using bump connectors

Industry

CPC
H01L2021/60022

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2021/60022using bump connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Passivation layer and planarization layer and method of forming the...
- Patent number 12,051,622
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for making the same
- Patent number 12,027,433
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for forming solder bumps
- Patent number 11,990,437
- Issue date May 21, 2024
- International Business Machines Corporation
- Eric Peter Lewandowski
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,961,742
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cap for package of integrated circuit
- Patent number 11,923,256
- Issue date Mar 5, 2024
- STMicroelectronics (Grenoble 2) SAS
- Olivier Franiatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive devices in package-on-package structures and methods for fo...
- Patent number 11,742,217
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure for bipolar transistor with constricted bumps
- Patent number 11,705,419
- Issue date Jul 18, 2023
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with embossed solder mask having non-...
- Patent number 11,688,706
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising semiconductor die and interposer an...
- Patent number 11,527,496
- Issue date Dec 13, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electronic device structure having an electron...
- Patent number 11,482,500
- Issue date Oct 25, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Shaun Bowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for making the same
- Patent number 11,482,461
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level components for integrated-circuit packages
- Patent number 11,476,198
- Issue date Oct 18, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable extreme large size substrate integration
- Patent number 11,404,337
- Issue date Aug 2, 2022
- Apple Inc.
- Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,309,219
- Issue date Apr 19, 2022
- Kioxia Corporation
- Akira Tomono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cap for package of integrated circuit
- Patent number 11,101,188
- Issue date Aug 24, 2021
- STMicroelectronics (Grenoble 2) SAS
- Olivier Franiatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-package partial via on package edge
- Patent number 11,101,220
- Issue date Aug 24, 2021
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,101,144
- Issue date Aug 24, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive devices in package-on-package structures and methods for fo...
- Patent number 11,018,086
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for forming solder bumps
- Patent number 10,879,202
- Issue date Dec 29, 2020
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electronic device structure having an electron...
- Patent number 10,847,478
- Issue date Nov 24, 2020
- Amkor Technology Singapore Holding Pte Ltd.
- Shaun Bowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-packaged die on leadframe with common contact
- Patent number 10,741,479
- Issue date Aug 11, 2020
- Great Wall Semiconductor Corporation
- Patrick M. Shea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding terminal of semiconductor chip using solder bump...
- Patent number 10,714,450
- Issue date Jul 14, 2020
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an encapsulated front side and interpos...
- Patent number 10,679,952
- Issue date Jun 9, 2020
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-packaged die on leadframe with common contact
- Patent number 10,529,651
- Issue date Jan 7, 2020
- Great Wall Semiconductor Corporation
- Patrick M. Shea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,515,825
- Issue date Dec 24, 2019
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 10,424,526
- Issue date Sep 24, 2019
- Powertech Technology Inc.
- Chi-An Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically anchored C4 pad and method of forming same
- Patent number 10,388,617
- Issue date Aug 20, 2019
- GLOBALFOUNDRIES Inc.
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an integrated fan-out package
- Patent number 10,304,790
- Issue date May 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shou-Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package
- Patent number 10,249,515
- Issue date Apr 2, 2019
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill dispensing using funnels
- Patent number 10,249,516
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Evan George Colgan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package and Method
- Publication number 20240387245
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH PULL-IN PLANARIZATION LAYER AND METHOD...
- Publication number 20240379428
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20240312851
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240266189
- Publication date Aug 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20240021467
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS DEVICE PACKAGE AND METHODS
- Publication number 20230411262
- Publication date Dec 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP BONDING STRUCTURE AND CIRCUIT BOARD THEREOF
- Publication number 20230380053
- Publication date Nov 23, 2023
- Chipbond Technology Corporation
- Chun-Te Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFUCTURING METHOD OF PACKAGING STRUCTURE FOR BIPOLAR TRANSISTOR...
- Publication number 20230307400
- Publication date Sep 28, 2023
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230307422
- Publication date Sep 28, 2023
- KIOXIA Corporation
- Takeori MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230223365
- Publication date Jul 13, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE DEFECTS IN INTERCONNECTS BETWEEN S...
- Publication number 20230096835
- Publication date Mar 30, 2023
- Intel Corporation
- Kyle McElhinny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE DEFECTS IN INTERCONNECTS BETWEEN SE...
- Publication number 20230095281
- Publication date Mar 30, 2023
- Intel Corporation
- Kyle McElhinny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL PACKAGE SUBSTRATE DEVICE WITH BGA PIN OUT AND COAXIAL SI...
- Publication number 20230063343
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Scalable Extreme Large Size Substrate Integration
- Publication number 20230017445
- Publication date Jan 19, 2023
- Apple Inc.
- Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN ELECTRONIC DEVICE STRUCTURE HAVING AN ELECTRON...
- Publication number 20220415834
- Publication date Dec 29, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Shaun BOWERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LEVEL DIE COUPLED WITH A SUBSTRATE
- Publication number 20220415770
- Publication date Dec 29, 2022
- Intel Corporation
- Omkar KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20220384281
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure with Pull-in Planarization Layer and Method...
- Publication number 20220384259
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20220254755
- Publication date Aug 11, 2022
- Yangtze Memory Technologies Co., Ltd.
- Xinru ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20220199461
- Publication date Jun 23, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE MANUFACTURING METHOD, ELECTRONIC EQUIPMENT MAN...
- Publication number 20220102330
- Publication date Mar 31, 2022
- Canon Kabushiki Kaisha
- Kana Onoko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH EMBOSSED SOLDER MASK AND ASSOCIA...
- Publication number 20220084971
- Publication date Mar 17, 2022
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20210398946
- Publication date Dec 23, 2021
- KIOXIA Corporation
- Takeori MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Lines Having Nano Columns and Method Forming Same
- Publication number 20210375672
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manfacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN-GRID-ARRAY-TYPE SEMICONDUCTOR PACKAGE
- Publication number 20210375811
- Publication date Dec 2, 2021
- MK ELECTRON CO., LTD.
- Jae Yeol SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAP FOR PACKAGE OF INTEGRATED CIRCUIT
- Publication number 20210343609
- Publication date Nov 4, 2021
- STMicroelectronics (Grenoble 2) SAS
- Olivier Franiatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD
- Publication number 20210242156
- Publication date Aug 5, 2021
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20210202329
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Scalable Extreme Large Size Substrate Integration
- Publication number 20210202332
- Publication date Jul 1, 2021
- Apple Inc.
- Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LEVEL FAN-OUT INTERCONNECTS FOR INTEGRATED-CIRCUIT PACKAGES
- Publication number 20210183779
- Publication date Jun 17, 2021
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS

using bump connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Passivation layer and planarization layer and method of forming the...

Semiconductor package and method for making the same

System and method for forming solder bumps

Semiconductor device and manufacturing method thereof

Cap for package of integrated circuit

Passive devices in package-on-package structures and methods for fo...

Packaging structure for bipolar transistor with constricted bumps

Semiconductor device assembly with embossed solder mask having non-...

Semiconductor device comprising semiconductor die and interposer an...

Method of forming an electronic device structure having an electron...

Semiconductor package and method for making the same

Multi-level components for integrated-circuit packages

Scalable extreme large size substrate integration

Method for manufacturing semiconductor device

Cap for package of integrated circuit

Through-package partial via on package edge

Semiconductor device and manufacturing method thereof

Passive devices in package-on-package structures and methods for fo...

System and method for forming solder bumps

Method of forming an electronic device structure having an electron...

Co-packaged die on leadframe with common contact

Method of bonding terminal of semiconductor chip using solder bump...

Semiconductor device having an encapsulated front side and interpos...

Co-packaged die on leadframe with common contact

Semiconductor device and manufacturing method thereof

Chip package structure and manufacturing method thereof

Mechanically anchored C4 pad and method of forming same

Method of fabricating an integrated fan-out package

Electronic device package

Underfill dispensing using funnels

Patents Applicationslast 30 patents

Semiconductor Package and Method

SEMICONDUCTOR STRUCTURE WITH PULL-IN PLANARIZATION LAYER AND METHOD...

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor Package and Method

MICROELECTRONICS DEVICE PACKAGE AND METHODS

FLIP-CHIP BONDING STRUCTURE AND CIRCUIT BOARD THEREOF

MANUFUCTURING METHOD OF PACKAGING STRUCTURE FOR BIPOLAR TRANSISTOR...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHODS AND APPARATUS TO REDUCE DEFECTS IN INTERCONNECTS BETWEEN S...

METHODS AND APPARATUS TO REDUCE DEFECTS IN INTERCONNECTS BETWEEN SE...

MULTILEVEL PACKAGE SUBSTRATE DEVICE WITH BGA PIN OUT AND COAXIAL SI...

Scalable Extreme Large Size Substrate Integration

METHOD OF FORMING AN ELECTRONIC DEVICE STRUCTURE HAVING AN ELECTRON...

MULTI-LEVEL DIE COUPLED WITH A SUBSTRATE

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

Semiconductor Structure with Pull-in Planarization Layer and Method...

FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD

SEMICONDUCTOR MODULE MANUFACTURING METHOD, ELECTRONIC EQUIPMENT MAN...

SEMICONDUCTOR DEVICE ASSEMBLY WITH EMBOSSED SOLDER MASK AND ASSOCIA...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Redistribution Lines Having Nano Columns and Method Forming Same

PIN-GRID-ARRAY-TYPE SEMICONDUCTOR PACKAGE

CAP FOR PACKAGE OF INTEGRATED CIRCUIT

SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

Scalable Extreme Large Size Substrate Integration

MULTI-LEVEL FAN-OUT INTERCONNECTS FOR INTEGRATED-CIRCUIT PACKAGES