using electrostatic chucks

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CPC
H01L21/6831

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/6831using electrostatic chucks

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bowed substrate clamping method, apparatus, and system
- Patent number 12,224,192
- Issue date Feb 11, 2025
- Applied Materials, Inc.
- Arvinder S. Chadha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature manifold assembly for substrate processing systems
- Patent number 12,224,161
- Issue date Feb 11, 2025
- Lam Research Corporation
- Gabriel De Jesus Soto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing device and method of manufacturing substrate p...
- Patent number 12,211,706
- Issue date Jan 28, 2025
- Tokyo Electron Limited
- Manabu Nakagawasai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor processing chamber to accommodate parasitic plasma fo...
- Patent number 12,205,845
- Issue date Jan 21, 2025
- Applied Materials, Inc.
- Khokan Chandra Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rating substrate support assemblies based on impedance circuit elec...
- Patent number 12,205,791
- Issue date Jan 21, 2025
- Applied Materials, Inc.
- Arvind Shankar Raman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Plasma control method in semiconductor wafer fabrication
- Patent number 12,205,844
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huang-Shao Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer composite ceramic plate and manufacturing method thereof
- Patent number 12,195,402
- Issue date Jan 14, 2025
- RAYCER ADVANCED MATERIALS TECHNOLOGY CO., LTD
- Juxian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Measuring device and optical fiber strain measuring jig thereof
- Patent number 12,196,629
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Tong Wu
- G01 - MEASURING TESTING
Information Patent Grant
Reticle carrier and associated methods
- Patent number 12,189,311
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer device, transfer system, and end effector
- Patent number 12,191,188
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Norihiko Amikura
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Apparatus and method for inspecting electrostatic chuck
- Patent number 12,181,504
- Issue date Dec 31, 2024
- Semes Co., Ltd.
- Su Hyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment apparatus, a method of monitoring a process of man...
- Patent number 12,170,233
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Meehyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece holding tool
- Patent number 12,165,897
- Issue date Dec 10, 2024
- Kyocera Corporation
- Naoki Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate processing apparatus and semiconductor subs...
- Patent number 12,165,933
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Inkeun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sample holder
- Patent number 12,162,110
- Issue date Dec 10, 2024
- Kyocera Corporation
- Hiromasa Takemori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of clamping a substrate to a clamping system, a substrate ho...
- Patent number 12,158,704
- Issue date Dec 3, 2024
- ASML Netherlands B.V.
- Abraham Alexander Soethoudt
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Integrated substrate measurement system
- Patent number 12,148,647
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Patricia Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system and temperature control method
- Patent number 12,142,501
- Issue date Nov 12, 2024
- Tokyo Electron Limited
- Kenichiro Yamada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In situ real-time sensing and compensation of non-uniformities in s...
- Patent number 12,142,464
- Issue date Nov 12, 2024
- Lam Research Corporation
- Changyou Jing
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing chambers configured for tunable substrate and edg...
- Patent number 12,142,469
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck with seal surface
- Patent number 12,142,509
- Issue date Nov 12, 2024
- Lam Research Corporation
- Patrick G. Breiling
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Micro device mass transfer tool
- Patent number 12,131,922
- Issue date Oct 29, 2024
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithographic apparatus
- Patent number 12,117,736
- Issue date Oct 15, 2024
- ASML Netherlands B.V.
- Marcus Adrianus Van De Kerkhof
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and method for dechucking wafer in the...
- Patent number 12,106,942
- Issue date Oct 1, 2024
- Samsung Electronics Co., Ltd.
- Yi Rop Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Turbomolecular pump and cathode assembly for etching reactor
- Patent number 12,106,946
- Issue date Oct 1, 2024
- Lam Research Corporation
- Thorsten Lill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chucking process
- Patent number 12,100,609
- Issue date Sep 24, 2024
- Applied Materials, Inc.
- Sarah Michelle Bobek
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for stacking substrates and method for the same
- Patent number 12,100,667
- Issue date Sep 24, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer edge ring lifting solution
- Patent number 12,094,752
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Michael R. Rice
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for cleaning a process chamber
- Patent number 12,087,555
- Issue date Sep 10, 2024
- Applied Materials, Inc.
