using a polymer adhesive

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H01L2224/8085

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8085using a polymer adhesive

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Low cost three-dimensional stacking semiconductor assemblies
- Patent number 12,062,607
- Issue date Aug 13, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing the same
- Patent number 11,894,335
- Issue date Feb 6, 2024
- Japan Display Inc.
- Kazuyuki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with through substrate via (TSV)
- Patent number 11,658,172
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit with interposing functionality and meth...
- Patent number 11,605,569
- Issue date Mar 14, 2023
- AT&SAustria Technologie & Systemtechnik AG
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost three-dimensional stacking semiconductor assemblies
- Patent number 11,462,472
- Issue date Oct 4, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module with sealing resin
- Patent number 11,387,400
- Issue date Jul 12, 2022
- Murata Manufacturing Co., Ltd.
- Junpei Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus incorporating variable force distribution
- Patent number 11,121,113
- Issue date Sep 14, 2021
- ASM Technology Singapore Pte. Ltd.
- Ming Yeung Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit package...
- Patent number 10,727,085
- Issue date Jul 28, 2020
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using MEMS fabrication incorporating into LED device mounting and a...
- Patent number 10,403,804
- Issue date Sep 3, 2019
- Epistar Corporation
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit delamina...
- Patent number 10,347,508
- Issue date Jul 9, 2019
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming hybrid bonding with through substrate via (TSV)
- Patent number 10,340,247
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using MEMS fabrication incorporating into LED device mounting and a...
- Patent number 10,026,882
- Issue date Jul 17, 2018
- Epistar Corporation
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with through substrate via (TSV)
- Patent number 9,768,143
- Issue date Sep 19, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing a semiconductor d...
- Patent number 9,613,930
- Issue date Apr 4, 2017
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly bonding
- Patent number 9,488,853
- Issue date Nov 8, 2016
- VERILY LIFE SCIENCES LLC
- James Etzkorn
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,230,938
- Issue date Jan 5, 2016
- Renesas Electronics Corporation
- Akio Hasebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optically clear adhesive for dicing die bonding film
- Patent number 9,133,367
- Issue date Sep 15, 2015
- Cheil Industries, Inc.
- Kyoung Jin Ha
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic component mounting structure
- Patent number 8,497,432
- Issue date Jul 30, 2013
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including double-sided multi-electrode chip em...
- Patent number 8,446,003
- Issue date May 21, 2013
- Denso Corporation
- Atsushi Komura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LOW COST THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES
- Publication number 20240371755
- Publication date Nov 7, 2024
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL (3D) CHIPLET AND METHODS FOR FORMING THE SAME
- Publication number 20230420437
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chieh-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING A DIE TO A SUBSTRATE WITH VIAS CONNECTING METAL PADS...
- Publication number 20230317653
- Publication date Oct 5, 2023
- Intel Corporation
- Hongxia FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXOTHERMIC REACTIVE BONDING FOR SEMICONDUCTOR DIE ASSEMBLIES AND AS...
- Publication number 20230064032
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES
- Publication number 20230025886
- Publication date Jan 26, 2023
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210398939
- Publication date Dec 23, 2021
- Japan Display Inc.
- Kazuyuki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING WITH THROUGH SUBSTRATE VIA (TSV)
- Publication number 20200027868
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20190027676
- Publication date Jan 24, 2019
- Murata Manufacturing Co., Ltd.
- Junpei YASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND A...
- Publication number 20180301609
- Publication date Oct 18, 2018
- EPISTAR CORPORATION
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING HYBRID BONDING WITH THROUGH SUBSTRATE VIA (TSV)
- Publication number 20180005977
- Publication date Jan 4, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED ADHESION DEPOSITION TO MITIGATE INTEGRATED CIRCUIT DELAMINA...
- Publication number 20170271174
- Publication date Sep 21, 2017
- TEXAS INSTRUMENTS INCORPORATED
- YONG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20160155862
- Publication date Jun 2, 2016
- Samsung Electronics Co., Ltd.
- Yi-Koan HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Temporarily Attaching a Rigid Carrier to a Substrate
- Publication number 20150348935
- Publication date Dec 3, 2015
- Shawn O'Rourke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-TO-DIE BONDING AND ASSOCIATED PACKAGE CONFIGURATIONS
- Publication number 20150255411
- Publication date Sep 10, 2015
- Omkar G. Karhade
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ASSEMBLY BONDING
- Publication number 20150212340
- Publication date Jul 30, 2015
- Google Inc.
- James Etzkorn
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...
- Publication number 20150115458
- Publication date Apr 30, 2015
- INFINEON TECHNOLOGIES AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150111317
- Publication date Apr 23, 2015
- Renesas Electronics Corporation
- Akio Hasebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150084170
- Publication date Mar 26, 2015
- Hohyeuk IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140179032
- Publication date Jun 26, 2014
- RENESAS ELECTRONICS CORPORATION
- Akio Hasebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLING THIN SILICON CHIPS ON A CONTACT LENS
- Publication number 20140085599
- Publication date Mar 27, 2014
- Google Inc.
- James Etzkorn
- G02 - OPTICS
Information Patent Application
ASSEMBLING THIN SILICON CHIPS ON A CONTACT LENS
- Publication number 20140084489
- Publication date Mar 27, 2014
- James Etzkorn
- G02 - OPTICS
Information Patent Application
OPTICALLY CLEAR ADHESIVE FOR DICING DIE BONDING FILM
- Publication number 20120171481
- Publication date Jul 5, 2012
- Kyoung Jin Ha
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method of Temporarily Attaching a Rigid Carrier to a Substrate
- Publication number 20100297829
- Publication date Nov 25, 2010
- The Arizona Board of Regents, a body corporate acting for and on behalf of Ar...
- Shawn O'Rourke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100295170
- Publication date Nov 25, 2010
- DENSO CORPORATION
- Atsushi KOMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20100071946
- Publication date Mar 25, 2010
- SEIKO EPSON CORPORATION
- Nobuaki HASHIMOTO
- G02 - OPTICS

