using a layer connector

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83using a layer connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Pressing group for a sintering press for sintering electronic compo...
- Patent number 12,257,801
- Issue date Mar 25, 2025
- AMX—AUTOMATRIX S.R.L.
- Nicola Schivalocchi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of manufacturing substrate layered body and layered body
- Patent number 12,261,143
- Issue date Mar 25, 2025
- Mitsui Chemicals, Inc.
- Yasuhisa Kayaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joined structure, joining method, and joining material
- Patent number 12,257,650
- Issue date Mar 25, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takahiro Kumakawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device and method for fabricating a semiconductor device
- Patent number 12,261,144
- Issue date Mar 25, 2025
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with stacked semiconductor dies
- Patent number 12,255,155
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 12,255,168
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,255,116
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,249,578
- Issue date Mar 11, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,249,591
- Issue date Mar 11, 2025
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,249,531
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device including an optical path structure aligned to an o...
- Patent number 12,248,178
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for manufacturing display device and method for manufactu...
- Patent number 12,243,759
- Issue date Mar 4, 2025
- LG Electronics Inc.
- Kisu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device with film isolated power stack
- Patent number 12,243,809
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,243,843
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,243,765
- Issue date Mar 4, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,243,844
- Issue date Mar 4, 2025
- Samsung Display Co., Ltd.
- Byoungyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED, and manufacturing method therefor
- Patent number 12,243,861
- Issue date Mar 4, 2025
- LG Electronics Inc.
- Dohan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuits including micropatterns and using partial curing to adhere...
- Patent number 12,237,292
- Issue date Feb 25, 2025
- 3M Innovative Properties Company
- Teresa M. Goeddel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate, tiled display panel and display device
- Patent number 12,237,316
- Issue date Feb 25, 2025
- BOE Technology Group Co., Ltd.
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic structure including a support element
- Patent number 12,237,289
- Issue date Feb 25, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy structure of stacked and bonded semiconductor device
- Patent number 12,237,291
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with bridge chiplets
- Patent number 12,238,872
- Issue date Feb 25, 2025
- Advanced Micro Devices, Inc.
- Robert N. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,237,240
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power module package structures
- Patent number 12,230,601
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 12,230,606
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro-LED, and manufacturing method therefor
- Patent number 12,230,617
- Issue date Feb 18, 2025
- LG Electronics Inc.
- Bongchu Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package, and semiconductor pa...
- Patent number 12,230,580
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed hybrid bonding structures and methods of forming the same
- Patent number 12,224,261
- Issue date Feb 11, 2025
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible hybrid electronic system processing method and flexible hy...
- Patent number 12,224,246
- Issue date Feb 11, 2025
- Peking University
- Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105169
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Leu-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE HAVING HEAT DISSIPATION STRUCTURE AND MANUFACTURING ME...
- Publication number 20250105087
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Chunyan RUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOTSPOT-FREE SEMICONDUCTOR DEVICE CHIPS
- Publication number 20250105089
- Publication date Mar 27, 2025
- Diamond Foundry Inc.
- Jeroen Van Duren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20250105086
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yen Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ONE OR MORE SOLDER JOINTS ELECTRICA...
- Publication number 20250105103
- Publication date Mar 27, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250107298
- Publication date Mar 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Bonding
- Publication number 20250105196
- Publication date Mar 27, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105077
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250105197
- Publication date Mar 27, 2025
- Mitsubishi Electric Corporation
- Tatsuto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP
- Publication number 20250105198
- Publication date Mar 27, 2025
- NEXPERIA B.V.
- Heiming Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF PACKAGING SEMICONDUCT...
- Publication number 20250096008
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT CLIP FOR VERTICALLY STACKED DIE ARRANGEMENT
- Publication number 20250096082
- Publication date Mar 20, 2025
- INFINEON TECHNOLOGIES AG
- Mei Yih Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURI...
- Publication number 20250096183
- Publication date Mar 20, 2025
- Renesas Electronics America Inc.
- Martin Ashley VAGUES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ADHESIVE COMPOSITION FOR OPTICAL IRRADIATIO...
- Publication number 20250092293
- Publication date Mar 20, 2025
- NISSAN CHEMICAL CORPORATION
- Hiroshi OGINO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250096107
- Publication date Mar 20, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-ON-INSULATOR SUBSTRATE INCLUDING A PRE-NOTCHED FILM AND METHOD...
- Publication number 20250096035
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Chiang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MARKING SEMICONDUCTOR PACKAGE
- Publication number 20250096148
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Kanggyune LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20250096009
- Publication date Mar 20, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAM LAMINATE ISOLATION SUBSTRATE
- Publication number 20250096034
- Publication date Mar 20, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Chang-Yen KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS
- Publication number 20250096168
- Publication date Mar 20, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE ADHESIVE
- Publication number 20250084286
- Publication date Mar 13, 2025
- OSAKA SODA CO., LTD.
- Takamichi MORI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF SURFACE MODIFICATION FOR WAFER BONDING
- Publication number 20250087628
- Publication date Mar 13, 2025
- TOKYO ELECTRON LIMITED
- Soo Doo CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250087549
- Publication date Mar 13, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Yu Jin JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250087618
- Publication date Mar 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Shih-Chieh TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE
- Publication number 20250087648
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Fine Pitch Organic Inte...
- Publication number 20250087499
- Publication date Mar 13, 2025
- STATS ChipPAC Pte Ltd.
- KiRak SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
- Publication number 20250087553
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR HIGH STRENGTH ASYMMETRIC DIELECTRIC IN H...
- Publication number 20250079357
- Publication date Mar 6, 2025
- Applied Materials, Inc.
- Tyler Sherwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES FOR EFFICIENT HEAT DISSIPATION
- Publication number 20250079258
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Woochan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
- Publication number 20250079414
- Publication date Mar 6, 2025
- Universal Global Technology (Kunshan) Co., Ltd.
- KUO-HSIEN LIAO
- H01 - BASIC ELECTRIC ELEMENTS

