used to support diced chips prior to mounting

Industry

CPC
H01L2221/68354

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68354used to support diced chips prior to mounting

Industries

Patents Grantslast 30 patents

Information Patent Grant
Advanced info POP and method of forming thereof
- Patent number 11,955,460
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of LED display
- Patent number 11,942,352
- Issue date Mar 26, 2024
- Industry-Academic Cooperation Foundation, Yonsei University
- Dahl Young Khang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, display panel and manufacturing method of...
- Patent number 11,901,479
- Issue date Feb 13, 2024
- PlayNitride Display Co., Ltd.
- Bo-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode testing circuit, light-emitting diode testing...
- Patent number 11,862,751
- Issue date Jan 2, 2024
- Epistar Corporation
- Chia-Chen Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus having a semiconductor light emitting source
- Patent number 11,848,316
- Issue date Dec 19, 2023
- Seoul Semiconductor Co., Ltd.
- Motonobu Takeya
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Integrating control circuits with light emissive circuits with diss...
- Patent number 11,842,989
- Issue date Dec 12, 2023
- Meta Platforms Technologies, LLC
- Rajendra D. Pendse
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Temporary die support structures and related methods
- Patent number 11,830,756
- Issue date Nov 28, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and manufacturing method thereof
- Patent number 11,817,440
- Issue date Nov 14, 2023
- Seoul Semiconductor Co., Ltd.
- Motonobu Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring micro light emitting diodes
- Patent number 11,810,809
- Issue date Nov 7, 2023
- Macroblock, Inc.
- Shih-Sian Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display device and substrate for manufactu...
- Patent number 11,798,921
- Issue date Oct 24, 2023
- LG Electronics Inc.
- Changseo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device transfer apparatus and method
- Patent number 11,784,081
- Issue date Oct 10, 2023
- Samsung Display Co., Ltd.
- Heung Yeol Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual sided fan-out package having low warpage across all temperatures
- Patent number 11,784,166
- Issue date Oct 10, 2023
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 11,769,685
- Issue date Sep 26, 2023
- INNOLUX CORPORATION
- Cheng-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet alignment method for micro-semiconductor chip and display trans...
- Patent number 11,764,095
- Issue date Sep 19, 2023
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin bridge and multi-die ultrafine pitch patch architecture a...
- Patent number 11,756,889
- Issue date Sep 12, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package structure
- Patent number 11,756,855
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device integration into system substrate
- Patent number 11,735,623
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of demounting thin semiconductor devices
- Patent number 11,735,464
- Issue date Aug 22, 2023
- American Semiconductor, Inc.
- Douglas R. Hackler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for releasing ultra-small or ultra-thin discrete components...
- Patent number 11,728,201
- Issue date Aug 15, 2023
- Kulicke and Soffa Industries, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices for fabrication of shielded modules
- Patent number 11,682,585
- Issue date Jun 20, 2023
- Skyworks Solutions, Inc.
- Yi Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of aligning micro light emitting element and display transfe...
- Patent number 11,676,848
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Hyunjoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip transferring method and the apparatus thereof
- Patent number 11,658,052
- Issue date May 23, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processed stacked dies
- Patent number 11,652,083
- Issue date May 16, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic segmented LED array architecture
- Patent number 11,652,134
- Issue date May 16, 2023
- Lumileds LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel for display by micro LED and method for making same
- Patent number 11,652,089
- Issue date May 16, 2023
- Hon Hai Precision Industry Co., Ltd.
- Wei-Chih Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric device
- Patent number 11,640,913
- Issue date May 2, 2023
- Ultra Display Technology Corp.
- Hsien-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer device and transfer method for micro light-emitting diode...
- Patent number 11,621,183
- Issue date Apr 4, 2023
- TCL China Star Optoelectronics Technology Co., Ltd.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode
- Patent number 11,569,116
- Issue date Jan 31, 2023
- Lextar Electronics Corporation
- Shiou-Yi Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for direct transfer of semiconductor device die
- Patent number 11,562,990
- Issue date Jan 24, 2023
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package, semiconductor packa...
