using auxiliary mounted passive components or auxiliary substances

Industry

CPC
H05K1/023

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/023using auxiliary mounted passive components or auxiliary substances

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including semiconductor chip having elongated...
- Patent number 12,154,847
- Issue date Nov 26, 2024
- Murata Manufacturing Co., Ltd.
- Mizuho Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface wave launcher for high-speed data links over high-voltage p...
- Patent number 12,137,517
- Issue date Nov 5, 2024
- Intel Corporation
- Vishram Shriram Pandit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-scale planar-coil transformer with shield
- Patent number 12,125,630
- Issue date Oct 22, 2024
- Analog Devices International Unlimited Company
- Baoxing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal transmission line comprising stacked insulating layers havin...
- Patent number 12,119,531
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Nobuo Ikemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic wave shielding film and shielded printed wiring board
- Patent number 12,120,861
- Issue date Oct 15, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Yoshiharu Yanagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-dielectric printed circuit board
- Patent number 12,120,811
- Issue date Oct 15, 2024
- Intel Corporation
- Arvind S
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer capacitor and circuit board containing the same
- Patent number 12,112,891
- Issue date Oct 8, 2024
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module having polygon shaped flexible circuit board
- Patent number 12,114,420
- Issue date Oct 8, 2024
- Dell Products L.P.
- Tsung-Chin Cheng
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Optical receiver
- Patent number 12,104,950
- Issue date Oct 1, 2024
- Sumitomo Electric Industries, Ltd.
- Hiroshi Hara
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit module for mounting high frequency circuit carriers
- Patent number 12,101,876
- Issue date Sep 24, 2024
- Rohde & Schwarz GmbH & Co. KG
- Nico Riedmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shield printed wiring board with ground member and ground member
- Patent number 12,101,872
- Issue date Sep 24, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Yuusuke Haruna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double stub transmission line for suppression of harmonics
- Patent number 12,101,875
- Issue date Sep 24, 2024
- Hewlett Packard Enterprise Development LP
- David P. Kopp
- G11 - INFORMATION STORAGE
Information Patent Grant
Ultra-wideband electromagnetic band gap (EBG) structure and circuit...
- Patent number 12,095,135
- Issue date Sep 17, 2024
- ANHUI UNIVERSITY
- Xingang Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with integrated waveguide launcher
- Patent number 12,074,124
- Issue date Aug 27, 2024
- NXP B.V.
- Abdellatif Zanati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing circuit board and circuit board assembly
- Patent number 12,063,752
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Wen-Zhu Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Waveguide including a substrate having a coplanar waveguide and a s...
- Patent number 12,057,612
- Issue date Aug 6, 2024
- Alibaba Group Holding Limited
- Hua Xu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 12,057,383
- Issue date Aug 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible hybrid interconnect circuits
- Patent number 12,052,814
- Issue date Jul 30, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with laminated magnetic core inductor and magnet...
- Patent number 12,048,097
- Issue date Jul 23, 2024
- Ferric Inc.
- Noah Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna and foldable electronic device including the same
- Patent number 12,034,466
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Taeyun Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Mounting structure for inductors
- Patent number 12,035,460
- Issue date Jul 9, 2024
- Murata Manufacturing Co., Ltd.
- Tarou Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board including on-board integrated enclosure for e...
- Patent number 12,028,966
- Issue date Jul 2, 2024
- Marvell Asia Pte, Ltd.
- Shaowu Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transmission apparatus, printed circuit board, and information appl...
- Patent number 12,027,743
- Issue date Jul 2, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kazuya Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid coupler and method for manufacturing hybrid couplers
- Patent number 12,027,745
- Issue date Jul 2, 2024
- CommScope Technologies LLC
- Kamalakar Yeddula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency crossover with high isolation in microelectronics H...
- Patent number 12,022,608
- Issue date Jun 25, 2024
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and system of surface wave mitigation for multiple-input-...
- Patent number 12,013,481
- Issue date Jun 18, 2024
- Intel Corporation
- Arnaud Lucres Amadjikpe
- G01 - MEASURING TESTING
Information Patent Grant
Mitigating PDN induced RF interference using a stepped impedance fi...
- Patent number 12,016,113
- Issue date Jun 18, 2024
- Intel Corporation
- Vishram Shriram Pandit
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
RF filter device for aircraft nacelle access door gap
- Patent number 12,016,164
- Issue date Jun 18, 2024
- The Boeing Company
- Kyu-Pyung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed flexible wiring apparatus in a cryostat
- Patent number 12,016,138
- Issue date Jun 18, 2024
- EQUAL 1 LABORATORIES IRELAND LIMITED
- Hans Haenlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plurality of antennas and electronic device comprising same
