using a polymer adhesive

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CPC
H01L2224/8585

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8585using a polymer adhesive

Industries

Patents Grantslast 30 patents

Information Patent Grant
Anisotropic conductive film
- Patent number 10,964,440
- Issue date Mar 30, 2021
- Dexerials Corporation
- Shinichi Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device by laser-induced forming and transfer of shaped m...
- Patent number 10,297,565
- Issue date May 21, 2019
- The United States of America, as represented by the Secretary of the Navy
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-induced forming and transfer of shaped metallic interconnects
- Patent number 9,966,356
- Issue date May 8, 2018
- The United States of America, as represented by the Secretary of the Navy
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-induced forming and transfer of shaped metallic interconnects
- Patent number 9,685,349
- Issue date Jun 20, 2017
- The United States of America, as represented by the Secretary of the Navy
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,530,723
- Issue date Dec 27, 2016
- Renesas Electronics Corporation
- Akira Muto
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor packages having multiple lead frames and methods of f...
- Patent number 9,449,902
- Issue date Sep 20, 2016
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having multiple lead frames and methods of f...
- Patent number 8,896,106
- Issue date Nov 25, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grown carbon nanotube die attach structures, articles, devices, and...
- Patent number 8,753,924
- Issue date Jun 17, 2014
- Texas Instruments Incorporated
- James Cooper Wainerdi
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Assembly of radiofrequency chips
- Patent number 8,471,773
- Issue date Jun 25, 2013
- Commissariat a l'Energie Atomique
- Dominique Vicard
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package with adhesive material pre-printed on the lea...
- Patent number 8,455,303
- Issue date Jun 4, 2013
- Alpha and Omega Semiconductor Incorporated
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure for back illuminated optoelectronic device an...
- Patent number 8,361,898
- Issue date Jan 29, 2013
- Visera Technologies Company Limited
- Kai-Chih Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for producing a set of chips mechanically interconnected by...
- Patent number 8,258,011
- Issue date Sep 4, 2012
- Commissariat a l'Energie Atomique
- Jean Brun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package structure and manufacturing method thereof for effecti...
- Patent number 8,242,594
- Issue date Aug 14, 2012
- Unimicron Technology Corp.
- Chung-Pan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with adhesive material pre-printed on the lea...
- Patent number 8,222,088
- Issue date Jul 17, 2012
- Alpha and Omega Semiconductor Incorporated
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical microfilament to circuit interface
- Patent number 8,217,269
- Issue date Jul 10, 2012
- Raytheon Company
- Stephen C. Jacobsen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, method of manufacturing wiring substrate, and ele...
- Patent number 8,127,438
- Issue date Mar 6, 2012
- Seiko Epson Corporation
- Toshiki Hara
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electrical microfilament to circuit interface
- Patent number 8,026,447
- Issue date Sep 27, 2011
- Raytheon Sarcos, LLC
- Stephen C. Jacobsen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding pad structure for back illuminated optoelectronic device an...
- Patent number 7,679,187
- Issue date Mar 16, 2010
- Visera Technologies Company Limited
- Kai-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical microfilament to circuit interface
- Patent number 7,626,123
- Issue date Dec 1, 2009
- Raytheon Sarcos, LLC
- Stephen C. Jacobsen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structures and methods for wire bonding over active, brittle and lo...
- Patent number 7,176,580
- Issue date Feb 13, 2007
- Joseph Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible substrate mounted solid-state light sources for exterior v...
- Patent number 6,520,669
- Issue date Feb 18, 2003
- Light Sciences Corporation
- James C. Chen
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Electronic Device By Laser-Induced Forming and Transfer of Shaped M...
- Publication number 20180240772
- Publication date Aug 23, 2018
- The Government of the United States of America, as represented by the Secreta...
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser-Induced Forming and Transfer of Shaped Metallic Interconnects
- Publication number 20170221851
- Publication date Aug 3, 2017
- The Government of the United States of America, as represented by the Secreta...
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser-Induced Forming and Transfer of Shaped Metallic Interconnects
- Publication number 20170103902
- Publication date Apr 13, 2017
- The Government of the United States of America, as represented by the Secreta...
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages Having Multiple Lead Frames and Methods of F...
- Publication number 20140008702
- Publication date Jan 9, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROWN CARBON NANOTUBE DIE ATTACH STRUCTURES, ARTICLES, DEVICES, AND...
- Publication number 20130234313
- Publication date Sep 12, 2013
- TEXAS INSTRUMENTS INCORPORATED
- James Cooper Wainerdi
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ADHESIVE MATERIAL PRE-PRINTED ON THE LEA...
- Publication number 20120322207
- Publication date Dec 20, 2012
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM USING B-STAGE POLYMER AND METHO...
- Publication number 20120228768
- Publication date Sep 13, 2012
- Reza Argenty Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL MICROFILAMENT TO CIRCUIT INTERFACE
- Publication number 20110310577
- Publication date Dec 22, 2011
- Stephen C. Jacobsen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR SIMULTANEOUSLY FORMING A MECHANICAL AND ELECTRICAL CONNE...
- Publication number 20110217877
- Publication date Sep 8, 2011
- Torsten Linz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with adhesive material pre-printed on the lea...
- Publication number 20110068457
- Publication date Mar 24, 2011
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with adhesive material pre-printed on the lea...
- Publication number 20110070698
- Publication date Mar 24, 2011
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20100264534
- Publication date Oct 21, 2010
- Unimicron Technology Corp.
- Chung-Pan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly of Radiofrequency Chips
- Publication number 20100245182
- Publication date Sep 30, 2010
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Dominique Vicard
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR PRODUCING A SET OF CHIPS MECHANICALLY INTERCONNECTED BY...
- Publication number 20100136746
- Publication date Jun 3, 2010
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Jean Brun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING PAD STRUCTURE FOR BACK ILLUMINATED OPTOELECTRONIC DEVICE AN...
- Publication number 20100127408
- Publication date May 27, 2010
- VisEra Technologies Company Limited
- Kai-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Microfilament to Circuit Interface
- Publication number 20100116869
- Publication date May 13, 2010
- Stephen C. Jacobsen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Bonding pad structure for back illuminated optoelectronic device an...
- Publication number 20080169117
- Publication date Jul 17, 2008
- VisEra Technologies Company Limited
- Kai-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND ELE...
- Publication number 20080110017
- Publication date May 15, 2008
- SEIKO EPSON CORPORATION
- Toshiki HARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical microfilament to circuit interface
- Publication number 20070132109
- Publication date Jun 14, 2007
- Sarcos Investments LC.
- Stephen C. Jacobsen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

