using a laser or a focused ion beam [FIB]

Industry

CPC
H01L2224/1163

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1163using a laser or a focused ion beam [FIB]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electroless-catalyst doped-mold materials for integrated-circuit di...
- Patent number 11,227,849
- Issue date Jan 18, 2022
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing comprising a semiconductor body and a method for producing...
- Patent number 10,903,406
- Issue date Jan 26, 2021
- OSRAM OLED GmbH
- Martin Unterburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor devices including a redistr...
- Patent number 10,777,523
- Issue date Sep 15, 2020
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including conductive pillars
- Patent number 10,276,529
- Issue date Apr 30, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowires for pillar interconnects
- Patent number 10,068,864
- Issue date Sep 4, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive materials on semiconductor devices, a...
- Patent number 9,768,134
- Issue date Sep 19, 2017
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and method for making the same
- Patent number 9,117,697
- Issue date Aug 25, 2015
- Advanced Semiconductor Engineering, Inc.
- Chun-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser ablation tape for solder interconnect formation
- Patent number 8,969,134
- Issue date Mar 3, 2015
- Intel Corporation
- Xavier F. Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and method for fabricating the same
- Patent number 8,877,323
- Issue date Nov 4, 2014
- Himax Technologies Limited
- Tsung-Chieh Chang
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...
- Publication number 20240105670
- Publication date Mar 28, 2024
- CYNTEC CO., LTD.
- Chi-Hung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURE OF ELECTRONIC CHIPS
- Publication number 20220375840
- Publication date Nov 24, 2022
- STMicroelectronics (Tours) SAS
- Olivier ORY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOUSING COMPRISING A SEMICONDUCTOR BODY AND A METHOD FOR PRODUCING...
- Publication number 20210104653
- Publication date Apr 8, 2021
- OSRAM OLED GmbH
- Martin Unterburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS-CATALYST DOPED-MOLD MATERIALS FOR INTEGRATED-CIRCUIT DI...
- Publication number 20210091030
- Publication date Mar 25, 2021
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTR...
- Publication number 20190252338
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A COMPONENT AND COMPONENT
- Publication number 20180219145
- Publication date Aug 2, 2018
- Osram Opto Semiconductors GmbH
- Martin Unterburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCO...
- Publication number 20180082965
- Publication date Mar 22, 2018
- SUSS MicroTec Photonic Systems Inc.
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCO...
- Publication number 20180076160
- Publication date Mar 15, 2018
- SUSS MicroTec Photonic Systems Inc.
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE PILLARS
- Publication number 20170358547
- Publication date Dec 14, 2017
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRES FOR PILLAR INTERCONNECTS
- Publication number 20170179061
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCO...
- Publication number 20170117241
- Publication date Apr 27, 2017
- SUSS MicroTec Photonic Systems Inc.
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact bumps methods of making contact bumps
- Publication number 20160233188
- Publication date Aug 11, 2016
- SMARTRAC TECHNOLOGY GmbH
- Frank Kriebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...
- Publication number 20150132865
- Publication date May 14, 2015
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSUL...
- Publication number 20150021764
- Publication date Jan 22, 2015
- Amkor Technology, Inc.
- JongSik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD FOR MAKING THE SAME
- Publication number 20140367837
- Publication date Dec 18, 2014
- Chun-Che LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structures and Method for Fabricating the Same
- Publication number 20120135201
- Publication date May 31, 2012
- HIMAX TECHNOLOGIES LIMITED
- Tsung-Chieh Chang
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...
- Publication number 20090186425
- Publication date Jul 23, 2009
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming bumps, semiconductor device and method for manuf...
- Publication number 20050161814
- Publication date Jul 28, 2005
- FUJITSU LIMITED
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS

using a laser or a focused ion beam [FIB]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electroless-catalyst doped-mold materials for integrated-circuit di...

Housing comprising a semiconductor body and a method for producing...

Semiconductor devices and semiconductor devices including a redistr...

Semiconductor devices including conductive pillars

Nanowires for pillar interconnects

Methods of forming conductive materials on semiconductor devices, a...

Semiconductor substrate and method for making the same

Laser ablation tape for solder interconnect formation

Semiconductor structures and method for fabricating the same

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...

MANUFACTURE OF ELECTRONIC CHIPS

HOUSING COMPRISING A SEMICONDUCTOR BODY AND A METHOD FOR PRODUCING...

ELECTROLESS-CATALYST DOPED-MOLD MATERIALS FOR INTEGRATED-CIRCUIT DI...

SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTR...

METHOD FOR PRODUCING A COMPONENT AND COMPONENT

MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCO...

MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCO...

SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE PILLARS

NANOWIRES FOR PILLAR INTERCONNECTS

MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCO...

Contact bumps methods of making contact bumps

METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSUL...

SEMICONDUCTOR SUBSTRATE AND METHOD FOR MAKING THE SAME

Semiconductor Structures and Method for Fabricating the Same

METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...

Method for forming bumps, semiconductor device and method for manuf...