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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/9511using a rack or rail

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Patents Grantslast 30 patents

Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 12,165,881
- Issue date Dec 10, 2024
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Chip bonding apparatus and securing assembly therefor
- Patent number 12,074,133
- Issue date Aug 27, 2024
- GUANGZHOU AIFO LIGHT COMMUNICATION TECHNOLOGY COMPANY LTD.
- Guoqiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,843,085
- Issue date Dec 12, 2023
- Innolux Corporation
- Shun-Yuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 11,756,800
- Issue date Sep 12, 2023
- Rashid Mavliev
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
High registration particles-transferring system
- Patent number 11,732,362
- Issue date Aug 22, 2023
- Xerox Corporation
- Yunda Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device and method for manufacturing the same
- Patent number 11,545,606
- Issue date Jan 3, 2023
- Innolux Corporation
- Shun-Yuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for bonding a chip to a substrate
- Patent number 11,476,228
- Issue date Oct 18, 2022
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Gari Arutinov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method for manufacturing the same
- Patent number 11,063,195
- Issue date Jul 13, 2021
- Innolux Corporation
- Shun-Yuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming complex electronic circuits by interconnecting g...
- Patent number 10,964,665
- Issue date Mar 30, 2021
- Nthdegree Technologies Worldwide, Inc.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing plurality of electronic circ...
- Patent number 10,811,383
- Issue date Oct 20, 2020
- Pragmatic Printing Ltd.
- Neil Davies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED module and method for fabricating the same
- Patent number 10,756,071
- Issue date Aug 25, 2020
- LUMENS CO., LTD.
- Taekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED module and method for fabricating the same
- Patent number 10,756,070
- Issue date Aug 25, 2020
- LUMENS CO., LTD.
- Taekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High registration particles-transferring system
- Patent number 10,604,843
- Issue date Mar 31, 2020
- Xerox Corporation
- Yunda Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for fabricating LED module using transfer tape
- Patent number 10,559,554
- Issue date Feb 11, 2020
- LUMENS CO., LTD.
- Taekyung Yoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for stacking devices in an integrated circuit...
- Patent number 10,515,838
- Issue date Dec 24, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of batch transferring micro semiconductor structures
- Patent number 10,504,872
- Issue date Dec 10, 2019
- Ultra Display Technology Corp.
- Hsien-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing complex electronic circuits using a printable solution def...
- Patent number 10,499,499
- Issue date Dec 3, 2019
- NthDegree Technologies Worldwide Inc.
- William Johnstone Ray
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED module and method for fabricating the same
- Patent number 10,468,392
- Issue date Nov 5, 2019
- LUMENS CO., LTD.
- Taekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Equipment system using deformable organic silicone resin photoconve...
- Patent number 10,103,294
- Issue date Oct 16, 2018
- JIANGSU CHERRITY OPTRONICS CO., LTD
- Jinhua He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED Module and method for fabricating the same
- Patent number 10,103,131
- Issue date Oct 16, 2018
- LUMENS CO., LTD.
- Taekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clips defining electrical pathway on a flexible sheet
- Patent number 10,079,223
- Issue date Sep 18, 2018
- OSRAM SYLVANIA Inc.
- Richard Speer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for assembling a component with a flexible foi...
- Patent number 9,918,392
- Issue date Mar 13, 2018
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Gari Arutinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing complex electronic circuits using a patterned hydrophobic...
- Patent number 9,913,371
- Issue date Mar 6, 2018
- NthDegree Technologies Worldwide Inc.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing complex electronic circuits
- Patent number 9,572,249
- Issue date Feb 14, 2017
- Nthdegree Technologies Worldwide Inc.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact smart card
- Patent number 9,524,459
- Issue date Dec 20, 2016
- Johnson Electric S.A.
- Vincent Daniel Jean Salle
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-terminal printed devices interconnected as circuits
- Patent number 9,275,978
- Issue date Mar 1, 2016
- NthDegree Technologies Worldwide Inc.
- Richard Austin Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-terminal printed devices interconnected as circuits
- Patent number 9,099,568
- Issue date Aug 4, 2015
- NthDegree Technologies Worldwide Inc.
- Richard Austin Blanchard
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240072230
- Publication date Feb 29, 2024
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH REGISTRATION PARTICLES-TRANSFERRING SYSTEM
- Publication number 20230366093
- Publication date Nov 16, 2023
- Xerox Corporation
- Yunda Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS USING ENGI...
- Publication number 20230369065
- Publication date Nov 16, 2023
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20210313501
- Publication date Oct 7, 2021
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210296551
- Publication date Sep 23, 2021
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH REGISTRATION PARTICLES-TRANSFERRING SYSTEM
- Publication number 20200173026
- Publication date Jun 4, 2020
- Xerox Corporation
- Yunda Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LED MODULE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200126957
- Publication date Apr 23, 2020
- LUMENS CO., LTD
- Taekyung YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR STACKING DEVICES IN AN INTEGRATED CIRCUIT...
- Publication number 20190088527
- Publication date Mar 21, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING PLURALITY OF ELECTRONIC CIRC...
- Publication number 20190067243
- Publication date Feb 28, 2019
- PRAGMATIC PRINTING LTD
- Neil DAVIES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Equipment System Using Deformable Organic Silicone Resin Photoconve...
- Publication number 20180233636
- Publication date Aug 16, 2018
- Jiangsu Cherrity Optronics Co., Ltd.
- Jinhua He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED MODULE AND METHOD FOR FABRICATING THE SAME
- Publication number 20180145056
- Publication date May 24, 2018
- LUMENS CO., LTD.
- Taekyoung YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures for Wafer Level Package and Methods of Form...
- Publication number 20160172329
- Publication date Jun 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT SMART CARD
- Publication number 20160104063
- Publication date Apr 14, 2016
- JOHNSON ELECTRIC S.A.
- Vincent Daniel Jean SALLE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONTACT SMART CARD
- Publication number 20140306016
- Publication date Oct 16, 2014
- JOHNSON ELECTRIC S.A.
- Vincent Daniel Jean SALLE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTING COMPLEX ELECTRONIC CIRCUITS
- Publication number 20140268591
- Publication date Sep 18, 2014
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-TERMINAL PRINTED DEVICES INTERCONNECTED AS CIRCUITS
- Publication number 20140264460
- Publication date Sep 18, 2014
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- Richard Austin Blanchard
- H01 - BASIC ELECTRIC ELEMENTS

