using convection

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CPC
H01L2021/60135

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2021/60135using convection

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chip-scale package architectures containing a die back side metal a...
- Patent number 12,040,246
- Issue date Jul 16, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated substrate structure, redistribution structure, and manuf...
- Patent number 11,984,403
- Issue date May 14, 2024
- Dyi-Chung Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of using processing oven
- Patent number 11,850,672
- Issue date Dec 26, 2023
- YIELD ENGINEERING SYSTEMS, INC.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,830,746
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package
- Patent number 11,817,397
- Issue date Nov 14, 2023
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing process thereof
- Patent number 11,742,276
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Huan Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic module, electronic module, and e...
- Patent number 11,632,886
- Issue date Apr 18, 2023
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out light-emitting diode (LED) device substrate with embedded b...
- Patent number 11,626,448
- Issue date Apr 11, 2023
- Lumileds LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out light-emitting diode (LED) device substrate with embedded b...
- Patent number 11,610,935
- Issue date Mar 21, 2023
- Lumileds LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and manufacturing method thereof
- Patent number 11,587,879
- Issue date Feb 21, 2023
- Fuji Electric Co., Ltd.
- Naoki Takizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out light-emitting diode (LED) device substrate with embedded b...
- Patent number 11,574,951
- Issue date Feb 7, 2023
- Lumileds LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate with mixed pitch wiring
- Patent number 11,527,462
- Issue date Dec 13, 2022
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame jig for manufacturing semiconductor package, apparatus includ...
- Patent number 11,508,598
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Seungwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical soldering technology for 3D circuit assembly
- Patent number 11,501,982
- Issue date Nov 15, 2022
- The United States of Americas as represented by the Secretary of the Army
- Stephen Redington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using processing oven
- Patent number 11,465,225
- Issue date Oct 11, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for capacitor protection, package structure, and method o...
- Patent number 11,450,732
- Issue date Sep 20, 2022
- SUZHOU TF-AMD SEMICONDUCTOR CO. LTD.
- Zhe Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic package assemblies including solder reflow compatibl...
- Patent number 11,387,374
- Issue date Jul 12, 2022
- Corning Research & Development Corporation
- Douglas Llewellyn Butler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure with radial spokes for improved s...
- Patent number 11,355,429
- Issue date Jun 7, 2022
- Infineon Technologies AG
- Paul Armand Asentista Calo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating and method of using porous wafer battery
- Patent number 11,342,625
- Issue date May 24, 2022
- XNRGI, INC.
- Gerard Christopher D'Couto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing process thereof
- Patent number 11,315,860
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Huan Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Input/output pins for chip-embedded substrate
- Patent number 11,101,221
- Issue date Aug 24, 2021
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structures and methods for forming the same
- Patent number 11,101,261
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated solder TSV insertion interconnect
- Patent number 11,018,056
- Issue date May 25, 2021
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate and stacked silicon package assembly having...
- Patent number 10,879,157
- Issue date Dec 29, 2020
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package structures and methods for forming the same
- Patent number 10,373,941
- Issue date Aug 6, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density redistribution layer (RDL) interconnect bridge using a...
- Patent number 10,276,403
- Issue date Apr 30, 2019
- Avago Technologies International Sales Pe. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Input/output pins for chip-embedded substrate
- Patent number 9,966,341
- Issue date May 8, 2018
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structures and methods for forming the same
- Patent number 9,935,091
- Issue date Apr 3, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of attaching components to printed cirucuit board with reduc...
- Patent number 9,865,479
- Issue date Jan 9, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Wei-Shun Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...
- Publication number 20240332112
- Publication date Oct 3, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING INTEGRATED SUBSTRATE STRUCTURE
- Publication number 20240222277
- Publication date Jul 4, 2024
- Dyi-Chung HU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND SOLDER REFLOW METHOD
- Publication number 20240145259
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ALIGNMENT ASSEMBLY OF THE SOLDER REFLOW SYSTEM
- Publication number 20240047255
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ching Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20230386862
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING AN INTERPOSER PRODUCT
- Publication number 20230290649
- Publication date Sep 14, 2023
- Murata Manufacturing Co., Ltd.
- Sophie GABORIEAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING PROCESS THEREOF
- Publication number 20220246511
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Huan Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20220216071
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220199550
- Publication date Jun 23, 2022
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE, REWORKABLE, AND NO-UNDERFILL ATTACH PROCESS FOR FI...
- Publication number 20220108965
- Publication date Apr 7, 2022
- Jabil Inc.
- Anwar A. Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...
- Publication number 20220102234
- Publication date Mar 31, 2022
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20210233855
- Publication date Jul 29, 2021
- Fuji Electric Co., Ltd.
- Naoki TAKIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRAME JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE, APPARATUS INCLUD...
- Publication number 20210233792
- Publication date Jul 29, 2021
- Samsung Electronics Co., Ltd.
- SEUNGWAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Interconnect Structure with Radial Spokes for Improved S...
- Publication number 20210233839
- Publication date Jul 29, 2021
- Paul Armand Asentista Calo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE WITH MIXED PITCH WIRING
- Publication number 20210183753
- Publication date Jun 17, 2021
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC PACKAGE ASSEMBLIES INCLUDING SOLDER REFLOW COMPATIBL...
- Publication number 20210159347
- Publication date May 27, 2021
- Corning Research & Development Corporation
- Douglas Llewellyn Butler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SUBSTRATE STRUCTURE, REDISTRIBUTION STRUCTURE, AND MANUF...
- Publication number 20210151382
- Publication date May 20, 2021
- Dyi-Chung HU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC MODULE, ELECTRONIC MODULE, AND E...
- Publication number 20210136967
- Publication date May 6, 2021
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED SOLDER TSV INSERTION INTERCONNECT
- Publication number 20210134670
- Publication date May 6, 2021
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING AND METHOD OF USING POROUS WAFER BATTERY
- Publication number 20210134608
- Publication date May 6, 2021
- Xnrgi, Inc.
- Gerard Christopher D'Couto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING PROCESS THEREOF
- Publication number 20210118789
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Huan Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE METHOD FOR ATTACHED SINGLE SMALL SIZE AND ARRAY TYPE OF CHI...
- Publication number 20200411470
- Publication date Dec 31, 2020
- SFI Electronics Technology Inc.
- Ching-Hohn Len
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR CAPACITOR PROTECTION, PACKAGE STRUCTURE, AND METHOD O...
- Publication number 20200286983
- Publication date Sep 10, 2020
- SUZHOU TF-AMD SEMICONDUCTOR CO. LTD.
- Zhe LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREMOLDED SUBSTRATE FOR MOUNTING A SEMICONDUCTOR DIE AND A METHOD O...
- Publication number 20190164875
- Publication date May 30, 2019
- ASM Technology Singapore Pte Ltd
- Chun Ho FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INPUT/OUTPUT PINS FOR CHIP-EMBEDDED SUBSTRATE
- Publication number 20180233453
- Publication date Aug 16, 2018
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Structures and Methods for Forming the Same
- Publication number 20180197847
- Publication date Jul 12, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY REDISTRIBUTION LAYER (RDL) INTERCONNECT BRIDGE USING A...
- Publication number 20170365565
- Publication date Dec 21, 2017
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ATTACHING COMPONENTS TO PRINTED CIRUCUIT BOARD WITH REDUC...
- Publication number 20170301559
- Publication date Oct 19, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Wei-Shun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Manufacturing Method
- Publication number 20160240394
- Publication date Aug 18, 2016
- NITTO DENKO CORPORATION
- Akihiro Fukui
- H01 - BASIC ELECTRIC ELEMENTS