using a polymer adhesive

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Anisotropic conductive film

Electronic device by laser-induced forming and transfer of shaped m...

Laser-induced forming and transfer of shaped metallic interconnects

Laser-induced forming and transfer of shaped metallic interconnects

Semiconductor device and manufacturing method thereof

Semiconductor packages having multiple lead frames and methods of f...

Semiconductor packages having multiple lead frames and methods of f...

Grown carbon nanotube die attach structures, articles, devices, and...

Assembly of radiofrequency chips

Semiconductor package with adhesive material pre-printed on the lea...

Bonding pad structure for back illuminated optoelectronic device an...

Method for producing a set of chips mechanically interconnected by...

Chip package structure and manufacturing method thereof for effecti...

Semiconductor package with adhesive material pre-printed on the lea...

Electrical microfilament to circuit interface

Wiring substrate, method of manufacturing wiring substrate, and ele...

Electrical microfilament to circuit interface

Bonding pad structure for back illuminated optoelectronic device an...

Electrical microfilament to circuit interface

Structures and methods for wire bonding over active, brittle and lo...

Flexible substrate mounted solid-state light sources for exterior v...

Patents Applicationslast 30 patents

Electronic Device By Laser-Induced Forming and Transfer of Shaped M...

Laser-Induced Forming and Transfer of Shaped Metallic Interconnects

Laser-Induced Forming and Transfer of Shaped Metallic Interconnects

Semiconductor Packages Having Multiple Lead Frames and Methods of F...

GROWN CARBON NANOTUBE DIE ATTACH STRUCTURES, ARTICLES, DEVICES, AND...

SEMICONDUCTOR PACKAGE WITH ADHESIVE MATERIAL PRE-PRINTED ON THE LEA...

INTEGRATED CIRCUIT PACKAGING SYSTEM USING B-STAGE POLYMER AND METHO...

ELECTRICAL MICROFILAMENT TO CIRCUIT INTERFACE

METHOD FOR SIMULTANEOUSLY FORMING A MECHANICAL AND ELECTRICAL CONNE...

Semiconductor package with adhesive material pre-printed on the lea...

Semiconductor package with adhesive material pre-printed on the lea...

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Assembly of Radiofrequency Chips

METHOD FOR PRODUCING A SET OF CHIPS MECHANICALLY INTERCONNECTED BY...

BONDING PAD STRUCTURE FOR BACK ILLUMINATED OPTOELECTRONIC DEVICE AN...

Electrical Microfilament to Circuit Interface

Bonding pad structure for back illuminated optoelectronic device an...

WIRING SUBSTRATE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND ELE...

Electrical microfilament to circuit interface