using a polymer adhesive

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low cost three-dimensional stacking semiconductor assemblies

Display device and method for manufacturing the same

Hybrid bonding with through substrate via (TSV)

Packaged integrated circuit with interposing functionality and meth...

Low cost three-dimensional stacking semiconductor assemblies

Electronic module with sealing resin

Bonding apparatus incorporating variable force distribution

Printed adhesion deposition to mitigate integrated circuit package...

Using MEMS fabrication incorporating into LED device mounting and a...

Printed adhesion deposition to mitigate integrated circuit delamina...

Method for forming hybrid bonding with through substrate via (TSV)

Using MEMS fabrication incorporating into LED device mounting and a...

Hybrid bonding with through substrate via (TSV)

Semiconductor device and method for manufacturing a semiconductor d...

Assembly bonding

Method of manufacturing semiconductor device

Optically clear adhesive for dicing die bonding film

Electronic component mounting structure

Semiconductor device including double-sided multi-electrode chip em...

Patents Applicationslast 30 patents

LOW COST THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES

THREE DIMENSIONAL (3D) CHIPLET AND METHODS FOR FORMING THE SAME

HYBRID BONDING A DIE TO A SUBSTRATE WITH VIAS CONNECTING METAL PADS...

EXOTHERMIC REACTIVE BONDING FOR SEMICONDUCTOR DIE ASSEMBLIES AND AS...

LOW COST THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

HYBRID BONDING WITH THROUGH SUBSTRATE VIA (TSV)

ELECTRONIC MODULE

USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND A...

METHOD FOR FORMING HYBRID BONDING WITH THROUGH SUBSTRATE VIA (TSV)

PRINTED ADHESION DEPOSITION TO MITIGATE INTEGRATED CIRCUIT DELAMINA...

METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE

Method of Temporarily Attaching a Rigid Carrier to a Substrate

DIE-TO-DIE BONDING AND ASSOCIATED PACKAGE CONFIGURATIONS

ASSEMBLY BONDING

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ASSEMBLING THIN SILICON CHIPS ON A CONTACT LENS

ASSEMBLING THIN SILICON CHIPS ON A CONTACT LENS

OPTICALLY CLEAR ADHESIVE FOR DICING DIE BONDING FILM

Method of Temporarily Attaching a Rigid Carrier to a Substrate

SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT MOUNTING STRUCTURE