using auxiliary mounted passive components or auxiliary substances

Industry

CPC
H05K1/023

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/023using auxiliary mounted passive components or auxiliary substances

Industries

Patents Grantslast 30 patents

Information Patent Grant
Vehicle communication device including an isolation circuit for iso...
- Patent number 12,362,473
- Issue date Jul 15, 2025
- Ford Global Technologies, LLC
- Ali Attaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sandwich structure power supply module
- Patent number 12,356,550
- Issue date Jul 8, 2025
- Monolithic Power Systems, Inc.
- Daocheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic control device
- Patent number 12,356,561
- Issue date Jul 8, 2025
- LG Innotek Co., Ltd
- Kun Yong Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated assembly comprising radio-frequency interface board
- Patent number 12,356,539
- Issue date Jul 8, 2025
- AGC GLASS EUROPE
- Mohsen Yousefbeiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna module and electronic device including same
- Patent number 12,349,277
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Kwanghyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,349,327
- Issue date Jul 1, 2025
- Murata Manufacturing Co., Ltd.
- Shota Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost, low loss material for microwave or antenna printed circui...
- Patent number 12,347,927
- Issue date Jul 1, 2025
- Hughes Network Systems, L.L.C.
- Bingqian Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector and board connecting assembly comprising the same
- Patent number 12,347,949
- Issue date Jul 1, 2025
- Gigalane Co., Ltd.
- Sun-hwa Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module and power supply device comprising same
- Patent number 12,342,451
- Issue date Jun 24, 2025
- LG Innotek Co., Ltd
- Sung June Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supply apparatus, load and electronic device
- Patent number 12,342,450
- Issue date Jun 24, 2025
- Delta Electronics (Shanghai) Co., Ltd.
- Wulong Cong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and electronic device
- Patent number 12,342,452
- Issue date Jun 24, 2025
- Murata Manufacturing Co., Ltd.
- Kosuke Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductive coupling structures for reducing cross talk effects in pa...
- Patent number 12,336,088
- Issue date Jun 17, 2025
- Intel Corporation
- Ranjul Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency module and communication device
- Patent number 12,336,156
- Issue date Jun 17, 2025
- Murata Manufacturing Co., Ltd.
- Kunitoshi Hanaoka
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multilayer ceramic capacitor and board having the same
- Patent number 12,334,262
- Issue date Jun 17, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Moon Soo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass core wiring substrate incorporating high-frequency filter, hi...
- Patent number 12,317,411
- Issue date May 27, 2025
- TOPPAN INC.
- Susumu Maniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transmission line device compriing first and second conductive line...
- Patent number 12,315,981
- Issue date May 27, 2025
- Unimicron Technology Corp.
- Yu-Kuang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Access point device
- Patent number 12,317,410
- Issue date May 27, 2025
- Google LLC
- Yau-Shing Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition for protective layer of electromagnetic wave-shie...
- Patent number 12,297,333
- Issue date May 13, 2025
- Tatsuta Electric Wire & Cable Co., Ltd.
- Akio Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Signal processing board and image forming apparatus
- Patent number 12,295,093
- Issue date May 6, 2025
- Kyocera Document Solutions Inc.
- Shotaro Ikegami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metamaterial electromagnetic absorber
- Patent number 12,289,823
- Issue date Apr 29, 2025
- Hyundai Motor Company
- Seung Hyun Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PCB tuning for waveguide antennae
- Patent number 12,283,736
- Issue date Apr 22, 2025
- MAGNA ELECTRONICS, LLC
- Angelos Alexanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency line structure with lead pin-connected substrates
- Patent number 12,278,413
- Issue date Apr 15, 2025
- Nippon Telegraph and Telephone Corporation
- Hiromasa Tanobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module and method for manufacturing submodule
- Patent number 12,279,374
- Issue date Apr 15, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antenna device and electronic device including the same
- Patent number 12,274,004
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Minki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package and camera device comprising same
- Patent number 12,273,605
- Issue date Apr 8, 2025
- LG Innotek Co., Ltd
- Seong Su Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer resin substrate and method for producing same
- Patent number 12,269,238
- Issue date Apr 8, 2025
- Murata Manufacturing Co., Ltd.
- Yoshimasa Nishi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Dense via pitch interconnect to increase wiring density
- Patent number 12,266,598
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Francesco Preda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of wide bandgap power electronic power stages
- Patent number 12,261,489
- Issue date Mar 25, 2025
- Deere & Company
- Brij N Singh
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic device with differential transmission lines equipped wit...
- Patent number 12,260,996
- Issue date Mar 25, 2025
- Murata Manufacturing Co., Ltd.