using a layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pressing group for a sintering press for sintering electronic compo...

Method of manufacturing substrate layered body and layered body

Joined structure, joining method, and joining material

Semiconductor device and method for fabricating a semiconductor device

Package structure with stacked semiconductor dies

Semiconductor packages with an intermetallic layer

Electronic device with multi-layer contact and system

Semiconductor structure and manufacturing method thereof

Semiconductor package structure and method for manufacturing the same

Display device and method of manufacturing the same

Method for forming semiconductor structure

Packaged device including an optical path structure aligned to an o...

Substrate for manufacturing display device and method for manufactu...

Packaged electronic device with film isolated power stack

Integrated circuit package and method of forming same

3D semiconductor device and structure with metal layers and memory...

Display device and method of manufacturing the same

Display device using micro LED, and manufacturing method therefor

Circuits including micropatterns and using partial curing to adhere...

Display substrate, tiled display panel and display device

Flexible electronic structure including a support element

Dummy structure of stacked and bonded semiconductor device

Circuit board with bridge chiplets

Semiconductor package and method of manufacturing semiconductor pac...

High power module package structures

Semiconductor package and related methods

Display device using micro-LED, and manufacturing method therefor

Method of manufacturing semiconductor package, and semiconductor pa...

Mixed hybrid bonding structures and methods of forming the same

Flexible hybrid electronic system processing method and flexible hy...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE HAVING HEAT DISSIPATION STRUCTURE AND MANUFACTURING ME...

HOTSPOT-FREE SEMICONDUCTOR DEVICE CHIPS

Integrated Circuit Packages and Methods of Forming the Same

SEMICONDUCTOR PACKAGE INCLUDING ONE OR MORE SOLDER JOINTS ELECTRICA...

PACKAGE STRUCTURE

Semiconductor Die Bonding

PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

CLIP

PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF PACKAGING SEMICONDUCT...

INTERCONNECT CLIP FOR VERTICALLY STACKED DIE ARRANGEMENT

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURI...

METHOD FOR PRODUCING AN ADHESIVE COMPOSITION FOR OPTICAL IRRADIATIO...

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

FILM-ON-INSULATOR SUBSTRATE INCLUDING A PRE-NOTCHED FILM AND METHOD...

METHOD OF MARKING SEMICONDUCTOR PACKAGE

LOW COST PACKAGE WARPAGE SOLUTION

DAM LAMINATE ISOLATION SUBSTRATE

NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS

ELECTROCONDUCTIVE ADHESIVE

METHOD OF SURFACE MODIFICATION FOR WAFER BONDING

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

PACKAGE STRUCTURE

METHOD FOR FORMING PACKAGE STRUCTURE

Semiconductor Device and Method of Making a Fine Pitch Organic Inte...

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

METHODS AND STRUCTURES FOR HIGH STRENGTH ASYMMETRIC DIELECTRIC IN H...

PACKAGE STRUCTURES FOR EFFICIENT HEAT DISSIPATION

ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME