using auxiliary mounted passive components or auxiliary substances

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CPC
H05K1/023

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/023using auxiliary mounted passive components or auxiliary substances

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Resin composition for protective layer of electromagnetic wave-shie...
- Patent number 12,297,333
- Issue date May 13, 2025
- Tatsuta Electric Wire & Cable Co., Ltd.
- Akio Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Signal processing board and image forming apparatus
- Patent number 12,295,093
- Issue date May 6, 2025
- Kyocera Document Solutions Inc.
- Shotaro Ikegami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metamaterial electromagnetic absorber
- Patent number 12,289,823
- Issue date Apr 29, 2025
- Hyundai Motor Company
- Seung Hyun Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PCB tuning for waveguide antennae
- Patent number 12,283,736
- Issue date Apr 22, 2025
- MAGNA ELECTRONICS, LLC
- Angelos Alexanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module and method for manufacturing submodule
- Patent number 12,279,374
- Issue date Apr 15, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency line structure with lead pin-connected substrates
- Patent number 12,278,413
- Issue date Apr 15, 2025
- Nippon Telegraph and Telephone Corporation
- Hiromasa Tanobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna device and electronic device including the same
- Patent number 12,274,004
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Minki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package and camera device comprising same
- Patent number 12,273,605
- Issue date Apr 8, 2025
- LG Innotek Co., Ltd
- Seong Su Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer resin substrate and method for producing same
- Patent number 12,269,238
- Issue date Apr 8, 2025
- Murata Manufacturing Co., Ltd.
- Yoshimasa Nishi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Dense via pitch interconnect to increase wiring density
- Patent number 12,266,598
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Francesco Preda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of wide bandgap power electronic power stages
- Patent number 12,261,489
- Issue date Mar 25, 2025
- Deere & Company
- Brij N Singh
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic device with differential transmission lines equipped wit...
- Patent number 12,260,996
- Issue date Mar 25, 2025
- Murata Manufacturing Co., Ltd.
- Stéphane Bouvier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer line structure
- Patent number 12,255,145
- Issue date Mar 18, 2025
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-resin composite, surface treatment method, and substrate of c...
- Patent number 12,251,862
- Issue date Mar 18, 2025
- Nanjing University
- Wei Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Package board, antenna package including the same and image display...
- Patent number 12,255,414
- Issue date Mar 18, 2025
- Dongwoo Fine-Chem Co., Ltd.
- Na Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency electronic component and module
- Patent number 12,245,365
- Issue date Mar 4, 2025
- Murata Manufacturing Co., Ltd.
- Hirofumi Oie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,237,556
- Issue date Feb 25, 2025
- Murata Manufacturing Co., Ltd.
- Tomohiro Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module of an inverter and method for mounting thereof
- Patent number 12,235,010
- Issue date Feb 25, 2025
- HANON SYSTEMS
- Bernd Guntermann
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Module type sensor for detecting voltage and current of radio frequ...
- Patent number 12,228,605
- Issue date Feb 18, 2025
- NEWPOWERPLASMA CO., LTD.
- Jinjoong Kim
- G01 - MEASURING TESTING
Information Patent Grant
Sample holder and superconducting quantum computer
- Patent number 12,232,248
- Issue date Feb 18, 2025
- NEC Corporation
- Yoshihito Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Environmental hazard risk mitigation system, method and computer pr...
- Patent number 12,232,232
- Issue date Feb 18, 2025
- Lighting Defense Group, LLC
- Daniel S. Spiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlaced crosstalk controlled traces, vias, and capacitors
- Patent number 12,225,658
- Issue date Feb 11, 2025
- Cisco Technology, Inc.
- Shadi Ebrahimi Asl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control device
- Patent number 12,224,886
- Issue date Feb 11, 2025
- Hitachi Astemo, Ltd.
- Masahiro Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for measuring surface parameter of copper foil, method for s...
- Patent number 12,222,201
- Issue date Feb 11, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Hiroaki Kurihara
- G01 - MEASURING TESTING
Information Patent Grant
Wearable device antenna system
- Patent number 12,212,046
- Issue date Jan 28, 2025
- Snap Inc.
- Andrea Ashwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic control device
- Patent number 12,213,294
- Issue date Jan 28, 2025
- Hitachi Astemo, Ltd.
- Masahiro Toyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus, system, and method for implementing multipurpose screw h...
- Patent number 12,213,241
- Issue date Jan 28, 2025
- Meta Platforms Technologies, LLC
- Qiuming Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacture for embedded IC chip directly connected to PCB
- Patent number 12,213,258
- Issue date Jan 28, 2025
- AVERATEK CORPORATION
- Haris Basit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including a structure for guiding an arrangement...
- Patent number 12,213,242
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Kyungdae Son
