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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/11332
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Patents Grants
last 30 patents
Information
Patent Grant
Sintering materials and attachment methods using same
Patent number
11,389,865
Issue date
Jul 19, 2022
Alpha Assembly Solutions Inc.
Shamik Ghoshal
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Method and apparatus for heat sinking high frequency IC with absorb...
Patent number
11,177,227
Issue date
Nov 16, 2021
Anokiwave, Inc.
Gaurav Menon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Assembly comprising hybrid interconnecting means including intermed...
Patent number
11,011,490
Issue date
May 18, 2021
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Rabih Khazaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead-free solder alloy, solder joint, solder paste composition, ele...
Patent number
10,926,360
Issue date
Feb 23, 2021
Tamura Corporation
Masaya Arai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flux, solder paste, and method for forming solder bump
Patent number
10,836,000
Issue date
Nov 17, 2020
Tamura Corporation
Masanori Shibasaki
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic element and electronic device comprising the same
Patent number
10,825,787
Issue date
Nov 3, 2020
Innolux Corporation
Wei-Cheng Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for heat sinking high frequency IC with absorb...
Patent number
10,763,226
Issue date
Sep 1, 2020
Anokiwave, Inc.
Gaurav Menon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing chip-on-chip structure comprising sinterted...
Patent number
10,734,346
Issue date
Aug 4, 2020
ELPIS TECHNOLOGIES INC.
Richard S. Graf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder in cavity interconnection structures
Patent number
10,468,367
Issue date
Nov 5, 2019
Intel Corporation
Chuan Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High temperature solder paste
Patent number
10,391,590
Issue date
Aug 27, 2019
Intel Corporation
Kabir J. Mirpuri
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Chip-on-chip structure and methods of manufacture
Patent number
10,340,241
Issue date
Jul 2, 2019
International Business Machines Corporation
Richard S. Graf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High temperature solder paste
Patent number
10,086,479
Issue date
Oct 2, 2018
Intel Corporation
Kabir J. Mirpuri
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Formation of solder and copper interconnect structures and associat...
Patent number
10,068,863
Issue date
Sep 4, 2018
Intel Corporation
Edward R. Prack
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sintered conductive matrix material on wire bond
Patent number
9,905,502
Issue date
Feb 27, 2018
Tessera, Inc.
Wael Zohni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ablation method and recipe for wafer level underfill material patte...
Patent number
9,786,517
Issue date
Oct 10, 2017
Intel Corporation
Rajendra C. Dias
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dense interconnect with solder cap (DISC) formation with laser abla...
Patent number
9,741,645
Issue date
Aug 22, 2017
Intel Corporation
Chuan Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods of forming the same
Patent number
9,735,129
Issue date
Aug 15, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor-mounted product and method of producing the same
Patent number
9,627,345
Issue date
Apr 18, 2017
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Atsushi Yamaguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetic contacts
Patent number
9,601,468
Issue date
Mar 21, 2017
Intel Corporation
Michael P. Skinner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Shaped and oriented solder joints
Patent number
9,564,412
Issue date
Feb 7, 2017
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder in cavity interconnection structures
Patent number
9,530,747
Issue date
Dec 27, 2016
Intel Corporation
Chuan Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Formation of solder and copper interconnect structures and associat...
Patent number
9,508,667
Issue date
Nov 29, 2016
Intel Corporation
Edward R. Prack
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip assembly and process with sintering material on metal bumps
Patent number
9,443,822
Issue date
Sep 13, 2016
Tessera, Inc.
Wael Zohni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die assemblies and semiconductor devices including same
Patent number
9,379,091
Issue date
Jun 28, 2016
Micron Technology, Inc.
Luke G. England
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetic contacts
Patent number
9,343,389
Issue date
May 17, 2016
Intel Corporation
Michael P. Skinner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip-chip hybridisation of two microelectronic components using a U...
Patent number
9,318,453
Issue date
Apr 19, 2016
Commissariat a l'Energie Atomique et aux Energies Alternatives
Abdelkader Aliane
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder transfer substrate, manufacturing method of solder transfer...
Patent number
9,238,278
Issue date
Jan 19, 2016
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Daisuke Sakurai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flip chip assembly and process with sintering material on metal bumps
Patent number
9,117,811
Issue date
Aug 25, 2015
Tessera, Inc.
Wael Zohni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of solder transfer substrate, solder precoatin...
Patent number
9,027,822
Issue date
May 12, 2015
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Daisuke Sakurai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing semiconductor packaging
Patent number
9,023,727
Issue date
May 5, 2015
ChipMOS Technologies Inc.
Geng Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
POWER SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME,...
Publication number
20230178506
Publication date
Jun 8, 2023
Mitsubishi Electric Corporation
Tatsushi MORISADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND APPARATUS FOR HEAT SINKING HIGH FREQUENCY IC WITH ABSORB...
Publication number
20200294942
Publication date
Sep 17, 2020
Anokiwave, Inc.
