Using a carrier for applying a plurality of packaging lids to the system wafer

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CPC
B81C2203/0127

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

Current Industry

B81C2203/0127Using a carrier for applying a plurality of packaging lids to the system wafer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Eutectic bonding with AlGe
- Patent number 11,724,933
- Issue date Aug 15, 2023
- Rohm Co., Ltd.
- Martin Heller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical electronics device
- Patent number 11,667,523
- Issue date Jun 6, 2023
- Texas Instruments Incorporated
- Simon Joshua Jacobs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical electronics device
- Patent number 10,894,712
- Issue date Jan 19, 2021
- Texas Instruments Incorporated
- Simon Joshua Jacobs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Eutectic bonding with AlGe
- Patent number 10,793,427
- Issue date Oct 6, 2020
- Kionix, Inc.
- Martin Heller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Eutectic bonding with ALGe
- Patent number 10,766,767
- Issue date Sep 8, 2020
- Kionix, Inc.
- Martin Heller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for processing product wafers using carrier substrates
- Patent number 10,759,660
- Issue date Sep 1, 2020
- Qorvo US, Inc.
- Jonathan Hammond
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing optical components using functional elements
- Patent number 10,752,500
- Issue date Aug 25, 2020
- FRAUNHOFER-GESELLSCAFT ZUR FÖRDERUNG ANGEWANDTEN FORSCHUNG E.V.
- Hans Joachim Quenzer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical electronic device and method of fabrication
- Patent number 9,994,441
- Issue date Jun 12, 2018
- Texas Instruments Incorporated
- Simon Joshua Jacobs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Temporary mechanical stabilization of semiconductor cavities
- Patent number 9,988,262
- Issue date Jun 5, 2018
- Infineon Technologies AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Transfer method, manufacturing method, device and electronic appara...
- Patent number 9,908,775
- Issue date Mar 6, 2018
- GOERTEK INC.
- Quanbo Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for handling a thin substrate and for substrate capping
- Patent number 9,266,724
- Issue date Feb 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked MEMS microphone packaging method
- Patent number 9,260,298
- Issue date Feb 16, 2016
- Lingsen Precision Industries, Ltd.
- Hsien-Ken Liao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thin back glass interconnect
- Patent number 9,045,332
- Issue date Jun 2, 2015
- QUALCOMM MEMS Technologies, Inc.
- Ravindra V. Shenoy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for handling a thin substrate and for substrate capping
- Patent number 8,796,110
- Issue date Aug 5, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and device for encapsulating microstructures
- Patent number 8,617,413
- Issue date Dec 31, 2013
- KFM Technology
- Sebastien Brault
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing capped MEMS components
- Patent number 8,470,631
- Issue date Jun 25, 2013
- Robert Bosch GmbH
- Torsten Kramer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package having formed metal lid
- Patent number 8,309,388
- Issue date Nov 13, 2012
- Texas Instruments Incorporated
- Kurt P. Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Protection capsule for MEMS devices
- Patent number 7,682,860
- Issue date Mar 23, 2010
- DALSA Semiconductor Inc.
- Luc Ouellet
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer lever fixture and method for packaging micro-electro-mechanic...
- Patent number 7,651,888
- Issue date Jan 26, 2010
- Advanced Semiconductor Engineering, Inc.
- Hsueh An Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing semiconductor sensor
- Patent number 7,598,118
- Issue date Oct 6, 2009
- Denso Corporation
- Kazuhiko Sugiura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package and method for making the same
- Patent number 7,491,568
- Issue date Feb 17, 2009
- Advanced Semiconductor Engineering, Inc.
- Wei-Chung Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for fabricating protective caps for protecting elements on a...
- Patent number 7,410,886
- Issue date Aug 12, 2008
- Advanced Semiconductor Engineering, Inc.
- Wei-Chung Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming at least one protective cap
- Patent number 7,407,614
- Issue date Aug 5, 2008
- Silverbrook Research Pty Ltd
- Kia Silverbrook
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for wafer-level package
- Patent number 7,361,284
- Issue date Apr 22, 2008
- Touch Micro-System Technology Inc.
- Chih-Hsien Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Moulding assembly for forming at least one protective cap
- Patent number 7,284,976
- Issue date Oct 23, 2007
- Silverbrook Research Pty Ltd
- Kia Silverbrook
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Placement tool for wafer scale caps
- Patent number 7,173,332
- Issue date Feb 6, 2007
- Silverbrook Research Pty Ltd
- Kia Silverbrook
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Two part mold for wafer scale caps
- Patent number 7,126,216
- Issue date Oct 24, 2006
- Silverbrook Research Pty Ltd
- Kia Silverbrook
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mold making method for wafer scale caps
- Patent number 7,026,176
- Issue date Apr 11, 2006
- Silverbrook Research Pty Ltd
- Kia Silverbrook
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabricating an array of wafer scale polymeric caps
- Patent number 7,008,819
- Issue date Mar 7, 2006
- Silverbrook Research Pty Ltd
- Kia Silverbrook
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of protecting microfabricated devices with protective caps
- Patent number 7,001,793
- Issue date Feb 21, 2006
- Silverbrook Research Pty Ltd
- Kia Silverbrook
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS DEVICE HAVING AN IMPROVED CAP AND MANUFACTURING PROCESS THEREOF