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sample holder and superconducting quantum computer
- Patent number 12,207,393
- Issue date Jan 21, 2025
- NEC Corporation
- Yoshihito Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CORE MODULES AND EARPHONES
- Publication number 20250159794
- Publication date May 15, 2025
- SHENZHEN SHOKZ CO., LTD.
- Gong YUE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TRANSMISSION LINE ASSEMBLY, PRINTED CIRCUIT BOARD ASSEMBLY, AND ELE...
- Publication number 20250158262
- Publication date May 15, 2025
- Huawei Technologies Co., Ltd
- Bing LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Embedded Electronic Switch Components and a...
- Publication number 20250142713
- Publication date May 1, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Gerald WEIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20250142737
- Publication date May 1, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Cheng-Jia LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEARABLE DEVICE ANTENNA SYSTEM
- Publication number 20250141096
- Publication date May 1, 2025
- Snap Inc.
- Andrea Ashwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
- Publication number 20250125248
- Publication date Apr 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250120006
- Publication date Apr 10, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Dae Chul CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250107005
- Publication date Mar 27, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Xiao-Long HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ABSORBER FOR PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20250107055
- Publication date Mar 27, 2025
- Cisco Technology, Inc.
- Wenbin Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250096073
- Publication date Mar 20, 2025
- Advanced Semiconductor Engineering, Inc.
- Chiung-Ying KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING POWER SUPPLY DEVICE
- Publication number 20250096673
- Publication date Mar 20, 2025
- Murata Manufacturing Co., Ltd.
- Tatsuya HOSOTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION MEDIA FOR DIGITAL SIGNALS AND ELECTRONIC DEVICE
- Publication number 20250089155
- Publication date Mar 13, 2025
- AUTOX TECH PTE. LTD.
- Luoqi Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND LAMINATED WIRING BOARD
- Publication number 20250081329
- Publication date Mar 6, 2025
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier with Rough Surface and Smooth Surface Metal Trace...
- Publication number 20250081330
- Publication date Mar 6, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Patrick LENHARDT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD SUBSTRATE, PRINTED WIRING BOARD, AND MULTILAYE...
- Publication number 20250071894
- Publication date Feb 27, 2025
- Sumitomo Electric Industries, Ltd.
- Hiroshi UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA WIDEBAND BOARD-TO-BOARD TRANSITIONS FOR STRIPLINE RF TRANSMIS...
- Publication number 20250062519
- Publication date Feb 20, 2025
- Outdoor Wireless Networks LLC
- Fusheng LV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20250056712
- Publication date Feb 13, 2025
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUSES FOR ENHANCING ANTENNA RADIATION IN WEARABLE DEVICES
- Publication number 20250046985
- Publication date Feb 6, 2025
- Plume Design, Inc.
- Miroslav SAMARDZIJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLEXER
- Publication number 20250048536
- Publication date Feb 6, 2025
- ASUSTek COMPUTER INC.
- Yu Ou yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYIMIDE FILM, HIGH-FREQUENCY CIRCUIT SUBSTRATE, AND FLEXIBLE ELEC...
- Publication number 20250043077
- Publication date Feb 6, 2025
- UBE Corporation
- Kosuke Yamaji
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Multilayer Printed Circuit Board with Filling Segment Structures
- Publication number 20250040030
- Publication date Jan 30, 2025
- Wolfspeed, Inc.
- Gérard Bouisse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
A PRINTED CIRCUIT BOARD ARRANGEMENT AND WAVEGUIDE INTERFACE ARRANGE...
- Publication number 20250040046
- Publication date Jan 30, 2025
- Telefonaktiebolaget LM Ericsson (publ)
- Klas ERIKSSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK
- Publication number 20250040028
- Publication date Jan 30, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Patrick LENHARDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Capacitor and Circuit Board Containing the Same
- Publication number 20250029785
- Publication date Jan 23, 2025
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND ELECTRICAL CONTACT ELEMENT
- Publication number 20250031305
- Publication date Jan 23, 2025
- Rohde& Schwarz GmbH & Co. KG
- Mathias NAGEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTENNA MODULE INCLUDING STRUCTURE FOR EXTENDING GROUND AND ELECTRO...
- Publication number 20250030149
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Sinhyung JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20250024587
- Publication date Jan 16, 2025
- LG Innotek Co., Ltd.
- Jong Bae SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE AND ELECTRONIC DEVICE
- Publication number 20250008639
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Jiwon LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SUPPLY BOARDS FOR WIRELESS COMMUNICATIONS DEVICES
- Publication number 20250008646
- Publication date Jan 2, 2025
- Plume Design, Inc.
- Chiu-Wen CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-SPEED OPTICAL PACKAGE WITH CONTINUOUS RADIO FREQUENCY (RF) FLE...
- Publication number 20240431022
- Publication date Dec 26, 2024
- CIENA CORPORATION
- Maxime Jacques
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

using auxiliary mounted passive components or auxiliary substances

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Resin composition for protective layer of electromagnetic wave-shie...

Signal processing board and image forming apparatus

Metamaterial electromagnetic absorber

PCB tuning for waveguide antennae

Circuit module and method for manufacturing submodule

High-frequency line structure with lead pin-connected substrates

Antenna device and electronic device including the same

Image sensor package and camera device comprising same

Multilayer resin substrate and method for producing same

Dense via pitch interconnect to increase wiring density

Packaging of wide bandgap power electronic power stages

Electronic device with differential transmission lines equipped wit...

Multi-layer line structure

Metal-resin composite, surface treatment method, and substrate of c...

Package board, antenna package including the same and image display...

High-frequency electronic component and module

Electronic device

Electronic module of an inverter and method for mounting thereof

Module type sensor for detecting voltage and current of radio frequ...

Sample holder and superconducting quantum computer

Environmental hazard risk mitigation system, method and computer pr...

Interlaced crosstalk controlled traces, vias, and capacitors

Electronic control device

Method for measuring surface parameter of copper foil, method for s...

Wearable device antenna system

Electronic control device

Apparatus, system, and method for implementing multipurpose screw h...

Method of manufacture for embedded IC chip directly connected to PCB

Electronic device including a structure for guiding an arrangement...

Sample holder and superconducting quantum computer

Patents Applicationslast 30 patents

CORE MODULES AND EARPHONES

TRANSMISSION LINE ASSEMBLY, PRINTED CIRCUIT BOARD ASSEMBLY, AND ELE...

Component Carrier With Embedded Electronic Switch Components and a...

CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF

WEARABLE DEVICE ANTENNA SYSTEM

BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT

PRINTED CIRCUIT BOARD

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

ABSORBER FOR PRINTED CIRCUIT BOARD ASSEMBLY

ELECTRONIC DEVICE

SWITCHING POWER SUPPLY DEVICE

TRANSMISSION MEDIA FOR DIGITAL SIGNALS AND ELECTRONIC DEVICE

WIRING BOARD AND LAMINATED WIRING BOARD

Component Carrier with Rough Surface and Smooth Surface Metal Trace...

PRINTED WIRING BOARD SUBSTRATE, PRINTED WIRING BOARD, AND MULTILAYE...

ULTRA WIDEBAND BOARD-TO-BOARD TRANSITIONS FOR STRIPLINE RF TRANSMIS...

MANUFACTURING METHOD OF CIRCUIT BOARD

APPARATUSES FOR ENHANCING ANTENNA RADIATION IN WEARABLE DEVICES

MULTIPLEXER

POLYIMIDE FILM, HIGH-FREQUENCY CIRCUIT SUBSTRATE, AND FLEXIBLE ELEC...

Multilayer Printed Circuit Board with Filling Segment Structures

A PRINTED CIRCUIT BOARD ARRANGEMENT AND WAVEGUIDE INTERFACE ARRANGE...

RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK

Multilayer Capacitor and Circuit Board Containing the Same

METHOD AND ELECTRICAL CONTACT ELEMENT

ANTENNA MODULE INCLUDING STRUCTURE FOR EXTENDING GROUND AND ELECTRO...

CIRCUIT BOARD

DISPLAY DEVICE AND ELECTRONIC DEVICE

POWER SUPPLY BOARDS FOR WIRELESS COMMUNICATIONS DEVICES

HIGH-SPEED OPTICAL PACKAGE WITH CONTINUOUS RADIO FREQUENCY (RF) FLE...