using convection

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip-scale package architectures containing a die back side metal a...

Integrated substrate structure, redistribution structure, and manuf...

Method of using processing oven

Semiconductor device and method of manufacture

Semiconductor device package

Semiconductor package and manufacturing process thereof

Method of manufacturing electronic module, electronic module, and e...

Fan-out light-emitting diode (LED) device substrate with embedded b...

Fan-out light-emitting diode (LED) device substrate with embedded b...

Electronic apparatus and manufacturing method thereof

Fan-out light-emitting diode (LED) device substrate with embedded b...

Circuit substrate with mixed pitch wiring

Frame jig for manufacturing semiconductor package, apparatus includ...

Vertical soldering technology for 3D circuit assembly

Method of using processing oven

Structure for capacitor protection, package structure, and method o...

Optoelectronic package assemblies including solder reflow compatibl...

Electrical interconnect structure with radial spokes for improved s...

Method of fabricating and method of using porous wafer battery

Semiconductor package and manufacturing process thereof

Input/output pins for chip-embedded substrate

Package-on-package structures and methods for forming the same

Encapsulated solder TSV insertion interconnect

High density substrate and stacked silicon package assembly having...

Package-on-package structures and methods for forming the same

High density redistribution layer (RDL) interconnect bridge using a...

Input/output pins for chip-embedded substrate

Package-on-package structures and methods for forming the same

Method of attaching components to printed cirucuit board with reduc...

Patents Applicationslast 30 patents

CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...

METHOD FOR MANUFACTURING INTEGRATED SUBSTRATE STRUCTURE

SOLDER REFLOW APPARATUS AND SOLDER REFLOW METHOD

WAFER ALIGNMENT ASSEMBLY OF THE SOLDER REFLOW SYSTEM

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

METHOD OF MANUFACTURING AN INTERPOSER PRODUCT

SEMICONDUCTOR PACKAGE AND MANUFACTURING PROCESS THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

LOW TEMPERATURE, REWORKABLE, AND NO-UNDERFILL ATTACH PROCESS FOR FI...

CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...

ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF

FRAME JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE, APPARATUS INCLUD...

Electrical Interconnect Structure with Radial Spokes for Improved S...

CIRCUIT SUBSTRATE WITH MIXED PITCH WIRING

OPTOELECTRONIC PACKAGE ASSEMBLIES INCLUDING SOLDER REFLOW COMPATIBL...

INTEGRATED SUBSTRATE STRUCTURE, REDISTRIBUTION STRUCTURE, AND MANUF...

METHOD OF MANUFACTURING ELECTRONIC MODULE, ELECTRONIC MODULE, AND E...

ENCAPSULATED SOLDER TSV INSERTION INTERCONNECT

METHOD OF FABRICATING AND METHOD OF USING POROUS WAFER BATTERY

SEMICONDUCTOR PACKAGE AND MANUFACTURING PROCESS THEREOF

PACKAGE METHOD FOR ATTACHED SINGLE SMALL SIZE AND ARRAY TYPE OF CHI...

STRUCTURE FOR CAPACITOR PROTECTION, PACKAGE STRUCTURE, AND METHOD O...

PREMOLDED SUBSTRATE FOR MOUNTING A SEMICONDUCTOR DIE AND A METHOD O...

INPUT/OUTPUT PINS FOR CHIP-EMBEDDED SUBSTRATE

Package-on-Package Structures and Methods for Forming the Same

HIGH DENSITY REDISTRIBUTION LAYER (RDL) INTERCONNECT BRIDGE USING A...

METHOD OF ATTACHING COMPONENTS TO PRINTED CIRUCUIT BOARD WITH REDUC...

Semiconductor Device Manufacturing Method