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H01L2224/83224

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83224using a laser

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method and structure for die bonding using energy beam
- Patent number 12,154,885
- Issue date Nov 26, 2024
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for repairing a light-emitting device and a method for manuf...
- Patent number 11,916,041
- Issue date Feb 27, 2024
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus, and method of manufacturing...
- Patent number 11,823,924
- Issue date Nov 21, 2023
- Kioxia Corporation
- Aoi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric-dielectric and metallization bonding via plasma activati...
- Patent number 11,735,689
- Issue date Aug 22, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for die bonding using energy beam
- Patent number 11,728,310
- Issue date Aug 15, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor package structure
- Patent number 11,652,081
- Issue date May 16, 2023
- Advanced Semiconductor Engineering, Inc.
- Yi Dao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor having double-sided substrate
- Patent number 11,631,627
- Issue date Apr 18, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Employing deformable contacts and pre-applied underfill for bonding...
- Patent number 11,575,069
- Issue date Feb 7, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- G02 - OPTICS
Information Patent Grant
Systems for direct transfer of semiconductor device die
- Patent number 11,562,990
- Issue date Jan 24, 2023
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curing pre-applied and plasma-etched underfill via a laser
- Patent number 11,563,142
- Issue date Jan 24, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively bonding light-emitting devices via a pulsed laser
- Patent number 11,557,692
- Issue date Jan 17, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for reel-to-reel laser reflow
- Patent number 11,515,287
- Issue date Nov 29, 2022
- LASERSSEL CO., LTD.
- Byung Rock Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct transfer of semiconductor devices from a substrate
- Patent number 11,515,293
- Issue date Nov 29, 2022
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transfer of semiconductor devices onto glass substrates
- Patent number 11,488,940
- Issue date Nov 1, 2022
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro LED display and manufacturing method with conductive film
- Patent number 11,417,627
- Issue date Aug 16, 2022
- Samsung Electronics Co., Ltd.
- Jamyeong Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and its process for curing post-applied underfill ma...
- Patent number 11,404,600
- Issue date Aug 2, 2022
- Meta Platforms Technologies, LLC
- Jeb Wu
- G02 - OPTICS
Information Patent Grant
Dielectric-dielectric and metallization bonding via plasma activati...
- Patent number 11,374,148
- Issue date Jun 28, 2022
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for die bonding using energy beam
- Patent number 11,362,060
- Issue date Jun 14, 2022
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for reel-to-reel laser reflow
- Patent number 11,257,783
- Issue date Feb 22, 2022
- LASERSSEL CO., LTD.
- Byung Rock Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip bonding method and bonding device
- Patent number 11,239,198
- Issue date Feb 1, 2022
- BOE Technology Group Co., Ltd.
- Lili Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improved transfer of semiconductor die
- Patent number 11,152,339
- Issue date Oct 19, 2021
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser bonding method
- Patent number 11,107,790
- Issue date Aug 31, 2021
- Electronics and Telecommunications Research Institute
- Kwang-Seong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module comprising a housing which is formed in levels
- Patent number 10,991,643
- Issue date Apr 27, 2021
- Robert Bosch GmbH
- Georg Hejtmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 10,971,471
- Issue date Apr 6, 2021
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,910,354
- Issue date Feb 2, 2021
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-selective sintering laser systems and methods thereof
- Patent number 10,722,947
- Issue date Jul 28, 2020
- Board of Regents, The University of Texas System
- Michael A. Cullinan
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Curing a heat-curable material in an embedded curing zone
- Patent number 10,717,236
- Issue date Jul 21, 2020
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Jeroen van den Brand
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of selectively transferring LED die to a backplane using hei...
- Patent number 10,714,464
- Issue date Jul 14, 2020
- GLO AB
- Anusha Pokhriyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED backplane having planar bonding surfaces and method of making t...
- Patent number 10,707,190
- Issue date Jul 7, 2020
- GLO AB
- Tsun Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package
- Patent number 10,636,761
- Issue date Apr 28, 2020
- Electronics and Telecommunications Reearch Institute
- Kwang-Seong Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER SOLDERING METHOD USING LASER
- Publication number 20240408687
- Publication date Dec 12, 2024
- S.S.P. INC.
- Heui Jong JU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE...
- Publication number 20240376348
- Publication date Nov 14, 2024
- TORAY INDUSTRIES, INC.
- Yukari ARIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
- Publication number 20240194629
- Publication date Jun 13, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240162402
- Publication date May 16, 2024
- AUO Corporation
- Chia-Hui Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20230230953
- Publication date Jul 20, 2023
- Advanced Semiconductor Engineering, Inc.
- Yi Dao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230040019
- Publication date Feb 9, 2023
- Fuji Electric Co., Ltd.
- Yuji IIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REPAIRING A DISPLAY PANEL AND REPAIRED DISPLAY PANEL
- Publication number 20220399317
- Publication date Dec 15, 2022
- Seoul Semiconductor Co., Ltd.
- Woo Gun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS
- Publication number 20220399304
- Publication date Dec 15, 2022
- Fuji Electric Co., Ltd.
- Narumi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRIC DEVICE
- Publication number 20220384674
- Publication date Dec 1, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jiho JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF DISPLAY DEVICE AND HOLDING SUBSTRATE
- Publication number 20220375895
- Publication date Nov 24, 2022
- Japan Display Inc.
- Keisuke Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20220336406
- Publication date Oct 20, 2022
- Advanced Semiconductor Engineering, Inc.
- Yi Dao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS, AND METHOD OF MANUFACTURING...
- Publication number 20220285181
- Publication date Sep 8, 2022
- KIOXIA Corporation
- Aoi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REPAIRING A LIGHT-EMITTING DEVICE AND A METHOD FOR MANUF...
- Publication number 20220181293
- Publication date Jun 9, 2022
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BONDING METHOD AND A SEMICONDUCTOR PACKAGE INCLUDING A BONDIN...
- Publication number 20210358885
- Publication date Nov 18, 2021
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang-Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR HAVING DOUBLE-SIDED SUBSTRATE
- Publication number 20210335691
- Publication date Oct 28, 2021
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RECONSTRUCTED WAFER TO WAFER BONDING USING A PERMANENT BOND WITH LA...
- Publication number 20210183803
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING METHOD AND BONDING DEVICE
- Publication number 20210159208
- Publication date May 27, 2021
- BOE TECHNOLOGY GROUP CO., LTD.
- Lili WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED DISPLAY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210066243
- Publication date Mar 4, 2021
- Samsung Electronics Co., Ltd.
- Byunghoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED DISPLAY AND MANUFACTURING METHOD THEREOF
- Publication number 20210050336
- Publication date Feb 18, 2021
- Samsung Electronics Co., Ltd.
- Jamyeong KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURING PRE-APPLIED AND PLASMA-ETCHED UNDERFILL VIA A LASER
- Publication number 20200395519
- Publication date Dec 17, 2020
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVELY BONDING LIGHT-EMITTING DEVICES VIA A PULSED LASER
- Publication number 20200395521
- Publication date Dec 17, 2020
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...
- Publication number 20200395520
- Publication date Dec 17, 2020
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES F...
- Publication number 20200251453
- Publication date Aug 6, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Application
APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE
- Publication number 20200243491
- Publication date Jul 30, 2020
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR DIE BONDING USING ENERGY BEAM
- Publication number 20200243478
- Publication date Jul 30, 2020
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE ON GLASS SUBSTRATE
- Publication number 20200235081
- Publication date Jul 23, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20200212001
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT DEVICE AND CONTROL METHOD FOR JOINT DEVICE
- Publication number 20200176414
- Publication date Jun 4, 2020
- JTEKT Corporation
- Koichiro MATSUHISA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Direct Transfer of Semiconductor Devices
- Publication number 20200168587
- Publication date May 28, 2020
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BONDING METHOD
- Publication number 20200075535
- Publication date Mar 5, 2020
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang-Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS

using a laser

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and structure for die bonding using energy beam

Method for repairing a light-emitting device and a method for manuf...

Semiconductor manufacturing apparatus, and method of manufacturing...

Dielectric-dielectric and metallization bonding via plasma activati...

Method and structure for die bonding using energy beam

Method for manufacturing semiconductor package structure

Method of manufacturing semiconductor having double-sided substrate

Employing deformable contacts and pre-applied underfill for bonding...

Systems for direct transfer of semiconductor device die

Curing pre-applied and plasma-etched underfill via a laser

Selectively bonding light-emitting devices via a pulsed laser

Device and method for reel-to-reel laser reflow

Direct transfer of semiconductor devices from a substrate

Method for transfer of semiconductor devices onto glass substrates

Micro LED display and manufacturing method with conductive film

Display device and its process for curing post-applied underfill ma...

Dielectric-dielectric and metallization bonding via plasma activati...

Method and structure for die bonding using energy beam

Device and method for reel-to-reel laser reflow

Chip bonding method and bonding device

Method for improved transfer of semiconductor die

Laser bonding method

Power module comprising a housing which is formed in levels

Methods and systems for manufacturing semiconductor devices

Apparatus for direct transfer of semiconductor device die

Micro-selective sintering laser systems and methods thereof

Curing a heat-curable material in an embedded curing zone

Method of selectively transferring LED die to a backplane using hei...

LED backplane having planar bonding surfaces and method of making t...

Method of fabricating a semiconductor package

Patents Applicationslast 30 patents

SOLDER SOLDERING METHOD USING LASER

ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE...

Semiconductor Device and Method of Making a Semiconductor Package w...

DISPLAY DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF REPAIRING A DISPLAY PANEL AND REPAIRED DISPLAY PANEL

ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS

METHOD OF MANUFACTURING ELECTRIC DEVICE

MANUFACTURING METHOD OF DISPLAY DEVICE AND HOLDING SUBSTRATE

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR MANUFACTURING APPARATUS, AND METHOD OF MANUFACTURING...

METHOD FOR REPAIRING A LIGHT-EMITTING DEVICE AND A METHOD FOR MANUF...

LASER BONDING METHOD AND A SEMICONDUCTOR PACKAGE INCLUDING A BONDIN...

METHOD OF MANUFACTURING SEMICONDUCTOR HAVING DOUBLE-SIDED SUBSTRATE

RECONSTRUCTED WAFER TO WAFER BONDING USING A PERMANENT BOND WITH LA...

CHIP BONDING METHOD AND BONDING DEVICE

MICRO LED DISPLAY AND METHOD FOR MANUFACTURING THE SAME

MICRO LED DISPLAY AND MANUFACTURING METHOD THEREOF

CURING PRE-APPLIED AND PLASMA-ETCHED UNDERFILL VIA A LASER

SELECTIVELY BONDING LIGHT-EMITTING DEVICES VIA A PULSED LASER

DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...

APPARATUS AND METHOD FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES F...

APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE

METHOD AND STRUCTURE FOR DIE BONDING USING ENERGY BEAM

SEMICONDUCTOR DEVICE ON GLASS SUBSTRATE

METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES

JOINT DEVICE AND CONTROL METHOD FOR JOINT DEVICE

Apparatus and Method for Direct Transfer of Semiconductor Devices

LASER BONDING METHOD