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H01L2224/78901

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78901using a computer

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Patents Grantslast 30 patents

Information Patent Grant
Methods of calibrating an ultrasonic characteristic on a wire bondi...
- Patent number 12,113,043
- Issue date Oct 8, 2024
- Kulicke and Soffa Industries, Inc.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 11,961,819
- Issue date Apr 16, 2024
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 11,908,827
- Issue date Feb 20, 2024
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 11,824,038
- Issue date Nov 21, 2023
- Shinkawa Ltd.
- Nobuyuki Aoyagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Force sensor in an ultrasonic wire bonding device
- Patent number 11,798,911
- Issue date Oct 24, 2023
- ASMPT SINGAPORE PTE. LTD.
- Hing Leung Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding insulated coating wire, connection structure, me...
- Patent number 11,791,304
- Issue date Oct 17, 2023
- Kaijo Corporation
- Akio Sugito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus and manufacturing method for semiconductor a...
- Patent number 11,450,640
- Issue date Sep 20, 2022
- Shinkawa Ltd.
- Shinsuke Tei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Full-automatic deep access ball bonding head device
- Patent number 11,437,343
- Issue date Sep 6, 2022
- ZHEJIANG RUIQUN TECHNOLOGY CO., LTD.
- Wen Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of vertically vibrating a bonding arm
- Patent number 11,302,667
- Issue date Apr 12, 2022
- Kaijo Corporation
- Riki Jindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for calibrating wire clamp device
- Patent number 11,257,781
- Issue date Feb 22, 2022
- Shinkawa Ltd.
- Noboru Fujino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic vibration bonding apparatus
- Patent number 10,953,487
- Issue date Mar 23, 2021
- Toshiba Mitsubishi-Electric Industrial Systems Corporation
- Akihiro Ichinose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods of operating wire bonding machines including cl...
- Patent number 10,763,236
- Issue date Sep 1, 2020
- Kulicke and Soffa Industries, Inc.
- Peter J. Klaerner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
On-bonder automatic overhang die optimization tool for wire bonding...
- Patent number 10,665,564
- Issue date May 26, 2020
- Kulicke and Soffa Industries, Inc.
- Aashish Shah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Detection of foreign particles during wire bonding
- Patent number 10,658,328
- Issue date May 19, 2020
- ASM Technology Singapore Pte. Ltd.
- Tact Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Screening methodology to eliminate wire sweep in bond and assembly...
- Patent number 10,605,850
- Issue date Mar 31, 2020
- International Business Machines Corporation
- Stephen Peter Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for detecting and removing defective integrate...
- Patent number 10,504,801
- Issue date Dec 10, 2019
- Texas Instruments Incorporated
- Zheng Qing Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus
- Patent number 10,340,163
- Issue date Jul 2, 2019
- Shinkawa Ltd.
- Kohei Seyama
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Bonding device
- Patent number 10,262,969
- Issue date Apr 16, 2019
- Kaijo Corporation
- Akio Sugito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
On-bonder automatic overhang die optimization tool for wire bonding...
- Patent number 10,121,759
- Issue date Nov 6, 2018
- Kulicke and Soffa Industries, Inc.
- Aashish Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus and method of manufacturing semiconductor de...
- Patent number 9,899,348
- Issue date Feb 20, 2018
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire-bonding apparatus and method of manufacturing semiconductor de...
- Patent number 9,793,236
- Issue date Oct 17, 2017
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Screening methodology to eliminate wire sweep in bond and assembly...
- Patent number 9,470,740
- Issue date Oct 18, 2016
- International Business Machines Corporation
- Stephen Peter Ayotte
- G01 - MEASURING TESTING
Information Patent Grant
Wire spool system for a wire bonding apparatus
- Patent number 9,461,013
- Issue date Oct 4, 2016
- ASM Technology Singapore Pte. Ltd.
- Chi Wah Cheng
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Bond pad assessment for wire bonding
- Patent number 8,657,180
- Issue date Feb 25, 2014
- ASM Technology Singapore Pte. Ltd.
- Ming Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wedge bonder and a method of cleaning a wedge bonder
- Patent number 8,657,181
- Issue date Feb 25, 2014
- ASM Technology Singapore Pte. Ltd.
- Chi Wah Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, and bonding apparatus
- Patent number 8,292,160
- Issue date Oct 23, 2012
- Shinkawa Ltd.
- Yusuke Maruya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of teaching eyepoints for wire bonding and related semicondu...
- Patent number 8,100,317
- Issue date Jan 24, 2012
- Kulicke and Soffa Industries, Inc.
- Michael T. Deley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire loop and method of forming the wire loop
- Patent number 8,048,720
- Issue date Nov 1, 2011
- Kulicke and Soffa Industries, Inc.
- Dodgie Reigh M. Calpito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of teaching eyepoints for wire bonding and related semicondu...
- Patent number 7,931,186
- Issue date Apr 26, 2011
- Kulicke and Soffa Industries, Inc.
- Michael T. Deley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and an information management system therefor
- Patent number 7,832,648
- Issue date Nov 16, 2010
- Oki Semiconductor Co., Ltd.
- Isao Kudo
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...
- Publication number 20240404986
- Publication date Dec 5, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND COMPUTER READABLE STORAGE ME...
- Publication number 20240304592
- Publication date Sep 12, 2024
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING DEVICE, MAINTENANCE METHOD AND NON-TRANSITORY COMPUTER...
- Publication number 20240088089
- Publication date Mar 14, 2024
- SHINKAWA LTD.
- Tsutomu KIYONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP-FORMING DEVICE, BUMP-FORMING METHOD, AND NON-TRANSITORY COMPUT...
- Publication number 20240055388
- Publication date Feb 15, 2024
- SHINKAWA LTD.
- Kiyotaka TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20230178510
- Publication date Jun 8, 2023
- SHINKAWA LTD.
- Shigeru HAYATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...
- Publication number 20230154888
- Publication date May 18, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING STATE DETERMINATION METHOD AND WIRE BONDING STATE DETE...
- Publication number 20220320040
- Publication date Oct 6, 2022
- Yamaha Robotics Holdings Co., Ltd.
- Hiroshi MUNAKATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR BONDING INSULATED COATING WIRE, CONNECTION STRUCTURE, ME...
- Publication number 20210358881
- Publication date Nov 18, 2021
- KAIJO CORPORATION
- Akio SUGITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20210272927
- Publication date Sep 2, 2021
- SHINKAWA LTD.
- Nobuyuki AOYAGI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FULL-AUTOMATIC DEEP ACCESS BALL BONDING HEAD DEVICE
- Publication number 20210057374
- Publication date Feb 25, 2021
- NINGBO SHANGJIN AUTOMATION TECHNOLOGY CO., LTD.
- Wen CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS OF OPERATING WIRE BONDING MACHINES INCLUDING CL...
- Publication number 20190214363
- Publication date Jul 11, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Peter J. Klaerner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DETECTION OF FOREIGN PARTICLES DURING WIRE BONDING
- Publication number 20190139929
- Publication date May 9, 2019
- ASM Technology Singapore Pte Ltd
- Tact LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ON-BONDER AUTOMATIC OVERHANG DIE OPTIMIZATION TOOL FOR WIRE BONDING...
- Publication number 20190027463
- Publication date Jan 24, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Aashish Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC VIBRATION BONDING APPARATUS
- Publication number 20180272463
- Publication date Sep 27, 2018
- TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
- Akihiro ICHINOSE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method For Producing Wire Bond Connection And Arrangement For Imple...
- Publication number 20180218996
- Publication date Aug 2, 2018
- F&K Delvotec Bondtechnik GmbH
- Franz Schlicht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING APPARATUS
- Publication number 20170309503
- Publication date Oct 26, 2017
- SHINKAWA LTD.
- Kohei SEYAMA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ON-BONDER AUTOMATIC OVERHANG DIE OPTIMIZATION TOOL FOR WIRE BONDING...
- Publication number 20170125311
- Publication date May 4, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Aashish Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20160351537
- Publication date Dec 1, 2016
- SHINKAWA LTD.
- Naoki SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE SPOOL SYSTEM FOR A WIRE BONDING APPARATUS
- Publication number 20160148898
- Publication date May 26, 2016
- Chi Wah CHENG
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
SCREENING METHODOLOGY TO ELIMINATE WIRE SWEEP IN BOND AND ASSEMBLY...
- Publication number 20140266242
- Publication date Sep 18, 2014
- International Business Machines Corporation
- Stephen Peter Ayotte
- G01 - MEASURING TESTING
Information Patent Application
WIRE BONDING MACHINE AND METHOD FOR TESTING WIRE BOND CONNECTIONS
- Publication number 20140103096
- Publication date Apr 17, 2014
- Hanmin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEDGE BONDER AND A METHOD OF CLEANING A WEDGE BONDER
- Publication number 20130341377
- Publication date Dec 26, 2013
- Chi Wah CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD ASSESSMENT FOR WIRE BONDING
- Publication number 20130327812
- Publication date Dec 12, 2013
- Ming LI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON...
- Publication number 20120024089
- Publication date Feb 2, 2012
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jeremiah Couey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND BONDING APPARATUS
- Publication number 20110315743
- Publication date Dec 29, 2011
- SHINKAWA LTD.
- Yusuke MARUYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDU...
- Publication number 20110174865
- Publication date Jul 21, 2011
- KULICKE AND SOFFA INDUSTRIES, INC.
- Michael T. Deley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE LOOP AND METHOD OF FORMING THE WIRE LOOP
- Publication number 20100230809
- Publication date Sep 16, 2010
- KULICKE AND SOFFA INDUSTRIES, INC.
- Dodgie Reigh M. Calpito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDU...
- Publication number 20100181365
- Publication date Jul 22, 2010
- KULICKE AND SOFFA INDUSTRIES, INC.
- Michael T. Deley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire-bonding method for wire-bonding apparatus
- Publication number 20080102539
- Publication date May 1, 2008
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND AN INFORMATION MANAGEMENT SYSTEM THEREFOR
- Publication number 20080083996
- Publication date Apr 10, 2008
- Oki Electric Industry Co., Ltd.
- Isao Kudo
- G06 - COMPUTING CALCULATING COUNTING

using a computer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of calibrating an ultrasonic characteristic on a wire bondi...

Wire bonding apparatus

Wire bonding apparatus

Wire bonding apparatus

Force sensor in an ultrasonic wire bonding device

Method for bonding insulated coating wire, connection structure, me...

Wire bonding apparatus and manufacturing method for semiconductor a...

Full-automatic deep access ball bonding head device

Method of vertically vibrating a bonding arm

Method for calibrating wire clamp device

Ultrasonic vibration bonding apparatus

Systems and methods of operating wire bonding machines including cl...

On-bonder automatic overhang die optimization tool for wire bonding...

Detection of foreign particles during wire bonding

Screening methodology to eliminate wire sweep in bond and assembly...

Method and apparatus for detecting and removing defective integrate...

Mounting apparatus

Bonding device

On-bonder automatic overhang die optimization tool for wire bonding...

Wire bonding apparatus and method of manufacturing semiconductor de...

Wire-bonding apparatus and method of manufacturing semiconductor de...

Screening methodology to eliminate wire sweep in bond and assembly...

Wire spool system for a wire bonding apparatus

Bond pad assessment for wire bonding

Wedge bonder and a method of cleaning a wedge bonder

Method of manufacturing semiconductor device, and bonding apparatus

Method of teaching eyepoints for wire bonding and related semicondu...

Wire loop and method of forming the wire loop

Method of teaching eyepoints for wire bonding and related semicondu...

Semiconductor device and an information management system therefor

Patents Applicationslast 30 patents

METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...

BONDING APPARATUS, BONDING METHOD, AND COMPUTER READABLE STORAGE ME...

WIRE BONDING DEVICE, MAINTENANCE METHOD AND NON-TRANSITORY COMPUTER...

BUMP-FORMING DEVICE, BUMP-FORMING METHOD, AND NON-TRANSITORY COMPUT...

WIRE BONDING APPARATUS

METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...

WIRE BONDING STATE DETERMINATION METHOD AND WIRE BONDING STATE DETE...

METHOD FOR BONDING INSULATED COATING WIRE, CONNECTION STRUCTURE, ME...

WIRE BONDING APPARATUS

FULL-AUTOMATIC DEEP ACCESS BALL BONDING HEAD DEVICE

SYSTEMS AND METHODS OF OPERATING WIRE BONDING MACHINES INCLUDING CL...

DETECTION OF FOREIGN PARTICLES DURING WIRE BONDING

ON-BONDER AUTOMATIC OVERHANG DIE OPTIMIZATION TOOL FOR WIRE BONDING...

ULTRASONIC VIBRATION BONDING APPARATUS

Method For Producing Wire Bond Connection And Arrangement For Imple...

MOUNTING APPARATUS

ON-BONDER AUTOMATIC OVERHANG DIE OPTIMIZATION TOOL FOR WIRE BONDING...

WIRE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...

WIRE SPOOL SYSTEM FOR A WIRE BONDING APPARATUS

SCREENING METHODOLOGY TO ELIMINATE WIRE SWEEP IN BOND AND ASSEMBLY...

WIRE BONDING MACHINE AND METHOD FOR TESTING WIRE BOND CONNECTIONS

WEDGE BONDER AND A METHOD OF CLEANING A WEDGE BONDER

BOND PAD ASSESSMENT FOR WIRE BONDING

METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND BONDING APPARATUS

METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDU...

WIRE LOOP AND METHOD OF FORMING THE WIRE LOOP

METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDU...

Wire-bonding method for wire-bonding apparatus

SEMICONDUCTOR DEVICE AND AN INFORMATION MANAGEMENT SYSTEM THEREFOR