using a rack or rail

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods and systems of forming metal interconnect layers using engi...

Chip bonding apparatus and securing assembly therefor

Electronic device

Methods and systems of forming metal interconnect layers using engi...

High registration particles-transferring system

Electronic device and method for manufacturing the same

Method and system for bonding a chip to a substrate

Electronic device and method for manufacturing the same

Method for forming complex electronic circuits by interconnecting g...

Apparatus and method for manufacturing plurality of electronic circ...

LED module and method for fabricating the same

LED module and method for fabricating the same

High registration particles-transferring system

Method for fabricating LED module using transfer tape

Method and apparatus for stacking devices in an integrated circuit...

Method of batch transferring micro semiconductor structures

Printing complex electronic circuits using a printable solution def...

LED module and method for fabricating the same

Equipment system using deformable organic silicone resin photoconve...

LED Module and method for fabricating the same

Clips defining electrical pathway on a flexible sheet

Method and apparatus for assembling a component with a flexible foi...

Printing complex electronic circuits using a patterned hydrophobic...

Printing complex electronic circuits

Contact smart card

Three-terminal printed devices interconnected as circuits

Three-terminal printed devices interconnected as circuits

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

HIGH REGISTRATION PARTICLES-TRANSFERRING SYSTEM

METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS USING ENGI...

ELECTRONIC DEVICE

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

HIGH REGISTRATION PARTICLES-TRANSFERRING SYSTEM

LED MODULE AND METHOD FOR FABRICATING THE SAME

METHOD AND APPARATUS FOR STACKING DEVICES IN AN INTEGRATED CIRCUIT...

APPARATUS AND METHOD FOR MANUFACTURING PLURALITY OF ELECTRONIC CIRC...

Equipment System Using Deformable Organic Silicone Resin Photoconve...

LED MODULE AND METHOD FOR FABRICATING THE SAME

Interconnect Structures for Wafer Level Package and Methods of Form...

CONTACT SMART CARD

CONTACT SMART CARD

PRINTING COMPLEX ELECTRONIC CIRCUITS

THREE-TERMINAL PRINTED DEVICES INTERCONNECTED AS CIRCUITS