using auxiliary pillars in the recessed region

Industry

CPC
H01L21/76208

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76208using auxiliary pillars in the recessed region

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor arrangement and method for manufacturing the same
- Patent number 11,842,931
- Issue date Dec 12, 2023
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method for manufacturing the same
- Patent number 10,861,748
- Issue date Dec 8, 2020
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crossbar reinforced semiconductor fins having reduced wiggling
- Patent number 10,755,963
- Issue date Aug 25, 2020
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curtain airbag device mounting structure and curtain airbag deploym...
- Patent number 10,723,306
- Issue date Jul 28, 2020
- Toyota Jidosha Kabushiki Kaisha
- Takamichi Komura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Power semiconductor device having an SOI island
- Patent number 10,658,457
- Issue date May 19, 2020
- Infineon Technologies AG
- Alexander Philippou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench isolated IC with transistors having LOCOS gate dielectric
- Patent number 10,586,730
- Issue date Mar 10, 2020
- Texas Instruments Incorporated
- Ming-Yeh Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon island structure and method of fabricating same
- Patent number 10,490,441
- Issue date Nov 26, 2019
- NEXCHIP SEMICONDUCTOR CORPORATION
- Tiansong Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing a semiconductor device
- Patent number 9,929,341
- Issue date Mar 27, 2018
- Unisantis Electronics Singapore Pte. Ltd.
- Fujio Masuoka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor fin on local oxide
- Patent number 9,035,430
- Issue date May 19, 2015
- International Business Machines Corporation
- Reinaldo A. Vega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a buried dielectric layer underneath a semicondu...
- Patent number 8,835,278
- Issue date Sep 16, 2014
- IMEC
- Gouri Sankar Kar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,404,537
- Issue date Mar 26, 2013
- Kabushiki Kaisha Toshiba
- Isao Kamioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a unidirectional and a bidirectional...
- Patent number 8,125,044
- Issue date Feb 28, 2012
- HVVi Semiconductors, Inc
- Bishnu P. Gogoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,097,503
- Issue date Jan 17, 2012
- Kabushiki Kaisha Toshiba
- Isao Kamioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,858,467
- Issue date Dec 28, 2010
- Kabushiki Kaisha Toshiba
- Isao Kamioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 7,709,348
- Issue date May 4, 2010
- Oki Semiconductor Co., Ltd.
- Kaoru Shimmoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gettering of silicon on insulator using relaxed silicon germanium e...
- Patent number 7,687,329
- Issue date Mar 30, 2010
- Micron Technology, Inc.
- Leonard Forbes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 7,687,368
- Issue date Mar 30, 2010
- Kabushiki Kaisha Toshiba
- Hirohisa Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gettering of silicon on insulator using relaxed silicon germanium e...
- Patent number 7,662,701
- Issue date Feb 16, 2010
- Micron Technology, Inc.
- Leonard Forbes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor having thick dielectric regions
- Patent number 7,339,252
- Issue date Mar 4, 2008
- Third Dimension (3D) Semiconductor, Inc.
- Richard A. Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having reduced capacitance to substrate and me...
- Patent number 7,087,925
- Issue date Aug 8, 2006
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing low-cost and high-quality SOI substrates
- Patent number 7,071,073
- Issue date Jul 4, 2006
- STMicroelectronics S.r.l.
- Flavio Villa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick oxide region in a semiconductor device
- Patent number 7,067,890
- Issue date Jun 27, 2006
- Agere Systems Inc.
- Muhammed Ayman Shibib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Push/pull actuator for microstructures
- Patent number 7,026,899
- Issue date Apr 11, 2006
- Kionix, Inc.
- Scott G. Adams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming thick dielectric regions using etched trenches
- Patent number 7,023,069
- Issue date Apr 4, 2006
- Third Dimension (3D) Semiconductor, Inc.
- Richard A. Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming isolation layer of semiconductor device
- Patent number 6,979,876
- Issue date Dec 27, 2005
- Hynix Semiconductor, Inc.
- Young Kwon Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a thick microstructural oxide layer
- Patent number 6,962,831
- Issue date Nov 8, 2005
- The Regents of the University of Michigan
- Khalil Najafi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for manufacturing a semiconductor wafer integrating electro...
- Patent number 6,869,856
- Issue date Mar 22, 2005
- STMicroelectronics S.r.l.
- Chantal Combi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming isolation layer of semiconductor device and semi...
- Patent number 6,852,606
- Issue date Feb 8, 2005
- LG Semicon Co., Ltd.
- Young-Kwon Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage resistive structure integrated on a semiconductor subs...
- Patent number 6,815,795
- Issue date Nov 9, 2004
- STMicroelectronics S.r.l.
