using a layer connector

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CPC
H01L2224/83

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83using a layer connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 12,322,705
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 12,322,731
- Issue date Jun 3, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 12,319,564
- Issue date Jun 3, 2025
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Deposit levelling
- Patent number 12,319,049
- Issue date Jun 3, 2025
- ASMPT SMT SINGAPORE PTE. LTD.
- Mark Alfred Whitmore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attached leveling control by metal stopper bumps
- Patent number 12,322,722
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing die stack structure
- Patent number 12,322,728
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,322,691
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device reflective bank structure
- Patent number 12,322,738
- Issue date Jun 3, 2025
- Apple Inc.
- Kapil V. Sakariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,316,307
- Issue date May 27, 2025
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage layers for wafer bonding
- Patent number 12,315,837
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- De-Yang Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,308,294
- Issue date May 20, 2025
- Tokyo Electron Limited
- Tetsuya Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display device and apparatus for manufactu...
- Patent number 12,308,259
- Issue date May 20, 2025
- Samsung Display Co., Ltd.
- Dong Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor chip having power tran...
- Patent number 12,308,356
- Issue date May 20, 2025
- Renesas Electronics Corporation
- Toshiyuki Hata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and molding press machine
- Patent number 12,308,260
- Issue date May 20, 2025
- Mitsubishi Electric Corporation
- Kiyohiro Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device, manufacturing method thereof and display mod...
- Patent number 12,300,772
- Issue date May 13, 2025
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DBI to SI bonding for simplified handle wafer
- Patent number 12,300,662
- Issue date May 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,300,667
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- YeongBeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid metal foam thermal interface material
- Patent number 12,300,567
- Issue date May 13, 2025
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material
- Patent number 12,296,409
- Issue date May 13, 2025
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device having connection unit
- Patent number 12,300,596
- Issue date May 13, 2025
- Samsung Display Co., Ltd.
- Myongsoo Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method for package structure
- Patent number 12,300,511
- Issue date May 13, 2025
- University of Electronic Science and Technology of China
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a bonded semiconductor structure
- Patent number 12,300,660
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,293,991
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging stacking flip chip
- Patent number 12,293,984
- Issue date May 6, 2025
- Hebei Beixin Semiconductor Technology Co., Ltd.
- Honglei Ran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,288,739
- Issue date Apr 29, 2025
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition for semiconductor circuit connection, adhesive...
- Patent number 12,286,564
- Issue date Apr 29, 2025
- LG Chem, Ltd.
- Youngsam Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Display device using micro LED, and method for manufacturing same
- Patent number 12,289,934
- Issue date Apr 29, 2025
- LG Electronics Inc.
- Hwanjoon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing laminate
- Patent number 12,288,768
- Issue date Apr 29, 2025
- Lintec Corporation
- Isao Ichikawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Methods of operating die attach systems
- Patent number 12,288,711
- Issue date Apr 29, 2025
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,283,555
- Issue date Apr 22, 2025
- Analog Devices International Unlimited Company
- Bilge Bayrakci
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250183217
- Publication date Jun 5, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250183110
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250183224
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- JIN-WOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER MICROPARTICLE DISPERSION
- Publication number 20250183215
- Publication date Jun 5, 2025
- KAO CORPORATION
- Takaaki EYAMA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
IC CHIP MOUNTING APPARATUS AND IC CHIP MOUNTING METHOD
- Publication number 20250183223
- Publication date Jun 5, 2025
- Sato Holdings Kabushiki Kaisha
- Yoshimitsu MAEDA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRIC POWER CONVERSION DEVICE
- Publication number 20250174503
- Publication date May 29, 2025
- Minebea Power Semiconductor Device Inc.
- Norio NAKAZATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED ARRAY ELECTRONIC DEVICE AND ITS TRANSFER METHOD
- Publication number 20250176343
- Publication date May 29, 2025
- Seoul National University R&DB Foundation
- Yong Taek HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20250176105
- Publication date May 29, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH STACKED SEMICONDUCTOR DIES
- Publication number 20250174578
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP M...
- Publication number 20250174555
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES FORMED USING RDL-LAST PROCESS
- Publication number 20250167173
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250167161
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250167159
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER TRANSFER OF MICROELECTRONIC DEVICE AND ASSOCIATED CONDUCTIVE PAD
- Publication number 20250167170
- Publication date May 22, 2025
- COHERENT LASERSYSTEMS GMBH & CO. KG
- Muhammad FATAHILAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Integration of Passive Devices
- Publication number 20250167176
- Publication date May 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250167061
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20250160096
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20250160095
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE SEMICONDUCTOR DEVICE PACKAGE WITH LEAD FRAME CLIP
- Publication number 20250157893
- Publication date May 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20250157985
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-LIKE ADHESIVE AND METHOD FOR PRODUCING SAME, INTEGRATED DICING...
- Publication number 20250157976
- Publication date May 15, 2025
- Resonac Corporation
- Tomoyo KANEKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...
- Publication number 20250157971
- Publication date May 15, 2025
- Institute of Semiconductors, Guangdong Academy of Sciences
- Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20250157975
- Publication date May 15, 2025
- NITTO DENKO CORPORATION
- Tsubasa OMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-IC FOR RF APPLICATIONS
- Publication number 20250157988
- Publication date May 15, 2025
- INFINEON TECHNOLOGIES AG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING RADIO-FREQUENCY MULTI-LAYER CIRCUITS ON FUSED...
- Publication number 20250157954
- Publication date May 15, 2025
- GE AVIATION SYSTEMS LIMITED
- Robert James MacDonald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250149399
- Publication date May 8, 2025
- MITSUBISHI ELECTRIC CORPORATION
- Junji FUJINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149518
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Yejin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY SUBSTRATE, TILED DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20250149522
- Publication date May 8, 2025
- BOE TECHNOLOGY GROUP CO., LTD.
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250149413
- Publication date May 8, 2025
- MITSUBISHI ELECTRIC CORPORATION
- Takayuki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
- Publication number 20250151421
- Publication date May 8, 2025
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS

using a layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package and manufacturing method thereof

Semiconductor package using a coreless signal distribution structure

Semiconductor device and method of forming microelectromechanical s...

Deposit levelling

Die attached leveling control by metal stopper bumps

Method of manufacturing die stack structure

Package structure and method of manufacturing the same

Light emitting device reflective bank structure

Switching device and electronic circuit

Storage layers for wafer bonding

Bonding apparatus and bonding method

Method for manufacturing display device and apparatus for manufactu...

Semiconductor device including semiconductor chip having power tran...

Semiconductor device manufacturing method and molding press machine

Light-emitting device, manufacturing method thereof and display mod...

DBI to SI bonding for simplified handle wafer

Semiconductor package and method of fabricating the same

Solid metal foam thermal interface material

Solder material

Display device having connection unit

Fabrication method for package structure

Method of forming a bonded semiconductor structure

Semiconductor packages and methods of forming same

Method for packaging stacking flip chip

Semiconductor device and method for manufacturing the same

Adhesive composition for semiconductor circuit connection, adhesive...

Display device using micro LED, and method for manufacturing same

Method of manufacturing laminate

Methods of operating die attach systems

Semiconductor packages

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

COPPER MICROPARTICLE DISPERSION

IC CHIP MOUNTING APPARATUS AND IC CHIP MOUNTING METHOD

SEMICONDUCTOR DEVICE AND ELECTRIC POWER CONVERSION DEVICE

MICRO LED ARRAY ELECTRONIC DEVICE AND ITS TRANSFER METHOD

SELECTIVE TRANSFER OF MICRO DEVICES

PACKAGE STRUCTURE WITH STACKED SEMICONDUCTOR DIES

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP M...

PACKAGES FORMED USING RDL-LAST PROCESS

INTEGRATED CIRCUIT PACKAGE AND METHOD

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

LASER TRANSFER OF MICROELECTRONIC DEVICE AND ASSOCIATED CONDUCTIVE PAD

Wafer Level Integration of Passive Devices

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE

DISCRETE SEMICONDUCTOR DEVICE PACKAGE WITH LEAD FRAME CLIP

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

FILM-LIKE ADHESIVE AND METHOD FOR PRODUCING SAME, INTEGRATED DICING...

THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

3D-IC FOR RF APPLICATIONS

METHOD OF FABRICATING RADIO-FREQUENCY MULTI-LAYER CIRCUITS ON FUSED...

POWER MODULE AND POWER CONVERSION APPARATUS

SEMICONDUCTOR PACKAGE

DISPLAY SUBSTRATE, TILED DISPLAY PANEL AND DISPLAY DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Device and Method of Making a Semiconductor Package w...