using a powder

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CPC
H01L2224/27442

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/27442using a powder

Industries

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for fabricating silicon die stacks for electron...
- Patent number 12,027,489
- Issue date Jul 2, 2024
- Ukyo Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a connecting medium on an assembly partner, me...
- Patent number 10,615,138
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Nicolas Heuck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of attaching an electronic part to a copper plate having a s...
- Patent number 9,831,157
- Issue date Nov 28, 2017
- Dowa Metaltech Co., Ltd.
- Naoya Sunachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip metal alloy thermal interface material
- Patent number 9,780,067
- Issue date Oct 3, 2017
- Advanced Micro Devices, Inc.
- Daniel Cavasin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a material-bonding connection between a semico...
- Patent number 9,659,793
- Issue date May 23, 2017
- Infineon Technologies AG
- Nicolas Heuck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder paste
- Patent number 9,610,655
- Issue date Apr 4, 2017
- LG Innotek Co., Ltd
- Deok Ki Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Preform structure for soldering a semiconductor chip arrangement, a...
- Patent number 9,536,851
- Issue date Jan 3, 2017
- Infineon Technologies AG
- Friedrich Kroener
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit arrangement for a thermally conductive chip assembly and a...
- Patent number 9,224,666
- Issue date Dec 29, 2015
- Rhode & Schwarz GmbH & Co. KG
- Robert Ziegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacting means and method for contacting electrical components
- Patent number 8,925,789
- Issue date Jan 6, 2015
- Heraeus Materials Technology GmbH & Co. KG
- Michael Schäfer
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...
- Publication number 20240371819
- Publication date Nov 7, 2024
- NANO-X IMAGING LTD.
- Ukyo JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...
- Publication number 20240047415
- Publication date Feb 8, 2024
- NANO-X IMAGING LTD
- Ukyo JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP METAL ALLOY THERMAL INTERFACE MATERIAL
- Publication number 20160358884
- Publication date Dec 8, 2016
- Daniel Cavasin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREFORM STRUCTURE FOR SOLDERING A SEMICONDUCTOR CHIP ARRANGEMENT, A...
- Publication number 20160071814
- Publication date Mar 10, 2016
- INFINEON TECHNOLOGIES AG
- Friedrich Kroener
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PASTE
- Publication number 20140332116
- Publication date Nov 13, 2014
- LG Innotek Co., Ltd.
- Deok Ki Hwang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140284795
- Publication date Sep 25, 2014
- SK HYNIX INC.
- Sang Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT ARRANGEMENT FOR A THERMALLY CONDUCTIVE CHIP ASSEMBLY AND A...
- Publication number 20130277846
- Publication date Oct 24, 2013
- ROHDE & SCHWARZ GMBH & CO. KG
- Robert Ziegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Metal Layer on a Substrate and Device
- Publication number 20120292773
- Publication date Nov 22, 2012
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Contacting Means and Method for Contacting Electrical Components
- Publication number 20120055978
- Publication date Mar 8, 2012
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Michael SCHÄFER
- B22 - CASTING POWDER METALLURGY

using a powder

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for fabricating silicon die stacks for electron...

Method for producing a connecting medium on an assembly partner, me...

Method of attaching an electronic part to a copper plate having a s...

Semiconductor chip metal alloy thermal interface material

Method for producing a material-bonding connection between a semico...

Solder paste

Preform structure for soldering a semiconductor chip arrangement, a...

Circuit arrangement for a thermally conductive chip assembly and a...

Contacting means and method for contacting electrical components

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...

SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...

SEMICONDUCTOR CHIP METAL ALLOY THERMAL INTERFACE MATERIAL

PREFORM STRUCTURE FOR SOLDERING A SEMICONDUCTOR CHIP ARRANGEMENT, A...

SOLDER PASTE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT ARRANGEMENT FOR A THERMALLY CONDUCTIVE CHIP ASSEMBLY AND A...

Method for Producing a Metal Layer on a Substrate and Device

Contacting Means and Method for Contacting Electrical Components