATUS FOR MULTI-CHIP MODULE
- Publication number 20250118589
- Publication date Apr 10, 2025
- Silicon Box, Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE, MANUFACTURING EQUIPMENT OF DISPLAY DEVICE, AND MANU...
- Publication number 20250118588
- Publication date Apr 10, 2025
- SAMSUNG DISPLAY CO., LTD.
- Dong Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20250062151
- Publication date Feb 20, 2025
- InnoLux Corporation
- Fang-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID TETHERS FOR MICRO-TRANSFER PRINTING
- Publication number 20250054800
- Publication date Feb 13, 2025
- X-CELEPRINT LIMITED
- Ruggero Loi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING DISPLAY PANEL
- Publication number 20250054801
- Publication date Feb 13, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jong Hyup KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE AND SEPARATION METHOD
- Publication number 20250038036
- Publication date Jan 30, 2025
- Nichia Corporation.
- Hiroaki KAGEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250014937
- Publication date Jan 9, 2025
- Resonac Corporation
- Motoo AOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER DEVICE AND TRANSFER METHOD
- Publication number 20250014936
- Publication date Jan 9, 2025
- TORAY ENGINEERING CO., LTD.
- Koichi KAZAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN OPTOELECTRONIC ASSEMBLY
- Publication number 20250006543
- Publication date Jan 2, 2025
- ams-OSRAM International GmbH
- Daniel Leisen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ARRANGEMENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240420988
- Publication date Dec 19, 2024
- EPISTAR CORPORATION
- Chien-Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSED STACKED DIES
- Publication number 20240404990
- Publication date Dec 5, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECEPTOR SUBSTRATE, METHOD FOR MANUFACTURING RECEPTOR SUBSTRATE, TR...
- Publication number 20240404865
- Publication date Dec 5, 2024
- Shin-Etsu Chemical Co., Ltd.
- Hiroshi Yamaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-ELEMENT, ALIGNMENT SYSTEM AND ASSEMBLING METHOD
- Publication number 20240404864
- Publication date Dec 5, 2024
- TOHOKU-MICROTEC CO., LTD.
- Makoto MOTOYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR PRODUCING AND PREPARING ELECTRONIC COMPONENTS
- Publication number 20240387270
- Publication date Nov 21, 2024
- EV GROUP E. THALLNER GMBH
- Jurgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICKUP APPARATUS AND METHOD OF USING THE SAME
- Publication number 20240387206
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS

used to support diced chips prior to mounting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display apparatus and manufacturing method thereof

Method for manufacturing display device, and transfer substrate for...

Display device using micro LED and method of manufacturing same

Display projector systems and devices for augmented-reality

Microdevice integration into system substrate

Massive parallel assembly method

Method for selecting semiconductor components

Heterogeneous integration of components onto compact devices using...

Display apparatus and manufacturing method thereof

Infrared debond damage mitigation by copper fill pattern

Integrated circuit packages and methods of forming the same

Light-emitting diode testing circuit, light-emitting diode testing...

Light-emitting diode substrate and manufacturing method thereof, di...

Wafer for electronic components

Wet alignment method for micro-semiconductor chip and display trans...

Fluidic assembly encapsulating light emitting diodes

Integrating control circuits with light emissive circuits with diss...

Integration of microdevices into system substrate

Method of manufacturing display device and display device

Method for manufacturing semiconductor package structure and clamp...

Method of fabricating package structure

Integrated circuit packages and methods of forming the same

Micro-LED manufacturing device

Pickup apparatus and method of using the same

Manufacturing method of electronic element module

Method for selectively releasing a light-emitting diode chip and me...

Display device using micro LED, and manufacturing method therefor

Encapsulated light emitting diodes for selective fluidic assembly

Method for producing optoelectronic devices

Antenna in embedded wafer-level ball-grid array package

Patents Applicationslast 30 patents

LIGHT-EMITTING ELEMENT ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING...

SEMICONDUCTOR DEVICE ARRANGEMENT

METHOD OF MANUFACTURING DISPLAY DEVICE

SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR DEVICE MANUFAC...

MANUFACTURING METHOD OF LIGHT-EMITTING DIODE SUBSTRATE, DISPLAY DEVICE

CHIP ATTACHING DEVICE, CHIP PROCESSING SYSTEM, AND CHIP PROCESSING...

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE

OPTOELECTRONIC MICRODEVICE

MICRO HEATER MODULE AND METHOD OF MANUFACTURING THE SAME

LIGHT-EMITTING ELEMENT TRANSFER STAMP AND METHOD FOR MANUFACTURING...

DISPLAY PROJECTOR SYSTEMS AND DEVICES FOR AUGMENTED-REALITY

INTEGRATION OF MICRODEVICES INTO SYSTEM SUBSTRATE

DIE TRANSFER METHOD AND APPARATUS FOR MULTI-CHIP MODULE

DISPLAY DEVICE, MANUFACTURING EQUIPMENT OF DISPLAY DEVICE, AND MANU...

MANUFACTURING METHOD OF ELECTRONIC DEVICE

HYBRID TETHERS FOR MICRO-TRANSFER PRINTING

METHOD OF FABRICATING DISPLAY PANEL

METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE AND SEPARATION METHOD

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

TRANSFER DEVICE AND TRANSFER METHOD

METHOD FOR PRODUCING AN OPTOELECTRONIC ASSEMBLY

SEMICONDUCTOR DEVICE ARRANGEMENT AND METHOD OF MANUFACTURING THE SAME

PROCESSED STACKED DIES

RECEPTOR SUBSTRATE, METHOD FOR MANUFACTURING RECEPTOR SUBSTRATE, TR...

MICRO-ELEMENT, ALIGNMENT SYSTEM AND ASSEMBLING METHOD

METHOD AND DEVICE FOR PRODUCING AND PREPARING ELECTRONIC COMPONENTS

PICKUP APPARATUS AND METHOD OF USING THE SAME