- Patent number 11,562,967
- Issue date Jan 24, 2023
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20240153936
- Publication date May 9, 2024
- SEOUL SEMICONDUCTOR CO., LTD.
- Motonobu TAKEYA
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
TRANSFER OF MICRO DEVICES
- Publication number 20240136215
- Publication date Apr 25, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE TESTING CIRCUIT, LIGHT-EMITTING DIODE TESTING...
- Publication number 20240120437
- Publication date Apr 11, 2024
- EPISTAR CORPORATION
- Chia-Chen TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR FABRICATING DISPLAY PANEL AND FABRICATING METHOD THEREOF
- Publication number 20240120230
- Publication date Apr 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- Tae Hee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SUCTION ASSISTANCE DEVICE
- Publication number 20240112943
- Publication date Apr 4, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PROCESSING OF SINGULATED DIES AND METHODS FOR USING T...
- Publication number 20240096683
- Publication date Mar 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Carriers and Methods of Making and Using
- Publication number 20240055292
- Publication date Feb 15, 2024
- UTAC Headquarters Pte. Ltd.
- Roel Adeva Robles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE, MICRO DEVICE ALIGNMENT APPARATUS, AND ALIGNMENT METHO...
- Publication number 20240038569
- Publication date Feb 1, 2024
- POINT ENGINEERING CO., LTD.
- Bum Mo AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Screen, Method for Manufacturing Same, and Display Terminal
- Publication number 20240030205
- Publication date Jan 25, 2024
- Huawei Technologies Co., Ltd
- Haohui Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED TRANSFER METHOD, DISPLAY PANEL AND FABRICATION METHOD
- Publication number 20240006217
- Publication date Jan 4, 2024
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Ping ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPON WAFER AND METHOD OF PREPARATION THEREOF
- Publication number 20230420305
- Publication date Dec 28, 2023
- ROCKLEY PHOTONICS LIMITED
- Ludovic CARO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE
- Publication number 20230420284
- Publication date Dec 28, 2023
- Nichia Corporation.
- Kensuke YAMAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASS TRANSFER OF SEMICONDUCTOR DIE USING TRANSFER ELEMENTS
- Publication number 20230402310
- Publication date Dec 14, 2023
- CreeLED, Inc.
- Colin Blakely
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20230387098
- Publication date Nov 30, 2023
- SEOUL SEMICONDUCTOR CO., LTD.
- Motonobu TAKEYA
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...
- Publication number 20230377936
- Publication date Nov 23, 2023
- Kulicke and Soffa Industries, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING METHOD
- Publication number 20230377938
- Publication date Nov 23, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Wanli GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20230360995
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF MICRODEVICES INTO SYSTEM SUBSTRATE
- Publication number 20230326937
- Publication date Oct 12, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20230317497
- Publication date Oct 5, 2023
- AUO Corporation
- Bo-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTING COMPONENTS SUSPENDED BY FRAMES
- Publication number 20230290663
- Publication date Sep 14, 2023
- X-CELEPRINT LIMITED
- António José Marques Trindade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Positioning Components on a Substrate and Substrates Sui...
- Publication number 20230290664
- Publication date Sep 14, 2023
- IMEC vzw
- Tom Sterken
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP TRANSFERRING METHOD AND THE APPARATUS THEREOF
- Publication number 20230274962
- Publication date Aug 31, 2023
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANS...
- Publication number 20230274970
- Publication date Aug 31, 2023
- Samsung Electronics Co., Ltd.
- Kyungwook HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANS...
- Publication number 20230274969
- Publication date Aug 31, 2023
- Samsung Electronics Co., Ltd.
- Kyungwook HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20230275071
- Publication date Aug 31, 2023
- Samsung Electronics Co., Ltd.
- Myunghee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20230268310
- Publication date Aug 24, 2023
- KIOXIA Corporation
- Satoru ITAKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO ELEMENT CARRIER AND MICRO ELEMENT TRANSFER SYSTEM INCLUDING S...
- Publication number 20230268204
- Publication date Aug 24, 2023
- POINT ENGINEERING CO., LTD.
- Seung Ho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230207537
- Publication date Jun 29, 2023
- LG Display Co., Ltd.
- Hyowon KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20230207611
- Publication date Jun 29, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT, SEMICONDUCTOR ELEME...
- Publication number 20230140914
- Publication date May 11, 2023
- KYOCERA CORPORATION
- Katsuaki MASAKI
- H01 - BASIC ELECTRIC ELEMENTS