- Salvatore Leonardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating micro-structure and method of manufacturing same
- Patent number 6,797,589
- Issue date Sep 28, 2004
- Kionix, Inc.
- Scott G. Adams
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR...
- Publication number 20230018338
- Publication date Jan 19, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- KeJun MU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210020521
- Publication date Jan 21, 2021
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSSBAR REINFORCED SEMICONDUCTOR FINS HAVING REDUCED WIGGLING
- Publication number 20200135539
- Publication date Apr 30, 2020
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device Having an SOI Island
- Publication number 20190198612
- Publication date Jun 27, 2019
- Alexander Philippou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180033699
- Publication date Feb 1, 2018
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE
- Publication number 20170222142
- Publication date Aug 3, 2017
- Unisantis Electronics Singapore PTE Ltd.
- FUJIO MASUOKA
- C30 - CRYSTAL GROWTH
Information Patent Application
DEVICES AND METHODS OF CREATING ELASTIC RELAXATION OF EPITAXIALLY G...
- Publication number 20170077234
- Publication date Mar 16, 2017
- GLOBALFOUNDRIES INC.
- Neeraj TRIPATHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Buried Dielectric Layer Underneath a Semicondu...
- Publication number 20140065794
- Publication date Mar 6, 2014
- IMEC
- Gouri Sankar Kar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FIN ON LOCAL OXIDE
- Publication number 20140061862
- Publication date Mar 6, 2014
- International Business Machines Corporation
- Reinaldo A. VEGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120282773
- Publication date Nov 8, 2012
- Kabushiki Kaisha Toshiba
- Isao Kamioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120122294
- Publication date May 17, 2012
- Kabushiki Kaisha Toshiba
- Isao Kamioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure of electrode pick up in LOCOS
- Publication number 20110156163
- Publication date Jun 30, 2011
- Tzuyin CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20110065262
- Publication date Mar 17, 2011
- Isao KAMIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20100230776
- Publication date Sep 16, 2010
- Bishnu Prasanna Gogoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING A MIXED SUBSTRATE
- Publication number 20100081280
- Publication date Apr 1, 2010
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Hubert Moriceau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20090261446
- Publication date Oct 22, 2009
- Bishnu P. Gogoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20090246932
- Publication date Oct 1, 2009
- Isao KAMIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor device
- Publication number 20090197389
- Publication date Aug 6, 2009
- Oki Semiconductor Co., Ltd.
- Kaoru Shimmoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20080135976
- Publication date Jun 12, 2008
- SANYO ELECTRIC CO., LTD.
- Keita ODAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GETTERING OF SILICON ON INSULATOR USING RELAXED SILICON GERMANIUM E...
- Publication number 20060258063
- Publication date Nov 16, 2006
- Micron Technology, Inc.
- Leonard Forbes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor having thick dielectric regions
- Publication number 20060163690
- Publication date Jul 27, 2006
- Third Dimension (3D) Semiconductor, Inc.
- Richard A. Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thick oxide region in a semiconductor device and method of forming...
- Publication number 20060071283
- Publication date Apr 6, 2006
- Muhammed Ayman Shibib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method
- Publication number 20050282354
- Publication date Dec 22, 2005
- Hirohisa Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having reduced capacitance to substrate and me...
- Publication number 20050173777
- Publication date Aug 11, 2005
- Semiconductor Components Industries, LLC.
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming thick dielectric regions using etched trenches
- Publication number 20050139914
- Publication date Jun 30, 2005
- Third Dimension (3D) Semiconductor, Inc.
- Richard A. Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor substrate and manufacturing process therefor
- Publication number 20050012175
- Publication date Jan 20, 2005
- Kazuhiro Tsuruta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gettering of silicon on insulator using relaxed silicon germanium e...
- Publication number 20040235264
- Publication date Nov 25, 2004
- Micron Technology, Inc.
- Leonard Forbes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making a thick microstructural oxide layer and device uti...
- Publication number 20030224565
- Publication date Dec 4, 2003
- Khalil Najafi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for forming isolation layer of semiconductor device
- Publication number 20030219958
- Publication date Nov 27, 2003
- Hynix Semiconductor, Inc.
- Young Kwon Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High voltage resistive structure integrated on a semiconductor subs...
- Publication number 20030205780
- Publication date Nov 6, 2003
- STMicroelectronics S.r.l.
- Salvatore Leonardi
- H01 - BASIC ELECTRIC ELEMENTS