- Patent number 12,010,255
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Hojung Nam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Flexible Hybrid Interconnect Circuits
- Publication number 20240373546
- Publication date Nov 7, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...
- Publication number 20240365464
- Publication date Oct 31, 2024
- Canon Kabushiki Kaisha
- HIROYUKI YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION LINE
- Publication number 20240356190
- Publication date Oct 24, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiro Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-RESIN COMPOSITE, SURFACE TREATMENT METHOD, AND SUBSTRATE OF C...
- Publication number 20240342968
- Publication date Oct 17, 2024
- Nanjing University
- Wei CHEN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MULTILAYER PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD FOR PACKAGING MUL...
- Publication number 20240341029
- Publication date Oct 10, 2024
- Spreadtrum Communications (Shanghai) CO., Ltd.
- Li YAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20240332772
- Publication date Oct 3, 2024
- Shinko Electric Industries Co., Ltd.
- Hiroshi TANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILTER DEVICE WITH PCB HEAT SPREADER AND INTEGRATED GROUND INDUCTANCE
- Publication number 20240333258
- Publication date Oct 3, 2024
- Murata Manufacturing Co., Ltd.
- Luke MYERS
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR MEASURING SURFACE PARAMETER OF COPPER FOIL, METHOD FOR S...
- Publication number 20240328779
- Publication date Oct 3, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Hiroaki KURIHARA
- G01 - MEASURING TESTING
Information Patent Application
MODULE AND SEMICONDUCTOR COMPOSITE APPARATUS
- Publication number 20240334591
- Publication date Oct 3, 2024
- Murata Manufacturing Co., Ltd.
- Takeshi FURUKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTENNA MODULE
- Publication number 20240334609
- Publication date Oct 3, 2024
- TDK Corporation
- Toshiyuki ABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SUPPLY CIRCUIT, PCB CIRCUIT BOARD AND POWER SUPPLY DEVICE
- Publication number 20240324096
- Publication date Sep 26, 2024
- BLACK SESAME TECHNOLOGIES (CHONGQING) CO., LTD.
- Hai Li
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MODULE
- Publication number 20240324158
- Publication date Sep 26, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID COUPLER AND METHOD FOR MANUFACTURING HYBRID COUPLERS
- Publication number 20240322415
- Publication date Sep 26, 2024
- CommScope Technologies LLC
- Kamalakar Yeddula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-Thin Sandwich Component
- Publication number 20240314928
- Publication date Sep 19, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL CIRCUIT AND POWER SUPPLY DEVICE
- Publication number 20240314924
- Publication date Sep 19, 2024
- Sharp Kabushiki Kaisha
- TAKESHI SHIOMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240306288
- Publication date Sep 12, 2024
- Hitachi Astemo, Ltd.
- Takashi OGURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CARRIER BOARD
- Publication number 20240292517
- Publication date Aug 29, 2024
- ASIA PACIFIC MICROSYSTEMS, INC.
- Jer-Wei HSIEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier For Waveguide Applications
- Publication number 20240292518
- Publication date Aug 29, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Heinrich Trischler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240290515
- Publication date Aug 29, 2024
- Advanced Semiconductor Engineering, Inc.
- Wu Chou HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLURALITY OF ANTENNAS AND ELECTRONIC DEVICE COMPRISING SAME
- Publication number 20240291914
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Hojung NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVE UNIT AND ELECTRICALLY ASSISTED BICYCLE
- Publication number 20240284597
- Publication date Aug 22, 2024
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Satoshi KATAYAMA
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Application
HIGH PERFORMANCE CAPACITORS AND CURRENT PATH ARRANGEMENTS
- Publication number 20240258034
- Publication date Aug 1, 2024
- Resonant Link, Inc.
- Aaron Stein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSSTALK CANCELLATION FOR SIGNAL LINES
- Publication number 20240260171
- Publication date Aug 1, 2024
- Micron Technology, Inc.
- M. Ataul Karim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR IMPLEMENTING MULTIPURPOSE SCREW H...
- Publication number 20240251499
- Publication date Jul 25, 2024
- Meta Platforms Technologies, LLC
- Qiuming Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for coating and forming novel material layer structure of hi...
- Publication number 20240244763
- Publication date Jul 18, 2024
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD HAVING COMPOSITE MAGNETIC COMPONENTS MOUNTED THEREON
- Publication number 20240237217
- Publication date Jul 11, 2024
- LG Innotek Co., Ltd.
- Jong Sun JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING...
- Publication number 20240237229
- Publication date Jul 11, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTI-INTERFERENCE MODULE AND TERMINAL DEVICE
- Publication number 20240224412
- Publication date Jul 4, 2024
- Honor Device Co., Ltd.
- Xing WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SAFETY AND EMC COMPLIANT INTERNAL POWER PLANE HEAT SINK CAPACITOR
- Publication number 20240224411
- Publication date Jul 4, 2024
- International Business Machines Corporation
- John S. Werner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240224413
- Publication date Jul 4, 2024
- Resonac Corporation
- Kosuke URASHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