- Publication number 20240239648
- Publication date Jul 18, 2024
- STMicroelectronics S.r.l.
- Silvia NICOLI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING STRUCTURES AND PACKAGING METHODS FOR ULTRASOUND-ON-CHIP D...
- Publication number 20230034707
- Publication date Feb 2, 2023
- BFLY Operations, Inc
- Jianwei Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A PLURALITY OF SENSOR DEVICES, AND SENSOR DEVICE
- Publication number 20220041436
- Publication date Feb 10, 2022
- ROBERT BOSCH GmbH
- Daniel Haug
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL ELECTRONICS DEVICE
- Publication number 20210139320
- Publication date May 13, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Simon Joshua Jacobs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING STRUCTURES AND PACKAGING METHODS FOR ULTRASOUND-ON-CHIP D...
- Publication number 20200239299
- Publication date Jul 30, 2020
- Butterfly Network, Inc.
- Jianwei Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EUTECTIC BONDING WITH ALGe
- Publication number 20200048078
- Publication date Feb 13, 2020
- Kionix, Inc.
- Martin Heller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Eutectic Bonding With ALGe
- Publication number 20190263656
- Publication date Aug 29, 2019
- Kionix, Inc.
- Martin Heller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL ELECTRONICS DEVICE
- Publication number 20180257930
- Publication date Sep 13, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Simon Joshua Jacobs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TEMPORARY MECHANICAL STABILIZATION OF SEMICONDUCTOR CAVITIES
- Publication number 20180086632
- Publication date Mar 29, 2018
- INFINEON TECHNOLOGIES AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW COST WAFER LEVEL PROCESS FOR PACKAGING MEMS THREE DIMENSIONAL D...
- Publication number 20170233247
- Publication date Aug 17, 2017
- The Regents of the University of California
- Andrei A. Shkel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED MEMS MICROPHONE PACKAGING METHOD
- Publication number 20160052780
- Publication date Feb 25, 2016
- LINGSEN PRECISION INDUSTRIES, LTD.
- Hsien-Ken LIAO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PROCESSING PRODUCT WAFERS USING CARRIER SUBSTRATES
- Publication number 20150329355
- Publication date Nov 19, 2015
- RF Micro Devices, Inc.
- Jonathan Hammond
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Handling a Thin Substrate and for Substrate Capping
- Publication number 20140322894
- Publication date Oct 30, 2014
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THIN BACK GLASS INTERCONNECT
- Publication number 20130135317
- Publication date May 30, 2013
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Ravindra V. Shenoy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATION OF EMS DEVICES ON GLASS
- Publication number 20130106868
- Publication date May 2, 2013
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Ravindra V. Shenoy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Handling a Thin Substrate and for Substrate Capping
- Publication number 20130052797
- Publication date Feb 28, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer Level Package and Manufacturing Method Using Photodefinable P...
- Publication number 20120094418
- Publication date Apr 19, 2012
- TriQuint Semiconductor, Inc.
- George Grama
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND DEVICE FOR ENCAPSULATING MICROSTRUCTURES
- Publication number 20110165365
- Publication date Jul 7, 2011
- KFM TECHNOLOGY
- Sebastien Brault
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE PACKAGES AND METHODS OF FABRICATING THE SAME
- Publication number 20110115036
- Publication date May 19, 2011
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jong Tae MOON
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING CAPPED MEMS COMPONENTS
- Publication number 20100267183
- Publication date Oct 21, 2010
- Torsten Kramer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Package Having Formed Metal Lid
- Publication number 20090267223
- Publication date Oct 29, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Kurt P. WACHTLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVER FIXTURE AND METHOD FOR PACKAGING MICRO-ELECTRO-MECHANIC...
- Publication number 20090215228
- Publication date Aug 27, 2009
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Hsueh An YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE STRUCTURE HAVING M...
- Publication number 20080188026
- Publication date Aug 7, 2008
- Advanced Semiconductor Engineering, Inc.
- Meng-Jen Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROTECTION CAPSULE FOR MEMS DEVICES
- Publication number 20070231943
- Publication date Oct 4, 2007
- DALSA Semiconductor Inc.
- Luc Ouellet
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR WAFER-LEVEL PACKAGE
- Publication number 20070218584
- Publication date Sep 20, 2007
- Chih-Hsien Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of manufacturing semiconductor sensor
- Publication number 20070117260
- Publication date May 24, 2007
- DENSO CORPORATION
- Kazuhiko Sugiura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level package and method for making the same
- Publication number 20070048899
- Publication date Mar 1, 2007
- Wei-Chung Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Fabricating Protective Caps for Protecting Elements on a...
- Publication number 20070031994
- Publication date Feb 8, 2007
- Wei-Chung Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for forming at least one protective cap
- Publication number 20050142686
- Publication date Jun 30, 2005
- Kia Silverbrook
- Kia Silverbrook
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Moulding assembly for forming at least one protective cap
- Publication number 20050142242
- Publication date Jun 30, 2005
- Kia Silverbrook
- Kia Silverbrook
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Using a carrier for applying a plurality of packaging lids to the system wafer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Eutectic bonding with AlGe

Optical electronics device

Optical electronics device

Eutectic bonding with AlGe

Eutectic bonding with ALGe

Method for processing product wafers using carrier substrates

Method for producing optical components using functional elements

Optical electronic device and method of fabrication

Temporary mechanical stabilization of semiconductor cavities

Transfer method, manufacturing method, device and electronic appara...

Method for handling a thin substrate and for substrate capping

Stacked MEMS microphone packaging method

Thin back glass interconnect

Method for handling a thin substrate and for substrate capping

Method and device for encapsulating microstructures

Method for manufacturing capped MEMS components

MEMS package having formed metal lid

Protection capsule for MEMS devices

Wafer lever fixture and method for packaging micro-electro-mechanic...

Method of manufacturing semiconductor sensor

Wafer level package and method for making the same

Method for fabricating protective caps for protecting elements on a...

Method for forming at least one protective cap

Method for wafer-level package

Moulding assembly for forming at least one protective cap

Placement tool for wafer scale caps

Two part mold for wafer scale caps

Mold making method for wafer scale caps

Method of fabricating an array of wafer scale polymeric caps

Method of protecting microfabricated devices with protective caps

Patents Applicationslast 30 patents

MEMS DEVICE HAVING AN IMPROVED CAP AND MANUFACTURING PROCESS THEREOF

PACKAGING STRUCTURES AND PACKAGING METHODS FOR ULTRASOUND-ON-CHIP D...

METHOD FOR PRODUCING A PLURALITY OF SENSOR DEVICES, AND SENSOR DEVICE

OPTICAL ELECTRONICS DEVICE

PACKAGING STRUCTURES AND PACKAGING METHODS FOR ULTRASOUND-ON-CHIP D...

EUTECTIC BONDING WITH ALGe

Eutectic Bonding With ALGe

OPTICAL ELECTRONICS DEVICE

TEMPORARY MECHANICAL STABILIZATION OF SEMICONDUCTOR CAVITIES

LOW COST WAFER LEVEL PROCESS FOR PACKAGING MEMS THREE DIMENSIONAL D...

STACKED MEMS MICROPHONE PACKAGING METHOD

METHOD FOR PROCESSING PRODUCT WAFERS USING CARRIER SUBSTRATES

Method for Handling a Thin Substrate and for Substrate Capping

THIN BACK GLASS INTERCONNECT

ENCAPSULATION OF EMS DEVICES ON GLASS

Method for Handling a Thin Substrate and for Substrate Capping

Wafer Level Package and Manufacturing Method Using Photodefinable P...

METHOD AND DEVICE FOR ENCAPSULATING MICROSTRUCTURES

DEVICE PACKAGES AND METHODS OF FABRICATING THE SAME

METHOD FOR MANUFACTURING CAPPED MEMS COMPONENTS

MEMS Package Having Formed Metal Lid

WAFER LEVER FIXTURE AND METHOD FOR PACKAGING MICRO-ELECTRO-MECHANIC...

METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE STRUCTURE HAVING M...

PROTECTION CAPSULE FOR MEMS DEVICES

METHOD FOR WAFER-LEVEL PACKAGE

Method of manufacturing semiconductor sensor

Wafer level package and method for making the same

Method for Fabricating Protective Caps for Protecting Elements on a...

Method for forming at least one protective cap

Moulding assembly for forming at least one protective cap