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H01L2224/75901

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75901using a computer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Mounting device and mounting method
- Patent number 12,154,811
- Issue date Nov 26, 2024
- Toray Engineering Co., Ltd.
- Yasushi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,136,604
- Issue date Nov 5, 2024
- Shinkawa Ltd.
- Hideharu Nihei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser bonding system and laser bonding apparatus
- Patent number 11,973,053
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Geun Woo Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting device
- Patent number 11,835,207
- Issue date Dec 5, 2023
- FUJI CORPORATION
- Kohei Sugihara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mounting device and mounting method
- Patent number 11,823,938
- Issue date Nov 21, 2023
- Toray Engineering Co., Ltd.
- Yasushi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Region-of-interest positioning for laser-assisted bonding
- Patent number 11,817,357
- Issue date Nov 14, 2023
- STATS ChipPAC Pte. Ltd.
- Wagno Alves Braganca
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Producing apparatus
- Patent number 11,784,158
- Issue date Oct 10, 2023
- GALLANT MICRO. MACHINING CO., LTD.
- Tun-Chih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus, manufacturing system, and semiconducto...
- Patent number 11,776,931
- Issue date Oct 3, 2023
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, control method and control device of semiconductor packa...
- Patent number 11,774,935
- Issue date Oct 3, 2023
- CAPCON LIMITED
- Hong Gang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parameter adjustment method of bonding apparatus and bonding system
- Patent number 11,721,596
- Issue date Aug 8, 2023
- Tokyo Electron Limited
- Norifumi Kohama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding method and wafer bonding apparatus
- Patent number 11,721,662
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Tai Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for embedding semiconductor devices
- Patent number 11,538,699
- Issue date Dec 27, 2022
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 11,521,950
- Issue date Dec 6, 2022
- Kioxia Corporation
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for bonding a chip to a substrate
- Patent number 11,476,228
- Issue date Oct 18, 2022
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Gari Arutinov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Batch processing oven and method
- Patent number 11,444,053
- Issue date Sep 13, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder reflow oven for batch processing
- Patent number 11,335,662
- Issue date May 17, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for reworking flip chip components
- Patent number 11,330,746
- Issue date May 10, 2022
- Raytheon Company
- James A. Robbins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device
- Patent number 11,262,056
- Issue date Mar 1, 2022
- FUJI CORPORATION
- Kohei Sugihara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 11,222,862
- Issue date Jan 11, 2022
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element bonding apparatus and semiconductor element b...
- Patent number 11,037,901
- Issue date Jun 15, 2021
- Toyota Jidosha Kabushiki Kaisha
- Hideyuki Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,985,132
- Issue date Apr 20, 2021
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Measurements of an integrated circuit chip and connected chip carri...
- Patent number 10,969,222
- Issue date Apr 6, 2021
- International Business Machines Corporation
- Elaine Cyr
- G01 - MEASURING TESTING
Information Patent Grant
Operating method for an ultrasonic wire bonder with active and pass...
- Patent number 10,960,488
- Issue date Mar 30, 2021
- Hesse GmbH
- Matthias Hunstig
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Object detection system
- Patent number 10,930,532
- Issue date Feb 23, 2021
- BPM Microsystems
- William H. White
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
System for adjusting relative positions between components of a bon...
- Patent number 10,882,298
- Issue date Jan 5, 2021
- ASM Technology Singapore Pte. Ltd.
- Shui Cheung Woo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for bonding wafers and bonding tool
- Patent number 10,872,873
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing soldered product
- Patent number 10,843,300
- Issue date Nov 24, 2020
- ORIGIN COMPANY, LIMITED
- Yukiko Hayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding alignment tool
- Patent number 10,847,490
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Tai Shih
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bonding system
- Patent number 10,840,213
- Issue date Nov 17, 2020
- Tokyo Electron Limited
- Masataka Matsunaga
- B32 - LAYERED PRODUCTS
Information Patent Grant
Stretching retention plate for electronic assemblies
- Patent number 10,825,714
- Issue date Nov 3, 2020
- Intel Corporation
- Daniel Chavez-Clemente
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POST-PLASMA CLEAN INFRARED IMAGE INSPECTION FOR OXIDELESS BONDING A...
- Publication number 20250006690