- Stéphane Bouvier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-resin composite, surface treatment method, and substrate of c...
- Patent number 12,251,862
- Issue date Mar 18, 2025
- Nanjing University
- Wei Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE
- Publication number 20250240874
- Publication date Jul 24, 2025
- Murata Manufacturing Co., Ltd.
- Ryutatsu MIZUKAMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE ADHESIVE LAYER AND HEAT DISSIPATION STRUCTURE
- Publication number 20250223471
- Publication date Jul 10, 2025
- Tatsuta Electric Wire & Cable Co., Ltd.
- Tomohiro NAGATAKE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD WITH AN EMBEDDED S...
- Publication number 20250220823
- Publication date Jul 3, 2025
- Hitron Technologies Inc.
- KUO-HAO PAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL MAGNETIC INTERFERENCE FILTER BOARD FOR POWER BUSBAR
- Publication number 20250220805
- Publication date Jul 3, 2025
- GM Cruise Holdings LLC
- Xiao Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER LINE STRUCTURE
- Publication number 20250210524
- Publication date Jun 26, 2025
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL SMARTCARD, AND METHOD FOR MANUFACTURING A METAL SMARTCARD
- Publication number 20250200321
- Publication date Jun 19, 2025
- IDEMIA France
- Ahmed ALI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMAGE SENSOR PACKAGE AND CAMERA DEVICE COMPRISING SAME
- Publication number 20250203181
- Publication date Jun 19, 2025
- LG Innotek Co., Ltd.
- Seong Su EOM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
AIRTIGHT OPTICAL MODULE
- Publication number 20250203757
- Publication date Jun 19, 2025
- Innolight Technology (ChengDu) LTD.
- Yin Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME
- Publication number 20250191841
- Publication date Jun 12, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Moon Soo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY DECOUPLED SIGNAL TRANSMISSION LINES
- Publication number 20250193996
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Samuel R. Connor
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
VEHICLE ELECTRIC SYSTEM
- Publication number 20250193995
- Publication date Jun 12, 2025
- FERRARI S.p.A.
- Luca CASOLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH DIFFERENTIAL TRANSMISSION LINES EQUIPPED WIT...
- Publication number 20250191847
- Publication date Jun 12, 2025
- Murata Manufacturing Co., Ltd.
- Stéphane BOUVIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING CONDUCTIVE LAYER
- Publication number 20250185175
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Taehoon KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR AN INTERMEDIATE DEVICE STRUCTURE
- Publication number 20250185139
- Publication date Jun 5, 2025
- LIGHTING DEFENSE GROUP, LLC
- Daniel S. Spiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GYSEL COMBINER AND GYSEL COMBINED APPARATUS FREE FROM SIGNAL INTERF...
- Publication number 20250183510
- Publication date Jun 5, 2025
- WAVEPIA CO., LTD.
- Sang-Hun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN AND PACKAGING OF WIDE BANDGAP POWER ELECTRONIC POWER STAGES
- Publication number 20250175060
- Publication date May 29, 2025
- Deere & Company
- BRIJ N. SINGH
- B60 - VEHICLES IN GENERAL
Information Patent Application
Multilayer Filter, Multilayer Filter Assembly, and Methods for Form...
- Publication number 20250167414
- Publication date May 22, 2025
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE MODULES AND EARPHONES
- Publication number 20250159794
- Publication date May 15, 2025
- SHENZHEN SHOKZ CO., LTD.
- Gong YUE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TRANSMISSION LINE ASSEMBLY, PRINTED CIRCUIT BOARD ASSEMBLY, AND ELE...
- Publication number 20250158262
- Publication date May 15, 2025
- Huawei Technologies Co., Ltd
- Bing LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Embedded Electronic Switch Components and a...
- Publication number 20250142713
- Publication date May 1, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Gerald WEIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20250142737
- Publication date May 1, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Cheng-Jia LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEARABLE DEVICE ANTENNA SYSTEM
- Publication number 20250141096
- Publication date May 1, 2025
- Snap Inc.
- Andrea Ashwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
- Publication number 20250125248
- Publication date Apr 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250120006
- Publication date Apr 10, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Dae Chul CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250107005
- Publication date Mar 27, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Xiao-Long HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ABSORBER FOR PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20250107055
- Publication date Mar 27, 2025
- Cisco Technology, Inc.
- Wenbin Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250096073
- Publication date Mar 20, 2025
- Advanced Semiconductor Engineering, Inc.
- Chiung-Ying KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING POWER SUPPLY DEVICE
- Publication number 20250096673
- Publication date Mar 20, 2025
- Murata Manufacturing Co., Ltd.
- Tatsuya HOSOTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION MEDIA FOR DIGITAL SIGNALS AND ELECTRONIC DEVICE
- Publication number 20250089155
- Publication date Mar 13, 2025
- AUTOX TECH PTE. LTD.
- Luoqi Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND LAMINATED WIRING BOARD
- Publication number 20250081329
- Publication date Mar 6, 2025
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