- Kalyanjit Ghosh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER CLAMPING METHOD AND SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20250029865
- Publication date Jan 23, 2025
- NISSIN ION EQUIPMENT CO., LTD.
- Takayuki MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE
- Publication number 20250022738
- Publication date Jan 16, 2025
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20250015030
- Publication date Jan 9, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING SYSTEM, ELECTROSTATIC CARRIER, AND PROCESSING METHOD
- Publication number 20240429073
- Publication date Dec 26, 2024
- TOKYO ELECTRON LIMITED
- Susumu HAYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER EDGE RING LIFTING SOLUTION
- Publication number 20240429088
- Publication date Dec 26, 2024
- Applied Materials, Inc.
- Michael R. RICE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
- Publication number 20240413093
- Publication date Dec 12, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20240411235
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Dae Geun YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FEEDBACK LOOP FOR CONTROLLING A PULSED VOLTAGE WAVEFORM
- Publication number 20240395502
- Publication date Nov 28, 2024
- Applied Materials, Inc.
- Leonid DORF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ETCH APPARATUS
- Publication number 20240395572
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hong-Ting LU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
- Publication number 20240387177
- Publication date Nov 21, 2024
- Nikon Corporation
- Hajime MITSUISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL DYNAMIC RESPONSE SENSING SYSTEMS FOR HEATERS
- Publication number 20240371665
- Publication date Nov 7, 2024
- WATLOW ELECTRIC MANUFACTURING COMPANY
- Louis P. STEINHAUSER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR MONITORING SUBSTRATE PROCESSING APPARATUS
- Publication number 20240371611
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- SEJIN OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TURBOMOLECULAR PUMP AND CATHODE ASSEMBLY FOR ETCHING REACTOR
- Publication number 20240355596
- Publication date Oct 24, 2024
- LAM RESEARCH CORPORATION
- Thorsten Lill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCKS WITH COOLANT GAS ZONES AND CORRESPONDING GROOV...
- Publication number 20240347366
- Publication date Oct 17, 2024
- LAM RESEARCH CORPORATION
- Alexander MATYUSHKIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20240347325
- Publication date Oct 17, 2024
- TOKYO ELECTRON LIMITED
- Yuki ONODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SUBSTRATE MEASUREMENT SYSTEM
- Publication number 20240339347
- Publication date Oct 10, 2024
- Applied Materials, Inc.
- Patricia Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20240331982
- Publication date Oct 3, 2024
- TOTO LTD.
- Yasutaka NITTA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROBER AND TEMPERATURE MEASUREMENT METHOD
- Publication number 20240329118
- Publication date Oct 3, 2024
- TOKYO SEIMITSU CO., LTD.
- Hiroo Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND RELATED DEVICE FOR REMOVING BY-PRODUCT ON SEMICONDUCTOR...
- Publication number 20240331988
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Liao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TUNABLE TEMPERATURE CONTROLLED SUBSTRATE SUPPORT ASSEMBLY
- Publication number 20240321620
- Publication date Sep 26, 2024
- Applied Materials, Inc.
- Vijay D. PARKHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE AS WELL AS METHOD FOR BONDING SUBSTRATES
- Publication number 20240312806
- Publication date Sep 19, 2024
- George GREGORY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UPPER ELECTRODE UNIT AND SUBSTRATE PROCESSING APPARATUS INCLUDING T...
- Publication number 20240297023
- Publication date Sep 5, 2024
- PSK INC.
- Kwang Sung YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PROCESSING AN ELECTROSTATIC CHUCK
- Publication number 20240286398
- Publication date Aug 29, 2024
- Entegris, Inc.
- Chiranjeevi PYDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT WITH IMPROVED PROCESS UNIFORMITY
- Publication number 20240282551
- Publication date Aug 22, 2024
- LAM RESEARCH CORPORATION
- Fangli Hao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HOLDER AND METHOD
- Publication number 20240264540
- Publication date Aug 8, 2024
- ASML NETHERLANDS B.V.
- Marcus Adrianus Van de Kerkhof
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIFT PIN ASSEMBLY
- Publication number 20240266206
- Publication date Aug 8, 2024
- Applied Materials, Inc.
- Yogananda SARODE VISHWANATH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE SUPPORT WITH REAL TIME FORCE AND FILM STRESS CONTROL
- Publication number 20240258075
- Publication date Aug 1, 2024
- Applied Materials, Inc.
- Wendell Glenn BOYD
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ROBOT, APPARATUS INCLUDING ROBOT, AND METHOD FOR MANUFACTURING SEMI...
- Publication number 20240243001
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yun CHENG
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
TEMPERATURE CONTROL DEVICE, SUBSTRATE PROCESSING APPARATUS, AND LIQ...
- Publication number 20240222169
- Publication date Jul 4, 2024
- TOKYO ELECTRON LIMITED
- Kei KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETERMINING AMOUNT OF WEAR OF EDGE RING, PLASMA PROCESSI...
- Publication number 20240212979
- Publication date Jun 27, 2024
- TOKYO ELECTRON LIMITED
- Ikko TANAKA
- H01 - BASIC ELECTRIC ELEMENTS

using electrostatic chucks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bowed substrate clamping method, apparatus, and system

