using a lift-off resist pattern or a release layer pattern

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CPC
H05K3/048

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/048using a lift-off resist pattern or a release layer pattern

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 11,991,836
- Issue date May 21, 2024
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making metal patterns on flexible substrate
- Patent number 11,950,372
- Issue date Apr 2, 2024
- 3M INNOVATION PROPERTIES
- Henrik B. van Lengerich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,917,768
- Issue date Feb 27, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fiducials for laminate structures
- Patent number 11,596,058
- Issue date Feb 28, 2023
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 11,596,072
- Issue date Feb 28, 2023
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowires-based transparent conductors
- Patent number 11,328,834
- Issue date May 10, 2022
- Cambrios Film Solutions Corporation
- Jonathan S. Alden
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,266,027
- Issue date Mar 1, 2022
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing circuit board with embedded conductive circ...
- Patent number 11,058,014
- Issue date Jul 6, 2021
- Avary Holding (Shenzhen) Co., Limited.
- Xiao-Yan Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,032,915
- Issue date Jun 8, 2021
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing structured surfaces
- Patent number 10,941,035
- Issue date Mar 9, 2021
- Leibniz-Institut für Neue Materialien gemeinnützige GmbH
- Johannes H. M. Maurer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Copper foil with carrier, coreless support with wiring layer, and m...
- Patent number 10,888,003
- Issue date Jan 5, 2021
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- B32 - LAYERED PRODUCTS
Information Patent Grant
Preparation of electrical circuits by adhesive transfer
- Patent number 10,849,234
- Issue date Nov 24, 2020
- 3M Innovative Properties Company
- John D. Le
- B32 - LAYERED PRODUCTS
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 10,757,820
- Issue date Aug 25, 2020
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit board interconnect decals
- Patent number 10,743,419
- Issue date Aug 11, 2020
- Honeywell Federal Manufacturing & Technologies, LLC
- Stephen McGarry Hatch
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Nanowires-based transparent conductors
- Patent number 10,580,549
- Issue date Mar 3, 2020
- Cambrios Film Solutions Corporation
- Jonathan S. Alden
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metallic microstructures with reduced-visibility and methods for pr...
- Patent number 10,537,028
- Issue date Jan 14, 2020
- 3M Innovative Properties Company
- Matthew S. Stay
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board interconnect decals
- Patent number 10,531,568
- Issue date Jan 7, 2020
- Honeywell Federal Manufacturing & Technologies, LLC
- Stephen McGarry Hatch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil with carrier, coreless support with wiring layer, and m...
- Patent number 10,492,308
- Issue date Nov 26, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 10,485,109
- Issue date Nov 19, 2019
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper foil with carrier, coreless support with wiring layer, and m...
- Patent number 10,356,915
- Issue date Jul 16, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and installation for producing a multilayer element and mult...
- Patent number 10,237,984
- Issue date Mar 19, 2019
- 3D-Micromac AG
- Tino Petsch
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sensor device with a flexible electrical conductor structure
- Patent number 10,098,223
- Issue date Oct 9, 2018
- Schreiner Group GmbH & Co. KG
- Peter Seidl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layered structures on thin substrates
- Patent number 10,046,584
- Issue date Aug 14, 2018
- Palo Alto Research Center Incorporated
- Michal V. Wolkin
- G01 - MEASURING TESTING
Information Patent Grant
Self-decap cavity fabrication process and structure
- Patent number 9,999,134
- Issue date Jun 12, 2018
- Multek Technologies Limited
- Mark Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding electronic components to patterned nanowire transparent con...
- Patent number 9,980,394
- Issue date May 22, 2018
- 3M Innovative Properties Company
- Matthew S. Stay
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Nanowires-based transparent conductors
- Patent number 9,899,123
- Issue date Feb 20, 2018
- Jonathan S. Alden
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Electronic assembly with fiducial marks for precision registration...
- Patent number 9,807,871
- Issue date Oct 31, 2017
- 3M Innovative Properties Company
- Daniel J. Theis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printing of multiple inks to achieve precision registration during...
- Patent number 9,766,732
- Issue date Sep 19, 2017
- 3M Innovative Properties Company
- Ann M. Gilman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metallization having high power compatibility and high electrical c...
- Patent number 9,728,705
- Issue date Aug 8, 2017
- QUALCOMM Incorporated
- Charles Binninger
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Substrate structure and manufacturing method thereof
- Patent number 9,648,760
- Issue date May 9, 2017
- Subtron Technology Co., Ltd.