using auxiliary mounted passive components or auxiliary substances

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Vehicle communication device including an isolation circuit for iso...

Sandwich structure power supply module

Electronic control device

Laminated assembly comprising radio-frequency interface board

Antenna module and electronic device including same

Module

Low cost, low loss material for microwave or antenna printed circui...

Connector and board connecting assembly comprising the same

Electronic component module and power supply device comprising same

Power supply apparatus, load and electronic device

Circuit board and electronic device

Inductive coupling structures for reducing cross talk effects in pa...

Radio frequency module and communication device

Multilayer ceramic capacitor and board having the same

Glass core wiring substrate incorporating high-frequency filter, hi...

Transmission line device compriing first and second conductive line...

Access point device

Resin composition for protective layer of electromagnetic wave-shie...

Signal processing board and image forming apparatus

Metamaterial electromagnetic absorber

PCB tuning for waveguide antennae

High-frequency line structure with lead pin-connected substrates

Circuit module and method for manufacturing submodule

Antenna device and electronic device including the same

Image sensor package and camera device comprising same

Multilayer resin substrate and method for producing same

Dense via pitch interconnect to increase wiring density

Packaging of wide bandgap power electronic power stages

Electronic device with differential transmission lines equipped wit...

Metal-resin composite, surface treatment method, and substrate of c...

Patents Applicationslast 30 patents

MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE

CONDUCTIVE ADHESIVE LAYER AND HEAT DISSIPATION STRUCTURE

METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD WITH AN EMBEDDED S...

ELECTRICAL MAGNETIC INTERFERENCE FILTER BOARD FOR POWER BUSBAR

MULTI-LAYER LINE STRUCTURE

METAL SMARTCARD, AND METHOD FOR MANUFACTURING A METAL SMARTCARD

IMAGE SENSOR PACKAGE AND CAMERA DEVICE COMPRISING SAME

AIRTIGHT OPTICAL MODULE

MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME

THERMALLY DECOUPLED SIGNAL TRANSMISSION LINES

VEHICLE ELECTRIC SYSTEM

ELECTRONIC DEVICE WITH DIFFERENTIAL TRANSMISSION LINES EQUIPPED WIT...

ELECTRONIC DEVICE COMPRISING CONDUCTIVE LAYER

SYSTEMS AND METHODS FOR AN INTERMEDIATE DEVICE STRUCTURE

GYSEL COMBINER AND GYSEL COMBINED APPARATUS FREE FROM SIGNAL INTERF...

DESIGN AND PACKAGING OF WIDE BANDGAP POWER ELECTRONIC POWER STAGES

Multilayer Filter, Multilayer Filter Assembly, and Methods for Form...

CORE MODULES AND EARPHONES

TRANSMISSION LINE ASSEMBLY, PRINTED CIRCUIT BOARD ASSEMBLY, AND ELE...

Component Carrier With Embedded Electronic Switch Components and a...

CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF

WEARABLE DEVICE ANTENNA SYSTEM

BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT

PRINTED CIRCUIT BOARD

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

ABSORBER FOR PRINTED CIRCUIT BOARD ASSEMBLY

ELECTRONIC DEVICE

SWITCHING POWER SUPPLY DEVICE

TRANSMISSION MEDIA FOR DIGITAL SIGNALS AND ELECTRONIC DEVICE

WIRING BOARD AND LAMINATED WIRING BOARD