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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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last 30 patents
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Patent Grant
Chip package and manufacturing method thereof
Patent number
12,322,705
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chuei-Tang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package using a coreless signal distribution structure
Patent number
12,322,731
Issue date
Jun 3, 2025
Amkor Technology Singapore Holding Pte Ltd.
Do Hyung Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming microelectromechanical s...
Patent number
12,319,564
Issue date
Jun 3, 2025
STATS ChipPAC Pte. Ltd.
Yaojian Lin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Deposit levelling
Patent number
12,319,049
Issue date
Jun 3, 2025
ASMPT SMT SINGAPORE PTE. LTD.
Mark Alfred Whitmore
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die attached leveling control by metal stopper bumps
Patent number
12,322,722
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Jhih Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing die stack structure
Patent number
12,322,728
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ching-Jung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of manufacturing the same
Patent number
12,322,691
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chuei-Tang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting device reflective bank structure
Patent number
12,322,738
Issue date
Jun 3, 2025
Apple Inc.
Kapil V. Sakariya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Switching device and electronic circuit
Patent number
12,316,307
Issue date
May 27, 2025
Rohm Co., Ltd.
Masashi Hayashiguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Storage layers for wafer bonding
Patent number
12,315,837
Issue date
May 27, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
De-Yang Chiou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding apparatus and bonding method
Patent number
12,308,294
Issue date
May 20, 2025
Tokyo Electron Limited
Tetsuya Maki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing display device and apparatus for manufactu...
Patent number
12,308,259
Issue date
May 20, 2025
Samsung Display Co., Ltd.
Dong Woo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including semiconductor chip having power tran...
Patent number
12,308,356
Issue date
May 20, 2025
Renesas Electronics Corporation
Toshiyuki Hata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device manufacturing method and molding press machine
Patent number
12,308,260
Issue date
May 20, 2025
Mitsubishi Electric Corporation
Kiyohiro Uchida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light-emitting device, manufacturing method thereof and display mod...
Patent number
12,300,772
Issue date
May 13, 2025
Epistar Corporation
Min-Hsun Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
DBI to SI bonding for simplified handle wafer
Patent number
12,300,662
Issue date
May 13, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Chandrasekhar Mandalapu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of fabricating the same
Patent number
12,300,667
Issue date
May 13, 2025
Samsung Electronics Co., Ltd.
YeongBeom Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solid metal foam thermal interface material
Patent number
12,300,567
Issue date
May 13, 2025
Indium Corporation
Ross B. Berntson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder material
Patent number
12,296,409
Issue date
May 13, 2025
Fuji Electric Co., Ltd.
Hirohiko Watanabe
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Display device having connection unit
Patent number
12,300,596
Issue date
May 13, 2025
Samsung Display Co., Ltd.
Myongsoo Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication method for package structure
Patent number
12,300,511
Issue date
May 13, 2025
University of Electronic Science and Technology of China
Xianming Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a bonded semiconductor structure
Patent number
12,300,660
Issue date
May 13, 2025
Taiwan Semiconductor Manufacturing Company Ltd.
Jen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods of forming same
Patent number
12,293,991
Issue date
May 6, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for packaging stacking flip chip
Patent number
12,293,984
Issue date
May 6, 2025
Hebei Beixin Semiconductor Technology Co., Ltd.
Honglei Ran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
12,288,739
Issue date
Apr 29, 2025
Rohm Co., Ltd.
Motoharu Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adhesive composition for semiconductor circuit connection, adhesive...
Patent number
12,286,564
Issue date
Apr 29, 2025
LG Chem, Ltd.
Youngsam Kim
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Display device using micro LED, and method for manufacturing same
Patent number
12,289,934
Issue date
Apr 29, 2025
LG Electronics Inc.
Hwanjoon Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing laminate
Patent number
12,288,768
Issue date
Apr 29, 2025
Lintec Corporation
Isao Ichikawa
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Methods of operating die attach systems
Patent number
12,288,711
Issue date
Apr 29, 2025
Assembleon B.V.
