using a lift-off mask

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CPC
H01L2224/1147

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1147using a lift-off mask

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package structure with a barrier layer
- Patent number 11,984,419
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package structure and manufacturing method thereof
- Patent number 11,955,443
- Issue date Apr 9, 2024
- Amazing Cool Technology Corp
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with conductive pad
- Patent number 11,942,445
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-En Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having reduced bump height variation
- Patent number 11,935,866
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device interconnection systems and methods
- Patent number 11,916,039
- Issue date Feb 27, 2024
- Teledyne FLIR Commercial Systems, Inc.
- Richard E. Bornfreund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,908,818
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with sacrificial pillars and methods...
- Patent number 11,894,329
- Issue date Feb 6, 2024
- Micron Technology, Inc.
- Chao Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package assembly
- Patent number 11,876,065
- Issue date Jan 16, 2024
- Texas Instruments Incorporated
- Katleen Fajardo Timbol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,876,064
- Issue date Jan 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing indium pillar solder, chip substrate and chip
- Patent number 11,869,861
- Issue date Jan 9, 2024
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Wenlong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,855,014
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and package assembly including the same
- Patent number 11,855,025
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 11,824,026
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,769,746
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Ae-nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Industrial chip scale package for microelectronic device
- Patent number 11,749,616
- Issue date Sep 5, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structures with conductive elements, and...
- Patent number 11,728,307
- Issue date Aug 15, 2023
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-bump connection to interconnect structure and manufacturing m...
- Patent number 11,705,420
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode containing a grating and methods of making the...
- Patent number 11,695,100
- Issue date Jul 4, 2023
- Nanosys, Inc.
- Zhen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric molded indium bump formation and INP planarization
- Patent number 11,694,981
- Issue date Jul 4, 2023
- Princeton Infrared Technologies, Inc.
- Martin H Ettenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and method for forming the same
- Patent number 11,688,708
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an optoelectronic component, and optoelectroni...
- Patent number 11,658,277
- Issue date May 23, 2023
- OSRAM OLED GmbH
- Guido Weiss
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 11,626,388
- Issue date Apr 11, 2023
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming bonding structures by using template layer as templates
- Patent number 11,594,484
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling inductors in an IC device using interconnecting elements w...
- Patent number 11,557,420
- Issue date Jan 17, 2023
- GLOBALFOUNDRIES Inc.
- Tak Ming Mak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device bonding area including fused solder film and m...
- Patent number 11,545,452
- Issue date Jan 3, 2023
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive external connector structure and method of forming
- Patent number 11,527,504
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 11,515,272
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making flip chip
- Patent number RE49286
- Issue date Nov 8, 2022
- Research & Business Foundation SUNGKYUNKWAN UNIV
- Seung Boo Jung
Information Patent Grant
Semiconductor structure having counductive bump with tapered portio...
- Patent number 11,495,556
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
- Publication number 20240162163
- Publication date May 16, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE ASSEMBLY
- Publication number 20240153903
- Publication date May 9, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Katleen Fajardo Timbol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS...
- Publication number 20240136315
- Publication date Apr 25, 2024
- Micron Technology, Inc.
- Chao Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240113066
- Publication date Apr 4, 2024
- Sony Semiconductor Solutions Corporation
- Takashi IMAHIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240105652
- Publication date Mar 28, 2024
- SK HYNIX INC.
- Dae Won KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240038706
- Publication date Feb 1, 2024
- Sony Semiconductor Solutions Corporation
- Takashi IMAHIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURES WITH CONDUCTIVE ELEMENTS, AND...
- Publication number 20230335522
- Publication date Oct 19, 2023
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REPLACING SOLDER BALLS OF AN ELECTRONIC PACKAGE
- Publication number 20230317659
- Publication date Oct 5, 2023
- Skyworks Solutions, Inc.
- Marco Antonio Carmona
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Bump Connection to Interconnect Structure and Manufacturing M...
- Publication number 20230317661
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230260936
- Publication date Aug 17, 2023
- Amazing Cool Technology Corp
- Shiann-Tsong TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH FLEXIBLE INTERCONNECTS AND ASSOCI...
- Publication number 20230260943
- Publication date Aug 17, 2023
- Micron Technology, Inc.
- Christopher Glancey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH CONDUCTIVE PILLAR AND METHOD FOR FORMING THE SAME
- Publication number 20230253356
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT (3DIC) STRUCTURE
- Publication number 20230230962
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20230170318
- Publication date Jun 1, 2023
- SIPLP MICROELECTRONICS (CHONGQING) CO., LTD.
- Yan HUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, A PACKAGE SUBSTRATE, AND A SEMICONDUCTOR PACKAGE
- Publication number 20230154879
- Publication date May 18, 2023
- SK HYNIX INC.
- Si Yun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE ASSEMBLY
- Publication number 20230104156
- Publication date Apr 6, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Katleen Fajardo Timbol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Contact Structure and Method
- Publication number 20230085696
- Publication date Mar 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230068503
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CONDUCT...
- Publication number 20230063127
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PILLAR, METHOD FOR MANUFACTURING THE SAME, AND METHOD FO...
- Publication number 20230041521
- Publication date Feb 9, 2023
- DIC CORPORATION
- Ryota Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES
- Publication number 20230012200
- Publication date Jan 12, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER AND METHOD FOR MANUFACTURING...
- Publication number 20220367398
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURES WITH CONDUCTIVE ELEMENTS, AND...
- Publication number 20220344295
- Publication date Oct 27, 2022
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRUCTURE, PACKAGE STRUCTURE AND MANUFACTURING METHOD TH...
- Publication number 20220336400
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS...
- Publication number 20220328442
- Publication date Oct 13, 2022
- Micron Technology, Inc.
- Chao Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20220328443
- Publication date Oct 13, 2022
- CHIPMORE TECHNOLOGY CORPORATION LIMITED
- HAO CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP FORMATION USING WAFER WITH RING
- Publication number 20220181192
- Publication date Jun 9, 2022
- Semiconductor Components Industries, LLC
- Takashi NOMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Semiconductor Package and Semiconductor Package
- Publication number 20220173063
- Publication date Jun 2, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT (3DIC) STRUCTURE
- Publication number 20220157785
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TESTING ELECTRICAL PERFORMANCE OF PACKAGED CHIP
- Publication number 20220148932
- Publication date May 12, 2022
- MONTAGE TECHNOLOGY (KUNSHAN) CO., LTD.
- Meng MEI
- H01 - BASIC ELECTRIC ELEMENTS

