using a reflow oven

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H01L2224/8121

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8121using a reflow oven

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Low cost package warpage solution
- Patent number 12,183,596
- Issue date Dec 31, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,154,882
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,113,044
- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Solder ball application for singular die
- Patent number 11,978,711
- Issue date May 7, 2024
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiative heat collective bonder and gangbonder
- Patent number 11,804,467
- Issue date Oct 31, 2023
- Micron Technology, Inc.
- Chao Wen Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low cost package warpage solution
- Patent number 11,764,080
- Issue date Sep 19, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball application for singular die
- Patent number 11,508,680
- Issue date Nov 22, 2022
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package design and methodology to compensate for die-substrate C...
- Patent number 11,495,568
- Issue date Nov 8, 2022
- NVIDIA Corporation
- Jayprakash Chipalkatti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,476,229
- Issue date Oct 18, 2022
- Kioxia Corporation
- Chikara Miyazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Batch processing oven and method
- Patent number 11,444,053
- Issue date Sep 13, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for processing semiconductor devices
- Patent number 11,355,471
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow oven for batch processing
- Patent number 11,335,662
- Issue date May 17, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low cost package warpage solution
- Patent number 11,328,937
- Issue date May 10, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure and method of manufacturing the same
- Patent number 11,094,661
- Issue date Aug 17, 2021
- Kabushiki Kaisha Toyota Chuo Kenkyusho
- Hirofumi Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 11,037,897
- Issue date Jun 15, 2021
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 10,998,284
- Issue date May 4, 2021
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
IC package design and methodology to compensate for die-substrate C...
- Patent number 10,943,882
- Issue date Mar 9, 2021
- NVIDIA Corporation
- Jayprakash Chipalkatti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective area heating for 3D chip stack
- Patent number 10,903,187
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate device, electronic apparatus, and method for manufacturin...
- Patent number 10,892,241
- Issue date Jan 12, 2021
- Sony Corporation
- Shigekazu Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acrylic composition for encapsulation, sheet material, laminated sh...
- Patent number 10,870,756
- Issue date Dec 22, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shigeru Yamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing solder bump by vacuum annealing
- Patent number 10,784,221
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED module and method for fabricating the same
- Patent number 10,756,071
- Issue date Aug 25, 2020
- LUMENS CO., LTD.
- Taekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED module and method for fabricating the same
- Patent number 10,756,070
- Issue date Aug 25, 2020
- LUMENS CO., LTD.
- Taekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 10,741,419
- Issue date Aug 11, 2020
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,720,402
- Issue date Jul 21, 2020
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,720,410
- Issue date Jul 21, 2020
- TOSHIBA MEMORY CORPORATION
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY
- Publication number 20250112198
- Publication date Apr 3, 2025
- Intel Corporation
- Pratyasha Mohapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20250096009
- Publication date Mar 20, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20250087625
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Young WANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20250046750
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BARE FLIP-CHIP DIE STACK AND THE FABRICATION METHOD AND TOOLING THE...
- Publication number 20250015053
- Publication date Jan 9, 2025
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...
- Publication number 20240395767
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Wafer Oxide Removal and Reflow Treatment
- Publication number 20240282734
- Publication date Aug 22, 2024
- Air Products and Chemicals, Inc.
- Liang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH VARYING THICKNESS PROFILE
- Publication number 20240249950
- Publication date Jul 25, 2024
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240234364
- Publication date Jul 11, 2024
- LG Innotek Co., Ltd.
- Tae Sup CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240178181
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240136322
- Publication date Apr 25, 2024
- LG Innotek Co., Ltd.
- Tae Sup CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20240047410
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR DEPOSITING UNDERFILL MATERIAL
- Publication number 20240038716
- Publication date Feb 1, 2024
- Western Digital Technologies, Inc.
- Choo Par Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20230369071
- Publication date Nov 16, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20230307419
- Publication date Sep 28, 2023
- KIOXIA Corporation
- Soichi HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230268314
- Publication date Aug 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Ball Application for Singular Die
- Publication number 20230055518
- Publication date Feb 23, 2023
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20220302079
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20220230892
- Publication date Jul 21, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Ball Application for Singular Die
- Publication number 20220157749
- Publication date May 19, 2022
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATIVE HEAT COLLECTIVE BONDER AND GANGBONDER
- Publication number 20210407958
- Publication date Dec 30, 2021
- Micron Technology, Inc.
- Chao Wen Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATCH PROCESSING OVEN AND METHOD
- Publication number 20210265301
- Publication date Aug 26, 2021
- Yield Engineering Systems, Inc.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IC PACKAGE DESIGN AND METHODOLOGY TO COMPENSATE FOR DIE-SUBSTRATE C...
- Publication number 20210151403
- Publication date May 20, 2021
- NVIDIA Corporation
- Jayprakash Chipalkatti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE DESIGN AND METHODOLOGY TO COMPENSATE FOR DIE-SUBSTRATE C...
- Publication number 20210066227
- Publication date Mar 4, 2021
- NVIDIA Corporation
- Jayprakash Chipalkatti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20200350181
- Publication date Nov 5, 2020
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20200294960
- Publication date Sep 17, 2020
- Toshiba Memory Corporation
- Chikara MIYAZAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LED MODULE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200126957
- Publication date Apr 23, 2020
- LUMENS CO., LTD
- Taekyung YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device
- Publication number 20200098713
- Publication date Mar 26, 2020
- Rohm Co., Ltd.
- Tadahiro Morifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACRYLIC COMPOSITION FOR ENCAPSULATION, SHEET MATERIAL, LAMINATED SH...
- Publication number 20200010675
- Publication date Jan 9, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- SHIGERU YAMATSU
- H01 - BASIC ELECTRIC ELEMENTS

using a reflow oven

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low cost package warpage solution

Solder reflow apparatus and method of manufacturing an electronic d...

Tools and systems for processing semiconductor devices, and methods...

Semiconductor package and manufacturing method thereof

Low pressure sintering powder

Solder ball application for singular die

Radiative heat collective bonder and gangbonder

Low cost package warpage solution

Solder ball application for singular die

IC package design and methodology to compensate for die-substrate C...

Semiconductor device manufacturing method

Batch processing oven and method

System for processing semiconductor devices

Solder reflow oven for batch processing

Low cost package warpage solution

Bonded structure and method of manufacturing the same

Semiconductor device

Low pressure sintering powder

IC package design and methodology to compensate for die-substrate C...

Selective area heating for 3D chip stack

Substrate device, electronic apparatus, and method for manufacturin...

Acrylic composition for encapsulation, sheet material, laminated sh...

Method of processing solder bump by vacuum annealing

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

LED module and method for fabricating the same

LED module and method for fabricating the same

Low cost package warpage solution

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY

LOW COST PACKAGE WARPAGE SOLUTION

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

BARE FLIP-CHIP DIE STACK AND THE FABRICATION METHOD AND TOOLING THE...

LOW PRESSURE SINTERING POWDER

TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...

Apparatus and Method for Wafer Oxide Removal and Reflow Treatment

SEMICONDUCTOR CHIP WITH VARYING THICKNESS PROFILE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

SYSTEM AND METHOD FOR DEPOSITING UNDERFILL MATERIAL

LOW COST PACKAGE WARPAGE SOLUTION

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Solder Ball Application for Singular Die

Tools and Systems for Processing Semiconductor Devices, and Methods...

LOW COST PACKAGE WARPAGE SOLUTION

Solder Ball Application for Singular Die

RADIATIVE HEAT COLLECTIVE BONDER AND GANGBONDER

BATCH PROCESSING OVEN AND METHOD

IC PACKAGE DESIGN AND METHODOLOGY TO COMPENSATE FOR DIE-SUBSTRATE C...

IC PACKAGE DESIGN AND METHODOLOGY TO COMPENSATE FOR DIE-SUBSTRATE C...

LOW COST PACKAGE WARPAGE SOLUTION

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

LED MODULE AND METHOD FOR FABRICATING THE SAME

Semiconductor Device

ACRYLIC COMPOSITION FOR ENCAPSULATION, SHEET MATERIAL, LAMINATED SH...