using an inorganic non metallic glass type adhesive

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CPC
H01L2224/8289

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8289using an inorganic non metallic glass type adhesive

Industries

Patents Grantslast 30 patents

Information Patent Grant
Redistribution layer (RDL) layouts for integrated circuits
- Patent number 12,021,054
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,848,304
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer (RDL) layouts for integrated circuits
- Patent number 11,791,299
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,410,968
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielets on flexible and stretchable packaging for microelectronics
- Patent number 11,355,443
- Issue date Jun 7, 2022
- Invensas Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engineered substrate with embedded mirror
- Patent number 11,251,321
- Issue date Feb 15, 2022
- Soitec
- Eric Guiot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method for producing same
- Patent number 10,932,386
- Issue date Feb 23, 2021
- Dyconex AG
- Marc Hauer
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Forming metal bonds with recesses
- Patent number 10,854,574
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming metal bonds with recesses
- Patent number 10,685,935
- Issue date Jun 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,586,746
- Issue date Mar 10, 2020
- CHIP SOLUTIONS, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stitched devices
- Patent number 10,535,645
- Issue date Jan 14, 2020
- ALSEPHINA INNOVATIONS INC.
- Wei Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,511,080
- Issue date Dec 17, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Won Wook So
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielets on flexible and stretchable packaging for microelectronics
- Patent number 10,403,577
- Issue date Sep 3, 2019
- Invensas Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Releasable carrier method
- Patent number 10,354,907
- Issue date Jul 16, 2019
- CHIP SOLUTIONS, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Releasable carrier and method
- Patent number 10,332,775
- Issue date Jun 25, 2019
- CHIP SOLUTIONS, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 9,941,146
- Issue date Apr 10, 2018
- CHIP SOLUTIONS, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 9,922,949
- Issue date Mar 20, 2018
- CHIP SOLUTIONS, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 9,847,244
- Issue date Dec 19, 2017
- CHIP SOLUTIONS, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 9,812,347
- Issue date Nov 7, 2017
- CHIP SOLUTIONS, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for metalizing blind vias
- Patent number 9,003,654
- Issue date Apr 14, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Fabrice Jacquet
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming the Same
- Publication number 20240063177
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer (RDL) Layouts for Integrated Circuits
- Publication number 20230378116
- Publication date Nov 23, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACKING STRUCTURE AND PREPARATION METHOD THEREOF, CHIP STACKI...
- Publication number 20230369292
- Publication date Nov 16, 2023
- Huawei Technologies Co., Ltd
- Shan GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING THREE-DIMENSIONAL SYSTEM-ON-CHIP AND THREE-...
- Publication number 20220375918
- Publication date Nov 24, 2022
- TZU-WEI CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming the Same
- Publication number 20220359460
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELETS ON FLEXIBLE AND STRETCHABLE PACKAGING FOR MICROELECTRONICS
- Publication number 20220278048
- Publication date Sep 1, 2022
- Invensas Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD AND BONDED WAFER
- Publication number 20220189822
- Publication date Jun 16, 2022
- Yangtze Memory Technologies Co., Ltd.
- Chao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20210118844
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Cimpany, Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Metal Bonds with Recesses
- Publication number 20200006288
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELETS ON FLEXIBLE AND STRETCHABLE PACKAGING FOR MICROELECTRONICS
- Publication number 20190341350
- Publication date Nov 7, 2019
- Invensas Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER (RDL) LAYOUTS FOR INTEGRATED CIRCUITS
- Publication number 20190164924
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Metal Bonds with Recesses
- Publication number 20190148336
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERMANENT FUNCTIONAL CARRIER SYSTEMS AND METHODS
- Publication number 20190057950
- Publication date Feb 21, 2019
- Intel Corporation
- Brennen K. Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20190058241
- Publication date Feb 21, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Won Wook SO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELEASABLE CARRIER METHOD
- Publication number 20180261489
- Publication date Sep 13, 2018
- Chip Solutions, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20170207184
- Publication date Jul 20, 2017
- Chip Solutions, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STITCHED DEVICES
- Publication number 20170125396
- Publication date May 4, 2017
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Wei SHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BOND USING A COPPER ALLOY FOR YIELD IMPROVEMENT
- Publication number 20170025381
- Publication date Jan 26, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Cheng Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20170018526
- Publication date Jan 19, 2017
- Chip Solutions, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Interconnect Apparatus and Method
- Publication number 20150179612
- Publication date Jun 25, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR METALIZING BLIND VIAS
- Publication number 20110219612
- Publication date Sep 15, 2011
- Comm. á I'éner. atom. et aux énergies alter.
- Fabrice JACQUET
- H01 - BASIC ELECTRIC ELEMENTS

using an inorganic non metallic glass type adhesive

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Redistribution layer (RDL) layouts for integrated circuits

Semiconductor device and method of forming the same

Redistribution layer (RDL) layouts for integrated circuits

Semiconductor device and method of forming the same

Dielets on flexible and stretchable packaging for microelectronics

Engineered substrate with embedded mirror

Electronic module and method for producing same

Forming metal bonds with recesses

Forming metal bonds with recesses

Semiconductor device and method

Stitched devices

Fan-out semiconductor package

Dielets on flexible and stretchable packaging for microelectronics

Releasable carrier method

Releasable carrier and method

Semiconductor device and method

Semiconductor device and method

Semiconductor device and method

Semiconductor device and method

Method for metalizing blind vias

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming the Same

Redistribution Layer (RDL) Layouts for Integrated Circuits

CHIP STACKING STRUCTURE AND PREPARATION METHOD THEREOF, CHIP STACKI...

METHOD OF MANUFACTURING THREE-DIMENSIONAL SYSTEM-ON-CHIP AND THREE-...

Semiconductor Device and Method of Forming the Same

DIELETS ON FLEXIBLE AND STRETCHABLE PACKAGING FOR MICROELECTRONICS

WAFER BONDING METHOD AND BONDED WAFER

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Forming Metal Bonds with Recesses

DIELETS ON FLEXIBLE AND STRETCHABLE PACKAGING FOR MICROELECTRONICS

REDISTRIBUTION LAYER (RDL) LAYOUTS FOR INTEGRATED CIRCUITS

Forming Metal Bonds with Recesses

PERMANENT FUNCTIONAL CARRIER SYSTEMS AND METHODS

FAN-OUT SEMICONDUCTOR PACKAGE

RELEASABLE CARRIER METHOD

SEMICONDUCTOR DEVICE AND METHOD

STITCHED DEVICES

HYBRID BOND USING A COPPER ALLOY FOR YIELD IMPROVEMENT

SEMICONDUCTOR DEVICE AND METHOD

3DIC Interconnect Apparatus and Method

METHOD FOR METALIZING BLIND VIAS