using a lift-off mask

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure with a barrier layer

Solderless interconnection structure and method of forming same

Flip chip package structure and manufacturing method thereof

Semiconductor device with conductive pad

Semiconductor device having reduced bump height variation

Semiconductor device interconnection systems and methods

Semiconductor device

Semiconductor device assembly with sacrificial pillars and methods...

Flip chip package assembly

Semiconductor structure and manufacturing method thereof

Method for preparing indium pillar solder, chip substrate and chip

Semiconductor device and method

Semiconductor device and package assembly including the same

Connector structure and method of forming same

Semiconductor package

Industrial chip scale package for microelectronic device

Semiconductor interconnect structures with conductive elements, and...

Multi-bump connection to interconnect structure and manufacturing m...

Light emitting diode containing a grating and methods of making the...

Dielectric molded indium bump formation and INP planarization

Chip structure and method for forming the same

Method for producing an optoelectronic component, and optoelectroni...

Interconnect structure with redundant electrical connectors and ass...

Forming bonding structures by using template layer as templates

Coupling inductors in an IC device using interconnecting elements w...

Semiconductor device bonding area including fused solder film and m...

Conductive external connector structure and method of forming

Semiconductor die contact structure and method

Method of making flip chip

Semiconductor structure having counductive bump with tapered portio...

Patents Applicationslast 30 patents

INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE

FLIP CHIP PACKAGE ASSEMBLY

SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS...

ELECTRONIC DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

SEMICONDUCTOR INTERCONNECT STRUCTURES WITH CONDUCTIVE ELEMENTS, AND...

METHOD FOR REPLACING SOLDER BALLS OF AN ELECTRONIC PACKAGE

Multi-Bump Connection to Interconnect Structure and Manufacturing M...

FLIP CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DIE ASSEMBLIES WITH FLEXIBLE INTERCONNECTS AND ASSOCI...

CHIP STRUCTURE WITH CONDUCTIVE PILLAR AND METHOD FOR FORMING THE SAME

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE

SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE

SEMICONDUCTOR DEVICE, A PACKAGE SUBSTRATE, AND A SEMICONDUCTOR PACKAGE

FLIP CHIP PACKAGE ASSEMBLY

Semiconductor Die Contact Structure and Method

CHIP STRUCTURE AND METHOD FOR FORMING THE SAME

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CONDUCT...

CONDUCTIVE PILLAR, METHOD FOR MANUFACTURING THE SAME, AND METHOD FO...

SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES

PACKAGE STRUCTURE WITH A BARRIER LAYER AND METHOD FOR MANUFACTURING...

SEMICONDUCTOR INTERCONNECT STRUCTURES WITH CONDUCTIVE ELEMENTS, AND...

CONNECTING STRUCTURE, PACKAGE STRUCTURE AND MANUFACTURING METHOD TH...

SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS...

PACKAGE STRUCTURE AND FORMING METHOD THEREOF

SOLDER BUMP FORMATION USING WAFER WITH RING

Method for Forming Semiconductor Package and Semiconductor Package

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE

METHOD FOR TESTING ELECTRICAL PERFORMANCE OF PACKAGED CHIP