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Amram Eitan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD FOR DEPOSITING UNDERFILL MATERIAL
- Publication number 20240038716
- Publication date Feb 1, 2024
- Western Digital Technologies, Inc.
- Choo Par Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT DISPENSING ADJUSTMENT SYSTEM AND METHOD THEREOF
- Publication number 20230420406
- Publication date Dec 28, 2023
- KULICKE AND SOFFA HI-TECH CO., LTD.
- Lu-Min Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20230054378
- Publication date Feb 23, 2023
- KIOXIA Corporation
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD
- Publication number 20230011327
- Publication date Jan 12, 2023
- SATO HOLDINGS KABUSHIKI KAISHA
- Yoshimitsu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20220406747
- Publication date Dec 22, 2022
- SHINKAWA LTD.
- Hideharu NIHEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Region-of-Interest Positioning for Laser-Assisted Bonding
- Publication number 20220399236
- Publication date Dec 15, 2022
- STATS ChipPAC Pte Ltd.
- Wagno Alves Braganca
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC COMPONENT BONDING MACHINES, AND METHODS OF MEASURING A D...
- Publication number 20220384384
- Publication date Dec 1, 2022
- KULICKE AND SOFFA INDUSTRIES, INC.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCING APPARATUS AND PRE-BONDING DEVICE
- Publication number 20220122939
- Publication date Apr 21, 2022
- GALLANT MICRO. MACHINING CO., LTD.
- TUN-CHIH SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE
- Publication number 20220120419
- Publication date Apr 21, 2022
- FUJI CORPORATION
- Kohei SUGIHARA
- F21 - LIGHTING
Information Patent Application
LASER BONDING SYSTEM AND LASER BONDING APPARATUS
- Publication number 20220068871
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- Geun Woo KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR LASER BONDING OF FLIP CHIP
- Publication number 20220052019
- Publication date Feb 17, 2022
- PROTEC CO., LTD.
- YOUN SUNG KO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER BONDED DEVICES, LASER BONDING TOOLS, AND RELATED METHODS
- Publication number 20210398936
- Publication date Dec 23, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Hyeon Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PARAMETER ADJUSTMENT METHOD OF BONDING APPARATUS AND BONDING SYSTEM
- Publication number 20210327773
- Publication date Oct 21, 2021
- TOKYO ELECTRON LIMITED
- Norifumi Kohama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Actuator for a Bonding Head
- Publication number 20210272925
- Publication date Sep 2, 2021
- BESI Switzerland AG
- Markus Aebischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH PROCESSING OVEN AND METHOD
- Publication number 20210265301
- Publication date Aug 26, 2021
- Yield Engineering Systems, Inc.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20210082867
- Publication date Mar 18, 2021
- Kioxia Corporation
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS, MANUFACTURING SYSTEM, AND SEMICONDUCTO...
- Publication number 20210074670
- Publication date Mar 11, 2021
- Kioxia Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD AND WAFER BONDING APPARATUS
- Publication number 20210050324
- Publication date Feb 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Tai SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, CONTROL METHOD AND CONTROL DEVICE OF SEMICONDUCTOR PACKA...
- Publication number 20200241498
- Publication date Jul 30, 2020
- CAPCON LIMITED
- Hong Gang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT BONDING APPARATUS AND SEMICONDUCTOR ELEMENT B...
- Publication number 20200235071
- Publication date Jul 23, 2020
- Toyota Jidosha Kabushiki Kaisha
- Hideyuki MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE
- Publication number 20200208817
- Publication date Jul 2, 2020
- FUJI CORPORATION
- Kohei SUGIHARA
- G05 - CONTROLLING REGULATING
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20200051948
- Publication date Feb 13, 2020
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR IMPROVED DIE BONDING
- Publication number 20200006283
- Publication date Jan 2, 2020
- SKYWORKS SOLUTIONS, INC.
- José Manuel FLORES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING ALIGNMENT TOOL
- Publication number 20190378813
- Publication date Dec 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Tai SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20190348392
- Publication date Nov 14, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING WAFERS AND BONDING TOOL
- Publication number 20190148333
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND STORAGE MEDIUM
- Publication number 20180158796
- Publication date Jun 7, 2018
- TOKYO ELECTRON LIMITED
- Yoshitaka OTSUKA
- B32 - LAYERED PRODUCTS
Information Patent Application
MICRO-SELECTIVE SINTERING LASER SYSTEMS AND METHODS THEREOF
- Publication number 20180065186
- Publication date Mar 8, 2018
- Board of Regents, The University of Texas System
- Michael A. Cullinan
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR MEASURING PHYSICAL CHARACTERISTICS OF SEMIC...
- Publication number 20180038806
- Publication date Feb 8, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Deepak Sood
- G01 - MEASURING TESTING