Low temperature manifold assembly for substrate processing systems

Substrate processing device and method of manufacturing substrate p...

Semiconductor processing chamber to accommodate parasitic plasma fo...

Rating substrate support assemblies based on impedance circuit elec...

Plasma control method in semiconductor wafer fabrication

Multi-layer composite ceramic plate and manufacturing method thereof

Selective micro device transfer to receiver substrate

Measuring device and optical fiber strain measuring jig thereof

Reticle carrier and associated methods

Transfer device, transfer system, and end effector

Apparatus and method for inspecting electrostatic chuck

Plasma treatment apparatus, a method of monitoring a process of man...

Workpiece holding tool

Semiconductor substrate processing apparatus and semiconductor subs...

Sample holder

Method of clamping a substrate to a clamping system, a substrate ho...

Integrated substrate measurement system

Substrate processing system and temperature control method

In situ real-time sensing and compensation of non-uniformities in s...

Plasma processing chambers configured for tunable substrate and edg...

Electrostatic chuck with seal surface

Micro device mass transfer tool

Lithographic apparatus

Plasma processing apparatus and method for dechucking wafer in the...

Turbomolecular pump and cathode assembly for etching reactor

Electrostatic chucking process

Apparatus for stacking substrates and method for the same

Wafer edge ring lifting solution

Method and system for cleaning a process chamber

Patents Applicationslast 30 patents

WAFER CLAMPING METHOD AND SEMICONDUCTOR MANUFACTURING APPARATUS

ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

PROCESSING SYSTEM, ELECTROSTATIC CARRIER, AND PROCESSING METHOD

WAFER EDGE RING LIFTING SOLUTION

APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME

SEMICONDUCTOR MANUFACTURING APPARATUS

FEEDBACK LOOP FOR CONTROLLING A PULSED VOLTAGE WAVEFORM

WET ETCH APPARATUS

BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER

THERMAL DYNAMIC RESPONSE SENSING SYSTEMS FOR HEATERS

METHOD AND SYSTEM FOR MONITORING SUBSTRATE PROCESSING APPARATUS

TURBOMOLECULAR PUMP AND CATHODE ASSEMBLY FOR ETCHING REACTOR

ELECTROSTATIC CHUCKS WITH COOLANT GAS ZONES AND CORRESPONDING GROOV...

PLASMA PROCESSING APPARATUS

INTEGRATED SUBSTRATE MEASUREMENT SYSTEM

SEMICONDUCTOR MANUFACTURING APPARATUS

PROBER AND TEMPERATURE MEASUREMENT METHOD

PROCESS AND RELATED DEVICE FOR REMOVING BY-PRODUCT ON SEMICONDUCTOR...

TUNABLE TEMPERATURE CONTROLLED SUBSTRATE SUPPORT ASSEMBLY

BONDING DEVICE AS WELL AS METHOD FOR BONDING SUBSTRATES

UPPER ELECTRODE UNIT AND SUBSTRATE PROCESSING APPARATUS INCLUDING T...

METHODS AND APPARATUS FOR PROCESSING AN ELECTROSTATIC CHUCK

SUBSTRATE SUPPORT WITH IMPROVED PROCESS UNIFORMITY

SUBSTRATE HOLDER AND METHOD

LIFT PIN ASSEMBLY

SUBSTRATE SUPPORT WITH REAL TIME FORCE AND FILM STRESS CONTROL

ROBOT, APPARATUS INCLUDING ROBOT, AND METHOD FOR MANUFACTURING SEMI...

TEMPERATURE CONTROL DEVICE, SUBSTRATE PROCESSING APPARATUS, AND LIQ...

METHOD FOR DETERMINING AMOUNT OF WEAR OF EDGE RING, PLASMA PROCESSI...