Alain De Bock
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages
Patent number
12,283,555
Issue date
Apr 22, 2025
Analog Devices International Unlimited Company
Bilge Bayrakci
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
Publication number
20250183217
Publication date
Jun 5, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20250183110
Publication date
Jun 5, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250183224
Publication date
Jun 5, 2025
Samsung Electronics Co., Ltd.
JIN-WOO PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER MICROPARTICLE DISPERSION
Publication number
20250183215
Publication date
Jun 5, 2025
KAO CORPORATION
Takaaki EYAMA
B22 - CASTING POWDER METALLURGY
Information
Patent Application
IC CHIP MOUNTING APPARATUS AND IC CHIP MOUNTING METHOD
Publication number
20250183223
Publication date
Jun 5, 2025
Sato Holdings Kabushiki Kaisha
Yoshimitsu MAEDA
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SEMICONDUCTOR DEVICE AND ELECTRIC POWER CONVERSION DEVICE
Publication number
20250174503
Publication date
May 29, 2025
Minebea Power Semiconductor Device Inc.
Norio NAKAZATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRO LED ARRAY ELECTRONIC DEVICE AND ITS TRANSFER METHOD
Publication number
20250176343
Publication date
May 29, 2025
Seoul National University R&DB Foundation
Yong Taek HONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
Publication number
20250176105
Publication date
May 29, 2025
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE WITH STACKED SEMICONDUCTOR DIES
Publication number
20250174578
Publication date
May 29, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Chao Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP M...
Publication number
20250174555
Publication date
May 29, 2025
Samsung Electronics Co., Ltd.
Jing Cheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGES FORMED USING RDL-LAST PROCESS
Publication number
20250167173
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
Publication number
20250167161
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Jin Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20250167159
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER TRANSFER OF MICROELECTRONIC DEVICE AND ASSOCIATED CONDUCTIVE PAD
Publication number
20250167170
Publication date
May 22, 2025
COHERENT LASERSYSTEMS GMBH & CO. KG
Muhammad FATAHILAH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer Level Integration of Passive Devices
Publication number
20250167176
Publication date
May 22, 2025
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
Publication number
20250167061
Publication date
May 22, 2025
Samsung Electronics Co., Ltd.
Jinwoo Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
Publication number
20250160096
Publication date
May 15, 2025
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
Publication number
20250157985
Publication date
May 15, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISCRETE SEMICONDUCTOR DEVICE PACKAGE WITH LEAD FRAME CLIP
Publication number
20250157893
Publication date
May 15, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Jie CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE
Publication number
20250160095
Publication date
May 15, 2025
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FILM-LIKE ADHESIVE AND METHOD FOR PRODUCING SAME, INTEGRATED DICING...
Publication number
20250157976
Publication date
May 15, 2025
Resonac Corporation
Tomoyo KANEKO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...
Publication number
20250157971
Publication date
May 15, 2025
Institute of Semiconductors, Guangdong Academy of Sciences
Chuan HU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Publication number
20250157975
Publication date
May 15, 2025
NITTO DENKO CORPORATION
Tsubasa OMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D-IC FOR RF APPLICATIONS
Publication number
20250157988
Publication date
May 15, 2025
INFINEON TECHNOLOGIES AG
Hans Taddiken
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING RADIO-FREQUENCY MULTI-LAYER CIRCUITS ON FUSED...
Publication number
20250157954
Publication date
May 15, 2025
GE AVIATION SYSTEMS LIMITED
Robert James MacDonald
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
Publication number
20250149399
Publication date
May 8, 2025
MITSUBISHI ELECTRIC CORPORATION
Junji FUJINO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250149518
Publication date
May 8, 2025
Samsung Electronics Co., Ltd.
Yejin LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY SUBSTRATE, TILED DISPLAY PANEL AND DISPLAY DEVICE
Publication number
20250149522
Publication date
May 8, 2025
BOE TECHNOLOGY GROUP CO., LTD.
Wei Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20250149413
Publication date
May 8, 2025
MITSUBISHI ELECTRIC CORPORATION
Takayuki YAMADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
Publication number
20250151421
Publication date
May 8, 2025
UTAC Headquarters Pte. Ltd.
Jeffrey Punzalan
H01 - BASIC ELECTRIC ELEMENTS