using a computer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Mounting device and mounting method

Bonding apparatus and bonding method

Laser bonding system and laser bonding apparatus

Mounting device

Mounting device and mounting method

Region-of-interest positioning for laser-assisted bonding

Producing apparatus

Substrate bonding apparatus, manufacturing system, and semiconducto...

Apparatus, control method and control device of semiconductor packa...

Parameter adjustment method of bonding apparatus and bonding system

Wafer bonding method and wafer bonding apparatus

Method and apparatus for embedding semiconductor devices

Semiconductor manufacturing apparatus and method of manufacturing s...

Method and system for bonding a chip to a substrate

Batch processing oven and method

Solder reflow oven for batch processing

Device and method for reworking flip chip components

Mounting device

High speed handling of ultra-small chips by selective laser bonding...

Semiconductor element bonding apparatus and semiconductor element b...

Bonding apparatus, bonding system, bonding method and storage medium

Measurements of an integrated circuit chip and connected chip carri...

Operating method for an ultrasonic wire bonder with active and pass...

Object detection system

System for adjusting relative positions between components of a bon...

Method for bonding wafers and bonding tool

Method for producing soldered product

Bonding alignment tool

Bonding system

Stretching retention plate for electronic assemblies

Patents Applicationslast 30 patents

POST-PLASMA CLEAN INFRARED IMAGE INSPECTION FOR OXIDELESS BONDING A...

SYSTEM AND METHOD FOR DEPOSITING UNDERFILL MATERIAL

INTELLIGENT DISPENSING ADJUSTMENT SYSTEM AND METHOD THEREOF

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD

BONDING APPARATUS AND BONDING METHOD

Region-of-Interest Positioning for Laser-Assisted Bonding

ELECTRONIC COMPONENT BONDING MACHINES, AND METHODS OF MEASURING A D...

PRODUCING APPARATUS AND PRE-BONDING DEVICE

MOUNTING DEVICE

LASER BONDING SYSTEM AND LASER BONDING APPARATUS

SYSTEM FOR LASER BONDING OF FLIP CHIP

LASER BONDED DEVICES, LASER BONDING TOOLS, AND RELATED METHODS

PARAMETER ADJUSTMENT METHOD OF BONDING APPARATUS AND BONDING SYSTEM

Actuator for a Bonding Head

BATCH PROCESSING OVEN AND METHOD

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

SUBSTRATE BONDING APPARATUS, MANUFACTURING SYSTEM, AND SEMICONDUCTO...

WAFER BONDING METHOD AND WAFER BONDING APPARATUS

APPARATUS, CONTROL METHOD AND CONTROL DEVICE OF SEMICONDUCTOR PACKA...

SEMICONDUCTOR ELEMENT BONDING APPARATUS AND SEMICONDUCTOR ELEMENT B...

MOUNTING DEVICE

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...

METHODS FOR IMPROVED DIE BONDING

BONDING ALIGNMENT TOOL

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...

METHOD FOR BONDING WAFERS AND BONDING TOOL

BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND STORAGE MEDIUM

MICRO-SELECTIVE SINTERING LASER SYSTEMS AND METHODS THEREOF

SYSTEMS AND METHODS FOR MEASURING PHYSICAL CHARACTERISTICS OF SEMIC...