Gaurav Menon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER IN CAVITY INTERCONNECTION STRUCTURES
Publication number
20180151529
Publication date
May 31, 2018
Intel Corporation
Chuan Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DRY-REMOVABLE PROTECTIVE COATINGS
Publication number
20170033069
Publication date
Feb 2, 2017
Intel Corporation
Mihir A. Oka
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
FORMATION OF SOLDER AND COPPER INTERCONNECT STRUCTURES AND ASSOCIAT...
Publication number
20170033068
Publication date
Feb 2, 2017
Intel Corporation
Edward R. Prack
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE
Publication number
20160365328
Publication date
Dec 15, 2016
International Business Machines Corporation
Richard S. Graf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR-MOUNTED PRODUCT AND METHOD OF PRODUCING THE SAME
Publication number
20160329295
Publication date
Nov 10, 2016
Panasonic Intellectual Property Management Co., Ltd.
Atsushi YAMAGUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FORMATION OF SOLDER AND COPPER INTERCONNECT STRUCTURES AND ASSOCIAT...
Publication number
20160181217
Publication date
Jun 23, 2016
Intel Corporation
Edward R. Prack
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR COMPONENT, SEMICONDUCTOR-MOUNTED PRODUCT INCLUDING TH...
Publication number
20160035688
Publication date
Feb 4, 2016
YASUO FUKUHARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE ASSEMBLIES AND SEMICONDUCTOR DEVICES INCLUDING SAME
Publication number
20140353815
Publication date
Dec 4, 2014
Luke G. England
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...
Publication number
20140295619
Publication date
Oct 2, 2014
Tanaka Kikinzoku Kogyo K.K.
TOSHINORI OGASHIWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MAGNETIC CONTACTS FOR ELECTRONICS APPLICATIONS
Publication number
20140205851
Publication date
Jul 24, 2014
Ravindranath V. MAHAJAN
B32 - LAYERED PRODUCTS
Information
Patent Application
DENSE INTERCONNECT WITH SOLDER CAP (DISC) FORMATION WITH LASER ABLA...
Publication number
20140035134
Publication date
Feb 6, 2014
Chuan Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE ASSEMBLIES, SEMICONDUCTOR DEVICES INCLUDING SAME,...
Publication number
20140017823
Publication date
Jan 16, 2014
Micron Technology, Inc.
Luke G. England
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER TRANSFER BASE, METHOD FOR PRODUCING SOLDER TRANSFER BASE, AN...
Publication number
20140010991
Publication date
Jan 9, 2014
PANASONIC CORPORATION
Daisuke Sakurai
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGING
Publication number
20140004697
Publication date
Jan 2, 2014
CHIPMOS TECHNOLOGIES INC.
GENG SHIN SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SOLDER TRANSFER SUBSTRATE, SOLDER PRECOATIN...
Publication number
20130181041
Publication date
Jul 18, 2013
PANASONIC CORPORATION
Daisuke Sakurai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SOLDER BALL MOUNTING TOOL
Publication number
20130140344
Publication date
Jun 6, 2013
Jin-Bao Xu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SOLDER IN CAVITY INTERCONNECTION STRUCTURES
Publication number
20130128484
Publication date
May 23, 2013
Chaun Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOARD MODULE MANUFACTURING METHOD, BOARD MODULE, AND BOARD MODULE A...
Publication number
20130088839
Publication date
Apr 11, 2013
Fujitsu Limited
Takatoyo YAMAKAMI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SYSTEMS AND METHODS FOR HIGH ASPECT RATIO FLIP-CHIP INTERCONNECTS
Publication number
20130070436
Publication date
Mar 21, 2013
of Arizona
Jemmy Sutanto
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DIE ASSEMBLIES, SEMICONDUCTOR DEVICES INCLUDING SAME,...
Publication number
20130026643
Publication date
Jan 31, 2013
Micron Technology, Inc.
Luke G. England
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP-CHIP QFN STRUCTURE USING ETCHED LEAD FRAME
Publication number
20130001757
Publication date
Jan 3, 2013
Tessera. Inc.
Chok Chia
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS
Publication number
20120313239
Publication date
Dec 13, 2012
Tessera, Inc.
Wael Zohni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20120252164
Publication date
Oct 4, 2012
TOKYO ELECTRON LIMITED
Ken NAKAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER IN CAVITY INTERCONNECTION STRUCTURES
Publication number
20120241965
Publication date
Sep 27, 2012
Chuan Hu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20120205796
Publication date
Aug 16, 2012
Hynix Semiconductor Inc.
Si Han KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PACKAGING A SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE
Publication number
20120098143
Publication date
Apr 26, 2012
Tsung-Chi WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH A REDUCED VOLUME AND THICKNESS AND CAPAB...
Publication number
20120009775
Publication date
Jan 12, 2012
Hynix Semiconductor Inc.
Chang Jun PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER BUMP FORMATION ON A CIRCUIT BOARD USING A TRANSFER SHEET
Publication number
20110297433
Publication date
Dec 8, 2011
SENJU METAL INDUSTRY CO., LTD.
Takeo Kuramoto
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR