using auxiliary conductive elements

Industry

CPC
H05K3/4046

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4046using auxiliary conductive elements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,036,776
- Issue date Jul 16, 2024
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Substrate structure and manufacturing method thereof, electronic de...
- Patent number 11,917,758
- Issue date Feb 27, 2024
- PANELSEMI CORPORATION
- Ya-Che Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal drop ejecting three-dimensional (3D) object printer
- Patent number 11,737,216
- Issue date Aug 22, 2023
- Xerox Corporation
- Denis Cormier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate connection member comprising substrate having opening par...
- Patent number 11,690,179
- Issue date Jun 27, 2023
- Samsung Electronics Co., Ltd.
- Sungchul Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and semiconductor device including the same
- Patent number 11,602,056
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer structure and related method of manufacture for electronics
- Patent number 11,594,482
- Issue date Feb 28, 2023
- TACTOTEK OY
- Jarmo Sääski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a sealed electrical connection in a ceramic ca...
- Patent number 11,576,258
- Issue date Feb 7, 2023
- Photonis France
- Stéphane Personne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Continuous extrusion method for manufacturing a Z-directed componen...
- Patent number 11,390,005
- Issue date Jul 19, 2022
- Lexmark International, Inc.
- Keith Bryan Hardin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing electrical connections
- Patent number 11,317,518
- Issue date Apr 26, 2022
- Lewis James Marggraff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tapered broadband balun
- Patent number 11,189,900
- Issue date Nov 30, 2021
- Corning Research & Development Corporation
- Jesús Anzoátegui Cumana Morales
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multilayer structure and related method of manufacture for electronics
- Patent number 11,088,066
- Issue date Aug 10, 2021
- TACTOTEK OY
- Jarmo Sääski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional circuit formation
- Patent number 11,076,492
- Issue date Jul 27, 2021
- AVERATEK CORPORATION
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit boards
- Patent number 10,973,131
- Issue date Apr 6, 2021
- International Business Machines Corporation
- Joseph Kuczynski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor unit, temperature sensor including the same, method of manuf...
- Patent number 10,942,070
- Issue date Mar 9, 2021
- HAESUNG DS CO., LTD.
- Jin Woo Lee
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing method of circuit board and of semiconductor device i...
- Patent number 10,888,000
- Issue date Jan 5, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable inductor through electrochemically controlled capillarity
- Patent number 10,834,829
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Stuart B. Benefield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed wiring board, electronic device having flexible pr...
- Patent number 10,784,642
- Issue date Sep 22, 2020
- Ibiden Co., Ltd.
- Takahisa Hirasawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductor connection structure for plate-like routing members
- Patent number 10,638,607
- Issue date Apr 28, 2020
- Yazaki Corporation
- Masahito Ozaki
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Anisotropic conductive treads for electrical connections in soft el...
- Patent number 10,612,172
- Issue date Apr 7, 2020
- University of Louisville Research Foundation, Inc.
- Cindy Harnett
- D05 - SEWING EMBROIDERING TUFTING
Information Patent Grant
Circuit board, semiconductor device including the same, and manufac...
- Patent number 10,555,424
- Issue date Feb 4, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-less stackable package with wire-bond interconnect
- Patent number 10,510,659
- Issue date Dec 17, 2019
- Invensas Corporation
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical wire connections for integrated circuit package
- Patent number 10,490,527
- Issue date Nov 26, 2019
- Intel IP Corporation
- Christian Geissler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic feedthrough for an implantable medical device
- Patent number 10,471,266
- Issue date Nov 12, 2019
- Medtronic, Inc.
- Kengo Morioka
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Implementing customized PCB via creation through use of magnetic pads
- Patent number 10,433,431
- Issue date Oct 1, 2019
- International Business Machines Corporation
- Gerald K. Bartley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical power supply device for at least one LED and at least on...
- Patent number 10,427,585
- Issue date Oct 1, 2019
- Valeo Iluminacion
- Jose-David Roldan
- B60 - VEHICLES IN GENERAL
Information Patent Grant
System including a conductive textile and an electronic circuit uni...
- Patent number 10,412,830
- Issue date Sep 10, 2019
- Imec VZW
- Riet Labie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing electrical connections
- Patent number 10,412,840
- Issue date Sep 10, 2019
- DOTSLAM, INC.
- Lewis James Marggraff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implementing customized PCB via creation through use of magnetic pads
- Patent number 10,342,142
- Issue date Jul 2, 2019
- International Business Machines Corporation
- Gerald K. Bartley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting metal foils/wires and components in 3D printed substrate...
- Patent number 10,259,081
- Issue date Apr 16, 2019
- Board of Regents, The University of Texas System
- Eric MacDonald
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing stacked mounting structure
- Patent number 10,244,639
- Issue date Mar 26, 2019
- Olympus Corporation
- Mikio Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20240188226
- Publication date Jun 6, 2024
- Innolux Corporation
- Wei-Lun Shieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240023251
- Publication date Jan 18, 2024
- Unimicron Technology Corp.
- Shao-Chien LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR OPERATING A METAL DROP EJECTING THREE-DIMENSIONAL (3D) O...
- Publication number 20230309241
- Publication date Sep 28, 2023
- Xerox Corporation
- Denis Cormier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE FOR DISPLAY DEVICE
- Publication number 20230276580
- Publication date Aug 31, 2023
- AUO Corporation
- Chi-Sheng Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20230199973
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STUD BUMPED PRINTED CIRCUIT ASSEMBLY
- Publication number 20230041747
- Publication date Feb 9, 2023
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR OPERATING A METAL DROP EJECTING THREE-DIMENSI...
- Publication number 20220240387
- Publication date Jul 28, 2022
- Xerox Corporation
- Denis Cormier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF, ELECTRONIC DE...
- Publication number 20220210916
- Publication date Jun 30, 2022
- HUA YA APPLIED MATERIALS COMPANY LIMITED
- YA-CHE SHUEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CONNECTION MEMBER COMPRISING SUBSTRATE HAVING OPENING PAR...
- Publication number 20210360796
- Publication date Nov 18, 2021
- Samsung Electronics Co., Ltd.
- Sungchul PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE DIMENSIONAL CIRCUIT FORMATION
- Publication number 20210345498
- Publication date Nov 4, 2021
- Averatek Corporation
- Shinichi IKETANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING RESIN MULTI...
- Publication number 20210283890
- Publication date Sep 16, 2021
- Murata Manufacturing Co., Ltd.
- Yusuke KAMITSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAPERED BROADBAND BALUN
- Publication number 20210159579
- Publication date May 27, 2021
- Corning Research & Development Corporation
- Jesús Anzoátegui Cumana Morales
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20210127500
- Publication date Apr 29, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT-WIRE COPPER VERTICAL LAUNCH MICROWAVE INTERCONNECTION METHOD
- Publication number 20200367357
- Publication date Nov 19, 2020
- Raytheon Company
- James E. Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A SEALED ELECTRICAL CONNECTION IN A CERAMIC CA...
- Publication number 20200275551
- Publication date Aug 27, 2020
- PHOTONIS FRANCE
- Stéphane Personne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND MANUFAC...
- Publication number 20200275557
- Publication date Aug 27, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Yi Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FEEDTHROUGH FABRICATION METHOD AND METHOD OF FABRICATING ENCAPSULAT...
- Publication number 20200267846
- Publication date Aug 20, 2020
- TODOC CO., LTD.
- Kyou-Sik MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE DIMENSIONAL CIRCUIT FORMATION
- Publication number 20200196456
- Publication date Jun 18, 2020
- Averatek Corporation
- Shinichi IKETANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND MATERIAL TO CREATE PRINTED CIRCUIT BOARDS
- Publication number 20200015362
- Publication date Jan 9, 2020
- International Business Machines Corporation
- Joseph KUCZYNSKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR UNIT, TEMPERATURE SENSOR INCLUDING THE SAME, METHOD OF MANUF...
- Publication number 20190353531
- Publication date Nov 21, 2019
- HAESUNG DS CO., LTD
- Jin Woo LEE
- G01 - MEASURING TESTING
Information Patent Application
ANISOTROPIC CONDUCTIVE TREADS FOR ELECTRICAL CONNECTIONS IN SOFT EL...
- Publication number 20190257015
- Publication date Aug 22, 2019
- UNIVERSITY OF LOUISVILLE RESEARCH FOUNDATION, INC.
- Cindy HARNETT
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Application
IMPLEMENTING CUSTOMIZED PCB VIA CREATION THROUGH USE OF MAGNETIC PADS
- Publication number 20190254176
- Publication date Aug 15, 2019
- International Business Machines Corporation
- Gerald K. Bartley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
- Publication number 20190172782
- Publication date Jun 6, 2019
- STMicroelectronics S.r.l
- Federico Giovanni Ziglioli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD FOR WIRING BOARD
- Publication number 20190116661
- Publication date Apr 18, 2019
- Fujitsu Limited
- Takashi FUKUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE-LESS STACKABLE PACKAGE WITH WIRE-BOND INTERCONNECT
- Publication number 20190096803
- Publication date Mar 28, 2019
- Invensas Corporation
- Ilyas Mohammed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTINUOUS EXTRUSION METHOD FOR MANUFACTURING A Z-DIRECTED COMPONEN...
- Publication number 20190084208
- Publication date Mar 21, 2019
- Lexmark International, Inc.
- KEITH BRYAN HARDIN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PCB Assembly with Molded Matrix Core
- Publication number 20190075655
- Publication date Mar 7, 2019
- Apple Inc.
- Albert Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPLEMENTING CUSTOMIZED PCB VIA CREATION THROUGH USE OF MAGNETIC PADS
- Publication number 20190037709
- Publication date Jan 31, 2019
- International Business Machines Corporation
- Gerald K. Bartley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnection System with Flexible Pins
- Publication number 20180284156
- Publication date Oct 4, 2018
- Intel Corporation
- Jorge A. Alvarez Gonzalez
- G01 - MEASURING TESTING
Information Patent Application
Substrate-Less Stackable Package With Wire-Bond Interconnect
- Publication number 20180233448
- Publication date Aug 16, 2018
- Invensas Corporation
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS

using auxiliary conductive elements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Resin multilayer substrate and method for manufacturing resin multi...

Substrate structure and manufacturing method thereof, electronic de...

Metal drop ejecting three-dimensional (3D) object printer

Substrate connection member comprising substrate having opening par...

Circuit board and semiconductor device including the same

Multilayer structure and related method of manufacture for electronics

Method for producing a sealed electrical connection in a ceramic ca...

Continuous extrusion method for manufacturing a Z-directed componen...

Method for producing electrical connections

Tapered broadband balun

Multilayer structure and related method of manufacture for electronics

Three dimensional circuit formation

Method of manufacturing printed circuit boards

Sensor unit, temperature sensor including the same, method of manuf...

Manufacturing method of circuit board and of semiconductor device i...

Variable inductor through electrochemically controlled capillarity

Flexible printed wiring board, electronic device having flexible pr...

Conductor connection structure for plate-like routing members

Anisotropic conductive treads for electrical connections in soft el...

Circuit board, semiconductor device including the same, and manufac...

Substrate-less stackable package with wire-bond interconnect

Vertical wire connections for integrated circuit package

Hermetic feedthrough for an implantable medical device

Implementing customized PCB via creation through use of magnetic pads

Electrical power supply device for at least one LED and at least on...

System including a conductive textile and an electronic circuit uni...

Method for producing electrical connections

Implementing customized PCB via creation through use of magnetic pads

Connecting metal foils/wires and components in 3D printed substrate...

Method of manufacturing stacked mounting structure

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR OPERATING A METAL DROP EJECTING THREE-DIMENSIONAL (3D) O...

CIRCUIT BOARD STRUCTURE FOR DISPLAY DEVICE

CIRCUIT BOARD AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

STUD BUMPED PRINTED CIRCUIT ASSEMBLY

METHOD AND SYSTEM FOR OPERATING A METAL DROP EJECTING THREE-DIMENSI...

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF, ELECTRONIC DE...

SUBSTRATE CONNECTION MEMBER COMPRISING SUBSTRATE HAVING OPENING PAR...

THREE DIMENSIONAL CIRCUIT FORMATION

RESIN MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING RESIN MULTI...

TAPERED BROADBAND BALUN

CIRCUIT BOARD AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

FLAT-WIRE COPPER VERTICAL LAUNCH MICROWAVE INTERCONNECTION METHOD

METHOD FOR PRODUCING A SEALED ELECTRICAL CONNECTION IN A CERAMIC CA...

CIRCUIT BOARD, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND MANUFAC...

FEEDTHROUGH FABRICATION METHOD AND METHOD OF FABRICATING ENCAPSULAT...

THREE DIMENSIONAL CIRCUIT FORMATION

METHOD AND MATERIAL TO CREATE PRINTED CIRCUIT BOARDS

SENSOR UNIT, TEMPERATURE SENSOR INCLUDING THE SAME, METHOD OF MANUF...

ANISOTROPIC CONDUCTIVE TREADS FOR ELECTRICAL CONNECTIONS IN SOFT EL...

IMPLEMENTING CUSTOMIZED PCB VIA CREATION THROUGH USE OF MAGNETIC PADS

PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...

WIRING BOARD AND MANUFACTURING METHOD FOR WIRING BOARD

SUBSTRATE-LESS STACKABLE PACKAGE WITH WIRE-BOND INTERCONNECT

CONTINUOUS EXTRUSION METHOD FOR MANUFACTURING A Z-DIRECTED COMPONEN...

PCB Assembly with Molded Matrix Core

IMPLEMENTING CUSTOMIZED PCB VIA CREATION THROUGH USE OF MAGNETIC PADS

Interconnection System with Flexible Pins

Substrate-Less Stackable Package With Wire-Bond Interconnect