- Chao-Min Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USI...
- Publication number 20240260200
- Publication date Aug 1, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF MAKING METAL PATTERNS ON FLEXIBLE SUBSTRATE
- Publication number 20240206076
- Publication date Jun 20, 2024
- 3M Innovative Properties Company
- Henrik B. van Lengerich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...
- Publication number 20240188224
- Publication date Jun 6, 2024
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...
- Publication number 20230180396
- Publication date Jun 8, 2023
- Board of Regents, The University of Texas System
- Romil Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Forming Resistance on Circuit Board and Circuit Board Ha...
- Publication number 20230093870
- Publication date Mar 30, 2023
- Unimicron Technology Corporation
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230063719
- Publication date Mar 2, 2023
- IBIDEN CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, WIRING BOARD, METHOD FOR MAN...
- Publication number 20230007781
- Publication date Jan 5, 2023
- FUJIKURA LTD.
- Kazutoshi Koshimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS FOR ELEC...
- Publication number 20210185829
- Publication date Jun 17, 2021
- Jan Franck
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF MAKING METAL PATTERNS ON FLEXIBLE SUBSTRATE
- Publication number 20210161018
- Publication date May 27, 2021
- 3M Innovative Properties Company
- Henrik B. van Lengerich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...
- Publication number 20200344895
- Publication date Oct 29, 2020
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...
- Publication number 20200329567
- Publication date Oct 15, 2020
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FIDUCIALS FOR LAMINATE STRUCTURES
- Publication number 20200288567
- Publication date Sep 10, 2020
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD INTERCONNECT DECALS
- Publication number 20200236788
- Publication date Jul 23, 2020
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Stephen McGarry Hatch
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...
- Publication number 20200093007
- Publication date Mar 19, 2020
- Board of Regents, The University of Texas System
- Romil Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND M...
- Publication number 20200053885
- Publication date Feb 13, 2020
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Preparation of Electrical Circuits by Adhesive Transfer
- Publication number 20200029443
- Publication date Jan 23, 2020
- 3M Innovative Properties Company
- John D. Le
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING CAVITY IN PRINTED CIRCUIT BOARD BY USING RELEASE...
- Publication number 20200029445
- Publication date Jan 23, 2020
- TLB Co.
- Bum-Seok Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND M...
- Publication number 20190261518
- Publication date Aug 22, 2019
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SENSOR DEVICE WITH A FLEXIBLE ELECTRICAL CONDUCTOR STRUCTURE
- Publication number 20190045620
- Publication date Feb 7, 2019
- Schreiner Group GmbH & Co. KG
- Peter Seidl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND M...
- Publication number 20190029125
- Publication date Jan 24, 2019
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRES-BASED TRANSPARENT CONDUCTORS
- Publication number 20180218802
- Publication date Aug 2, 2018
- CAM HOLDING CORPORATION
- Jonathan S. Alden
- B82 - NANO-TECHNOLOGY
Information Patent Application
ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...
- Publication number 20180124926
- Publication date May 3, 2018
- Board of Regents, The University of Texas System
- Romil Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METALLIC MICROSTRUCTURES WITH REDUCED-VISIBILITY AND METHODS FOR PR...
- Publication number 20170142841
- Publication date May 18, 2017
- 3M Innovative Properties Company
- Matthew S. Stay
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTING OF MULTIPLE INKS TO ACHIEVE PRECISION REGISTRATION DURING...
- Publication number 20170115761
- Publication date Apr 27, 2017
- 3M Innovative Properties Company
- Ann M. Gilman
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ELECTRONIC ASSEMBLY WITH FIDUCIAL MARKS FOR PRECISION REGISTRATION...
- Publication number 20160205772
- Publication date Jul 14, 2016
- 3M INNOVATIVE PROPERTIES COMPANY
- Daniel J. Theis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Insulated Implantable Electrical Curcuit
- Publication number 20150182142
- Publication date Jul 2, 2015
- Second Sight Medical Products, Inc.
- Robert J. Greenberg
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150101852
- Publication date Apr 16, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Jong Tae Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Systems and Methods for Encapsulating Electronics in a Mountable De...
- Publication number 20140296673
- Publication date Oct 2, 2014
- Google Inc.
- James Etzkorn
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Systems and Methods for Encapsulating Electronics in a Mountable De...
- Publication number 20140296672
- Publication date Oct 2, 2014
- Google Inc.
- James Etzkorn
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
WAFER SCALE EPITAXIAL GRAPHENE TRANSFER
- Publication number 20140291282
- Publication date Oct 2, 2014
- International Business Machines Corporation
- Stephen W. Bedell
- B32 - LAYERED PRODUCTS