using auxiliary pillars in the recessed region

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor arrangement and method for manufacturing the same

Semiconductor arrangement and method for manufacturing the same

Crossbar reinforced semiconductor fins having reduced wiggling

Curtain airbag device mounting structure and curtain airbag deploym...

Power semiconductor device having an SOI island

Trench isolated IC with transistors having LOCOS gate dielectric

Silicon island structure and method of fabricating same

Semiconductor device and method for producing a semiconductor device

Semiconductor fin on local oxide

Method for forming a buried dielectric layer underneath a semicondu...

Method of manufacturing semiconductor device

Semiconductor structure having a unidirectional and a bidirectional...

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Method for manufacturing semiconductor device

Gettering of silicon on insulator using relaxed silicon germanium e...

Semiconductor device manufacturing method

Gettering of silicon on insulator using relaxed silicon germanium e...

Semiconductor having thick dielectric regions

Semiconductor device having reduced capacitance to substrate and me...

Process for manufacturing low-cost and high-quality SOI substrates

Thick oxide region in a semiconductor device

Push/pull actuator for microstructures

Method for forming thick dielectric regions using etched trenches

Method for forming isolation layer of semiconductor device

Method of making a thick microstructural oxide layer

Process for manufacturing a semiconductor wafer integrating electro...

Method for forming isolation layer of semiconductor device and semi...

High voltage resistive structure integrated on a semiconductor subs...

Insulating micro-structure and method of manufacturing same

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR...

SEMICONDUCTOR ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME

CROSSBAR REINFORCED SEMICONDUCTOR FINS HAVING REDUCED WIGGLING

Power Semiconductor Device Having an SOI Island

SEMICONDUCTOR ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE

DEVICES AND METHODS OF CREATING ELASTIC RELAXATION OF EPITAXIALLY G...

Method for Forming a Buried Dielectric Layer Underneath a Semicondu...

SEMICONDUCTOR FIN ON LOCAL OXIDE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Structure of electrode pick up in LOCOS

Method of manufacturing semiconductor device

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURE

METHOD OF PRODUCING A MIXED SUBSTRATE

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method for manufacturing semiconductor device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

GETTERING OF SILICON ON INSULATOR USING RELAXED SILICON GERMANIUM E...

Semiconductor having thick dielectric regions

Thick oxide region in a semiconductor device and method of forming...

Semiconductor device manufacturing method

Semiconductor device having reduced capacitance to substrate and me...

Method for forming thick dielectric regions using etched trenches

Semiconductor substrate and manufacturing process therefor

Gettering of silicon on insulator using relaxed silicon germanium e...

Method of making a thick microstructural oxide layer and device uti...

Method for forming isolation layer of semiconductor device

High voltage resistive structure integrated on a semiconductor subs...