using a polymer adhesive

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H01L2224/8485

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8485using a polymer adhesive

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 11,557,530
- Issue date Jan 17, 2023
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal surface-mount semiconductor package
- Patent number 11,469,205
- Issue date Oct 11, 2022
- Adventive International Ltd.
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component and method of manufacturing a component using an ultrathi...
- Patent number 11,367,654
- Issue date Jun 21, 2022
- Infineon Technologies AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,201,121
- Issue date Dec 14, 2021
- Fuji Electric Co., Ltd.
- Kohei Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,727,170
- Issue date Jul 28, 2020
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,658,274
- Issue date May 19, 2020
- Nexperia B.V.
- Tim Boettcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 10,622,276
- Issue date Apr 14, 2020
- Hyundai Motor Company
- Young Seok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal surface-mount semiconductor package
- Patent number 10,615,146
- Issue date Apr 7, 2020
- ADVENTIVE IPBANK
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stack die package
- Patent number 10,546,840
- Issue date Jan 28, 2020
- Vishay SIliconix, LLC
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic apparatus including semiconduct...
- Patent number 10,546,839
- Issue date Jan 28, 2020
- Renesas Electronic Corporation
- Akira Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,529,644
- Issue date Jan 7, 2020
- Nexperia B.V.
- Shun Tik Yeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a porous metal layer and an electronic...
- Patent number 10,515,910
- Issue date Dec 24, 2019
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and conductive member for semiconductor module...
- Patent number 10,475,667
- Issue date Nov 12, 2019
- Mitsubishi Electric Corporation
- Masakazu Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and an electronic device
- Patent number 10,453,946
- Issue date Oct 22, 2019
- Renesas Electronics Corporation
- Akira Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,395,967
- Issue date Aug 27, 2019
- Renesas Electronics Corporation
- Takamitsu Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and clip each having sinterable, solidified paste for conne...
- Patent number 10,347,566
- Issue date Jul 9, 2019
- Heraeus Deutschland GmbH & Co. KG
- Michael Benedikt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating low-profile footed power package
- Patent number 10,312,111
- Issue date Jun 4, 2019
- ADVENTIVE IPBANK
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic apparatus including a first sem...
- Patent number 10,217,727
- Issue date Feb 26, 2019
- Renesas Electronics Corporation
- Akira Muto
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device with first and second chips and connections th...
- Patent number 10,204,899
- Issue date Feb 12, 2019
- Renesas Electronics Corporation
- Masaki Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, semiconductor system and method of formi...
- Patent number 10,115,646
- Issue date Oct 30, 2018
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating low-profile footed power package
- Patent number 10,032,649
- Issue date Jul 24, 2018
- ADVENTIVE IPBANK
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack die package
- Patent number 9,966,330
- Issue date May 8, 2018
- Vishay Siliconix
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method of electronic device
- Patent number 9,922,906
- Issue date Mar 20, 2018
- Denso Corporation
- Toshihiro Nagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a plate-shaped lead terminal
- Patent number 9,917,064
- Issue date Mar 13, 2018
- Mitsubishi Electric Corporation
- Yusuke Ishiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple contact clips
- Patent number 9,837,380
- Issue date Dec 5, 2017
- Infineon Technologies Austria AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stack die package
- Patent number 9,589,929
- Issue date Mar 7, 2017
- Vishay Siliconix
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,530,723
- Issue date Dec 27, 2016
- Renesas Electronics Corporation
- Akira Muto
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power semiconductor package
- Patent number 9,496,205
- Issue date Nov 15, 2016
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dual-chip packaging structure and preparation method thereof
- Patent number 9,184,117
- Issue date Nov 10, 2015
- Alpha and Omega Semiconductor Incorporated
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Universal Surface-Mount Semiconductor Package
- Publication number 20220415849
- Publication date Dec 29, 2022
- Adventive International Ltd.
- Richard K Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Universal Surface-Mount Semiconductor Package
- Publication number 20200273838
- Publication date Aug 27, 2020
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Multi-Chip Semiconductor Power Device
- Publication number 20200083207
- Publication date Mar 12, 2020
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20190088629
- Publication date Mar 21, 2019
- RENESAS ELECTRONICS CORPORATION
- Akira MUTO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Universal Surface-Mount Semiconductor Package
- Publication number 20180331067
- Publication date Nov 15, 2018
- ADVENTIVE IPBANK
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Fabricating Low-Profile Footed Power Package
- Publication number 20180330968
- Publication date Nov 15, 2018
- ADVENTIVE IPBANK
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package with Multiple Dies
- Publication number 20150008572
- Publication date Jan 8, 2015
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package
- Publication number 20140319665
- Publication date Oct 30, 2014
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING STACK DIE PACKAGE
- Publication number 20140273344
- Publication date Sep 18, 2014
- VISHAY-SILICONIX
- Kyle TERRILL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Moisture-tight semiconductor module and method for producing a mois...
- Publication number 20140151868
- Publication date Jun 5, 2014
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DUAL-CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF
- Publication number 20140117523
- Publication date May 1, 2014
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENTS, A CHIP PACKAGE AND A METHOD FOR MANUFACTURING A...
- Publication number 20140097528
- Publication date Apr 10, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead Frame Packages and Methods of Formation Thereof
- Publication number 20140001480
- Publication date Jan 2, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electric Device Package and Method of Making an Electric Device Pac...
- Publication number 20130329365
- Publication date Dec 12, 2013
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMIFINISHED PRODUCT AND METHOD FOR PRODUCING A LIGHT-EMITTING DIODE
- Publication number 20130193475
- Publication date Aug 1, 2013
- Evonik Goldschmidt GmbH
- Volker Arning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module Including a Discrete Device Mounted on a DCB Substrate
- Publication number 20130161801
- Publication date Jun 27, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package with Conductive Clip
- Publication number 20130140602
- Publication date Jun 6, 2013
- International Rectifier Corporation
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY EFFICIENT INTEGRATED CIRCUIT PACKAGE
- Publication number 20130127008
- Publication date May 23, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IGBT Power Semiconductor Package Having a Conductive Clip
- Publication number 20120223415
- Publication date Sep 6, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MODULE
- Publication number 20110180809
- Publication date Jul 28, 2011
- Mitsubishi Electric Corporation
- Yasunari HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20080230889
- Publication date Sep 25, 2008
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS

using a polymer adhesive

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices and methods of making the same

Universal surface-mount semiconductor package

Component and method of manufacturing a component using an ultrathi...

Semiconductor device

Method for electrically contacting a component by galvanic connecti...

Semiconductor devices and methods of making the same

Electronic device

Power module

Universal surface-mount semiconductor package

Method for fabricating stack die package

Semiconductor device and electronic apparatus including semiconduct...

Semiconductor device

Semiconductor device having a porous metal layer and an electronic...

Semiconductor module and conductive member for semiconductor module...

Semiconductor device and an electronic device

Method for manufacturing semiconductor device

Carrier and clip each having sinterable, solidified paste for conne...

Method of fabricating low-profile footed power package

Semiconductor device and electronic apparatus including a first sem...

Semiconductor device with first and second chips and connections th...

Semiconductor arrangement, semiconductor system and method of formi...

Method of fabricating low-profile footed power package

Stack die package

Electronic device and manufacturing method of electronic device

Semiconductor device with a plate-shaped lead terminal

Semiconductor device having multiple contact clips

Method for fabricating stack die package

Semiconductor device and manufacturing method thereof

Power semiconductor package

Stacked dual-chip packaging structure and preparation method thereof

Patents Applicationslast 30 patents

Universal Surface-Mount Semiconductor Package

Universal Surface-Mount Semiconductor Package

Method of Manufacturing a Multi-Chip Semiconductor Power Device

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

Universal Surface-Mount Semiconductor Package

Method Of Fabricating Low-Profile Footed Power Package

Power Semiconductor Package with Multiple Dies

Power Semiconductor Package

METHOD FOR FABRICATING STACK DIE PACKAGE

Moisture-tight semiconductor module and method for producing a mois...

STACKED DUAL-CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF

CHIP ARRANGEMENTS, A CHIP PACKAGE AND A METHOD FOR MANUFACTURING A...

Lead Frame Packages and Methods of Formation Thereof

Electric Device Package and Method of Making an Electric Device Pac...

SEMIFINISHED PRODUCT AND METHOD FOR PRODUCING A LIGHT-EMITTING DIODE

Module Including a Discrete Device Mounted on a DCB Substrate

Power Semiconductor Package with Conductive Clip

THERMALLY EFFICIENT INTEGRATED CIRCUIT PACKAGE

IGBT Power Semiconductor Package Having a Conductive Clip

SEMICONDUCTOR DEVICE MODULE

SEMICONDUCTOR PACKAGE