using a lift-off resist pattern or a release layer pattern

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrical devices with electrodes on softening polymers and method...

Methods of making metal patterns on flexible substrate

Single-layer circuit board, multi-layer circuit board, and manufact...

Fiducials for laminate structures

Electrical devices with electrodes on softening polymers and method...

Nanowires-based transparent conductors

Single-layer circuit board, multi-layer circuit board, and manufact...

Method of manufacturing circuit board with embedded conductive circ...

Single-layer circuit board, multi-layer circuit board, and manufact...

Method for producing structured surfaces

Copper foil with carrier, coreless support with wiring layer, and m...

Preparation of electrical circuits by adhesive transfer

Single-layer circuit board, multi-layer circuit board, and manufact...

Circuit board interconnect decals

Nanowires-based transparent conductors

Metallic microstructures with reduced-visibility and methods for pr...

Circuit board interconnect decals

Copper foil with carrier, coreless support with wiring layer, and m...

Electrical devices with electrodes on softening polymers and method...

Copper foil with carrier, coreless support with wiring layer, and m...

Method and installation for producing a multilayer element and mult...

Sensor device with a flexible electrical conductor structure

Layered structures on thin substrates

Self-decap cavity fabrication process and structure

Bonding electronic components to patterned nanowire transparent con...

Nanowires-based transparent conductors

Electronic assembly with fiducial marks for precision registration...

Printing of multiple inks to achieve precision registration during...

Metallization having high power compatibility and high electrical c...

Substrate structure and manufacturing method thereof

Patents Applicationslast 30 patents

METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USI...

METHODS OF MAKING METAL PATTERNS ON FLEXIBLE SUBSTRATE

ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...

ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...

Method for Forming Resistance on Circuit Board and Circuit Board Ha...

METHOD FOR MANUFACTURING WIRING SUBSTRATE

METHOD FOR MANUFACTURING WIRING BOARD, WIRING BOARD, METHOD FOR MAN...

DEVICE AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS FOR ELEC...

METHODS OF MAKING METAL PATTERNS ON FLEXIBLE SUBSTRATE

SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...

SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...

FIDUCIALS FOR LAMINATE STRUCTURES

CIRCUIT BOARD INTERCONNECT DECALS

ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...

COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND M...

Preparation of Electrical Circuits by Adhesive Transfer

METHOD OF FORMING CAVITY IN PRINTED CIRCUIT BOARD BY USING RELEASE...

COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND M...

SENSOR DEVICE WITH A FLEXIBLE ELECTRICAL CONDUCTOR STRUCTURE

COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND M...

NANOWIRES-BASED TRANSPARENT CONDUCTORS

ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...

METALLIC MICROSTRUCTURES WITH REDUCED-VISIBILITY AND METHODS FOR PR...

PRINTING OF MULTIPLE INKS TO ACHIEVE PRECISION REGISTRATION DURING...

ELECTRONIC ASSEMBLY WITH FIDUCIAL MARKS FOR PRECISION REGISTRATION...

Insulated Implantable Electrical Curcuit

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Systems and Methods for Encapsulating Electronics in a Mountable De...

Systems and Methods for Encapsulating Electronics in a Mountable De...

WAFER SCALE EPITAXIAL GRAPHENE TRANSFER