used to support diced chips prior to mounting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Advanced info POP and method of forming thereof

Manufacturing method of LED display

Semiconductor structure, display panel and manufacturing method of...

Light-emitting diode testing circuit, light-emitting diode testing...

Display apparatus having a semiconductor light emitting source

Integrating control circuits with light emissive circuits with diss...

Temporary die support structures and related methods

Display apparatus and manufacturing method thereof

Method for transferring micro light emitting diodes

Method for manufacturing display device and substrate for manufactu...

Micro device transfer apparatus and method

Dual sided fan-out package having low warpage across all temperatures

Manufacturing method of semiconductor package

Wet alignment method for micro-semiconductor chip and display trans...

Ultrathin bridge and multi-die ultrafine pitch patch architecture a...

Method of fabricating package structure

Micro device integration into system substrate

Method of demounting thin semiconductor devices

Methods for releasing ultra-small or ultra-thin discrete components...

Devices for fabrication of shielded modules

Method of aligning micro light emitting element and display transfe...

Chip transferring method and the apparatus thereof

Processed stacked dies

Monolithic segmented LED array architecture

Panel for display by micro LED and method for making same

Photoelectric device

Transfer device and transfer method for micro light-emitting diode...

Light emitting diode

Systems for direct transfer of semiconductor device die

Method for fabricating a semiconductor package, semiconductor packa...

Patents Applicationslast 30 patents

DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF

TRANSFER OF MICRO DEVICES

LIGHT-EMITTING DIODE TESTING CIRCUIT, LIGHT-EMITTING DIODE TESTING...

APPARATUS FOR FABRICATING DISPLAY PANEL AND FABRICATING METHOD THEREOF

DIE SUCTION ASSISTANCE DEVICE

APPARATUS FOR PROCESSING OF SINGULATED DIES AND METHODS FOR USING T...

Semiconductor Device Carriers and Methods of Making and Using

MICRO DEVICE, MICRO DEVICE ALIGNMENT APPARATUS, AND ALIGNMENT METHO...

Display Screen, Method for Manufacturing Same, and Display Terminal

MICRO LED TRANSFER METHOD, DISPLAY PANEL AND FABRICATION METHOD

COUPON WAFER AND METHOD OF PREPARATION THEREOF

METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE

MASS TRANSFER OF SEMICONDUCTOR DIE USING TRANSFER ELEMENTS

DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF

Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...

CHIP BONDING METHOD

METHOD OF FABRICATING PACKAGE STRUCTURE

INTEGRATION OF MICRODEVICES INTO SYSTEM SUBSTRATE

DISPLAY APPARATUS

PRINTING COMPONENTS SUSPENDED BY FRAMES

Method for Positioning Components on a Substrate and Substrates Sui...

CHIP TRANSFERRING METHOD AND THE APPARATUS THEREOF

WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANS...

WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANS...

DISPLAY MODULE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

MICRO ELEMENT CARRIER AND MICRO ELEMENT TRANSFER SYSTEM INCLUDING S...

DISPLAY DEVICE

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT, SEMICONDUCTOR ELEME...