using at least one connector not provided for in any of the groups H01L2224/81 - H01L2224/86

Industry

CPC
H01L2224/89

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/89using at least one connector not provided for in any of the groups H01L2224/81 - H01L2224/86

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,456,240
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging structure having through interposer...
- Patent number 10,756,010
- Issue date Aug 25, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device packaging structure ha...
- Patent number 10,510,650
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using MEMS fabrication incorporating into LED device mounting and a...
- Patent number 10,403,804
- Issue date Sep 3, 2019
- Epistar Corporation
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via and trench filling using injection molded soldering
- Patent number 10,383,572
- Issue date Aug 20, 2019
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via and trench filling using injection molded soldering
- Patent number 10,258,279
- Issue date Apr 16, 2019
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via and trench filling using injection molded soldering
- Patent number 10,130,302
- Issue date Nov 20, 2018
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Using MEMS fabrication incorporating into LED device mounting and a...
- Patent number 10,026,882
- Issue date Jul 17, 2018
- Epistar Corporation
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via and trench filling using injection molded soldering
- Patent number 9,773,751
- Issue date Sep 26, 2017
- International Business Machines Corporation
- John U. Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP BONDING METHOD
- Publication number 20230377938
- Publication date Nov 23, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Wanli GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20220384327
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20200388563
- Publication date Dec 10, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20200118915
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING
- Publication number 20180344245
- Publication date Dec 6, 2018
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING
- Publication number 20180005982
- Publication date Jan 4, 2018
- International Business Machines Corporation
- John U. Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE TOPSIDE BALL GRID ARRAY FOR ULTRA LOW Z-HEIGHT
- Publication number 20170092618
- Publication date Mar 30, 2017
- Intel Corporation
- David Huitink
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STACK PROTECTION SEAL
- Publication number 20160343629
- Publication date Nov 24, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Ranjan RAJOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flat semiconductor device and power converter employing the same
- Publication number 20020145188
- Publication date Oct 10, 2002
- Hironori Kodama
- H01 - BASIC ELECTRIC ELEMENTS

using at least one connector not provided for in any of the groups H01L2224/81 - H01L2224/86

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of manufacture

Semiconductor device packaging structure having through interposer...

Method of manufacturing semiconductor device packaging structure ha...

Using MEMS fabrication incorporating into LED device mounting and a...

Via and trench filling using injection molded soldering

Via and trench filling using injection molded soldering

Via and trench filling using injection molded soldering

Using MEMS fabrication incorporating into LED device mounting and a...

Via and trench filling using injection molded soldering

Patents Applicationslast 30 patents

CHIP BONDING METHOD

Semiconductor Device and Method of Manufacture

Semiconductor Device and Method of Manufacture

Semiconductor Device and Method of Manufacture

VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING

VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING

PACKAGE TOPSIDE BALL GRID ARRAY FOR ULTRA LOW Z-HEIGHT

WAFER STACK PROTECTION SEAL

Flat semiconductor device and power converter employing the same