using auxiliary mounted passive components or auxiliary substances

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device including semiconductor chip having elongated...

Surface wave launcher for high-speed data links over high-voltage p...

Micro-scale planar-coil transformer with shield

Signal transmission line comprising stacked insulating layers havin...

Electromagnetic wave shielding film and shielded printed wiring board

Multi-dielectric printed circuit board

Multilayer capacitor and circuit board containing the same

Display module having polygon shaped flexible circuit board

Optical receiver

Circuit module for mounting high frequency circuit carriers

Shield printed wiring board with ground member and ground member

Double stub transmission line for suppression of harmonics

Ultra-wideband electromagnetic band gap (EBG) structure and circuit...

Integrated circuit package with integrated waveguide launcher

Methods of manufacturing circuit board and circuit board assembly

Waveguide including a substrate having a coplanar waveguide and a s...

Bonded structures with integrated passive component

Flexible hybrid interconnect circuits

Integrated circuit with laminated magnetic core inductor and magnet...

Antenna and foldable electronic device including the same

Mounting structure for inductors

Printed circuit board including on-board integrated enclosure for e...

Transmission apparatus, printed circuit board, and information appl...

Hybrid coupler and method for manufacturing hybrid couplers

Radio frequency crossover with high isolation in microelectronics H...

Apparatus and system of surface wave mitigation for multiple-input-...

Mitigating PDN induced RF interference using a stepped impedance fi...

RF filter device for aircraft nacelle access door gap

Printed flexible wiring apparatus in a cryostat

Plurality of antennas and electronic device comprising same

Patents Applicationslast 30 patents

Flexible Hybrid Interconnect Circuits

CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...

TRANSMISSION LINE

METAL-RESIN COMPOSITE, SURFACE TREATMENT METHOD, AND SUBSTRATE OF C...

MULTILAYER PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD FOR PACKAGING MUL...

WIRING BOARD

FILTER DEVICE WITH PCB HEAT SPREADER AND INTEGRATED GROUND INDUCTANCE

METHOD FOR MEASURING SURFACE PARAMETER OF COPPER FOIL, METHOD FOR S...

MODULE AND SEMICONDUCTOR COMPOSITE APPARATUS

ANTENNA MODULE

POWER SUPPLY CIRCUIT, PCB CIRCUIT BOARD AND POWER SUPPLY DEVICE

MODULE

HYBRID COUPLER AND METHOD FOR MANUFACTURING HYBRID COUPLERS

Ultra-Thin Sandwich Component

CONTROL CIRCUIT AND POWER SUPPLY DEVICE

ELECTRONIC DEVICE

CIRCUIT CARRIER BOARD

Component Carrier For Waveguide Applications

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PLURALITY OF ANTENNAS AND ELECTRONIC DEVICE COMPRISING SAME

DRIVE UNIT AND ELECTRICALLY ASSISTED BICYCLE

HIGH PERFORMANCE CAPACITORS AND CURRENT PATH ARRANGEMENTS

CROSSTALK CANCELLATION FOR SIGNAL LINES

APPARATUS, SYSTEM, AND METHOD FOR IMPLEMENTING MULTIPURPOSE SCREW H...

Method for coating and forming novel material layer structure of hi...

CIRCUIT BOARD HAVING COMPOSITE MAGNETIC COMPONENTS MOUNTED THEREON

RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING...

ANTI-INTERFERENCE MODULE AND TERMINAL DEVICE

SAFETY AND EMC COMPLIANT INTERNAL POWER PLANE HEAT SINK CAPACITOR

WIRING SUBSTRATE