using a powder

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CPC
H01L2224/03332

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/03332using a powder

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wafer level package (WLP) and method for forming the same
- Patent number 10,861,801
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package (WLP) and method for forming the same
- Patent number 10,510,690
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a porous conductive structure in connection to...
- Patent number 10,373,868
- Issue date Aug 6, 2019
- Infineon Technologies Austria AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package (WLP) and method for forming the same
- Patent number 10,074,617
- Issue date Sep 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive compositions and methods of using them
- Patent number 10,059,827
- Issue date Aug 28, 2018
- Rajan Hariharan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Environmental hardened packaged integrated circuit
- Patent number 9,711,480
- Issue date Jul 18, 2017
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 9,437,562
- Issue date Sep 6, 2016
- Toyota Jidosha Kabushiki Kaisha
- Takashi Ushijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mono-acid hybrid conductive composition and method
- Patent number 8,564,140
- Issue date Oct 22, 2013
- Alpha Metals, Inc.
- Rajan Hariharan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Wafer Level Package (WLP) and Method for Forming the Same
- Publication number 20200098705
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Package (WLP) and Method for Forming the Same
- Publication number 20180374801
- Publication date Dec 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SUBSTRATE AND AN ELECTRONIC DEVICE
- Publication number 20170207123
- Publication date Jul 20, 2017
- Infineon Technologies Austria AG
- Martin MISCHITZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Compositions and Methods of Using Them
- Publication number 20160251495
- Publication date Sep 1, 2016
- ALPHA METALS, INC.
- Rajan Hariharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150048510
- Publication date Feb 19, 2015
- Denso Corporation
- Manabu Tomisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM
- Publication number 20140153167
- Publication date Jun 5, 2014
- ALPHA METALS, INC.
- Rajan Hariharan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGING CONNECTOR AND METHODS FOR ITS PRODUCTION
- Publication number 20130087371
- Publication date Apr 11, 2013
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Metal Layer on a Substrate and Device
- Publication number 20120292773
- Publication date Nov 22, 2012
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PACKAGING A SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE
- Publication number 20120098143
- Publication date Apr 26, 2012
- Tsung-Chi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM
- Publication number 20100084757
- Publication date Apr 8, 2010
- Rajan Hariharan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

using a powder

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer level package (WLP) and method for forming the same

Wafer level package (WLP) and method for forming the same

Method of processing a porous conductive structure in connection to...

Wafer level package (WLP) and method for forming the same

Conductive compositions and methods of using them

Environmental hardened packaged integrated circuit

Semiconductor device and manufacturing method of semiconductor device

Mono-acid hybrid conductive composition and method

Patents Applicationslast 30 patents

Wafer Level Package (WLP) and Method for Forming the Same

Wafer Level Package (WLP) and Method for Forming the Same

METHOD FOR PROCESSING A SUBSTRATE AND AN ELECTRONIC DEVICE

Conductive Compositions and Methods of Using Them

SEMICONDUCTOR DEVICE

CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM

ELECTRONIC PACKAGING CONNECTOR AND METHODS FOR ITS PRODUCTION

Method for Producing a Metal Layer on a Substrate and Device

METHOD FOR PACKAGING A SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE

CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM