using electrostatic chucks

Industry

CPC
H01L21/6831

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/6831using electrostatic chucks

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Plasma etching apparatus and method
- Patent number 12,362,152
- Issue date Jul 15, 2025
- SPTS Technologies Limited
- Maxime Varvara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment apparatus, deposition apparatus, electronic device manufa...
- Patent number 12,354,894
- Issue date Jul 8, 2025
- CANON TOKKI CORPORATION
- Toshiaki Himeji
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing apparatus
- Patent number 12,347,654
- Issue date Jul 1, 2025
- Tokyo Electron Limited
- Hwajun Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooled substrate support assembly for radio frequency environments
- Patent number 12,334,315
- Issue date Jun 17, 2025
- Applied Materials, Inc.
- Vijay D. Parkhe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Filter device and plasma processing apparatus
- Patent number 12,334,309
- Issue date Jun 17, 2025
- Tokyo Electron Limited
- Naohiko Okunishi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tunable temperature controlled substrate support assembly
- Patent number 12,334,385
- Issue date Jun 17, 2025
- Applied Materials, Inc.
- Vijay D. Parkhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal contamination reduction in substrate processing systems with...
- Patent number 12,322,579
- Issue date Jun 3, 2025
- Lam Research Corporation
- Maolin Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus, and method and program for controlling...
- Patent number 12,315,704
- Issue date May 27, 2025
- Tokyo Electron Limited
- Yusuke Saitoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control method for multi-zone active-matrix temperature control in...
- Patent number 12,309,891
- Issue date May 20, 2025
- ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA
- Tuqiang Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus
- Patent number 12,308,240
- Issue date May 20, 2025
- SPTS Technologies Limited
- Janet Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and mounting table thereof
- Patent number 12,293,937
- Issue date May 6, 2025
- Tokyo Electron Limited
- Yohei Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stage and substrate processing apparatus
- Patent number 12,288,676
- Issue date Apr 29, 2025
- Tokyo Electron Limited
- Takayuki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting table and plasma processing apparatus
- Patent number 12,288,713
- Issue date Apr 29, 2025
- Tokyo Electron Limited
- Yasuharu Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus, thermal resistance acquisition method,...
- Patent number 12,278,126
- Issue date Apr 15, 2025
- Tokyo Electron Limited
- Shinsuke Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer clamping method and semiconductor manufacturing apparatus
- Patent number 12,272,588
- Issue date Apr 8, 2025
- NISSIN ION EQUIPMENT CO., LTD.
- Takayuki Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process control enabled VDC sensor for plasma process
- Patent number 12,272,520
- Issue date Apr 8, 2025
- Tokyo Electron Limited
- Merritt Funk
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Stage and plasma processing apparatus
- Patent number 12,272,528
- Issue date Apr 8, 2025
- Tokyo Electron Limited
- Yasuharu Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cleaning process for substrate etching
- Patent number 12,255,055
- Issue date Mar 18, 2025
- Applied Materials, Inc.
- Yi Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Antenna member and apparatus for treating substrate
- Patent number 12,255,050
- Issue date Mar 18, 2025
- Semes Co., Ltd.
- Yoon Seok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet etch apparatus
- Patent number 12,249,520
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hong-Ting Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature controlled substrate support assembly
- Patent number 12,243,756
- Issue date Mar 4, 2025
- Applied Materials, Inc.
- Vijay D. Parkhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing assembly using pulsed-voltage and radio-frequency...
- Patent number 12,237,148
- Issue date Feb 25, 2025
- Applied Materials, Inc.
- Leonid Dorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic shielding for plasma sources
- Patent number 12,237,155
- Issue date Feb 25, 2025
- Lam Research Corporation
- Hema Swaroop Mopidevi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chucks with coolant gas zones and corresponding groov...
- Patent number 12,237,201
- Issue date Feb 25, 2025
- Lam Research Corporation
- Alexander Matyushkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods of control for plasma processing
- Patent number 12,230,475
- Issue date Feb 18, 2025
- Tokyo Electron Limited
- Alok Ranjan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bowed substrate clamping method, apparatus, and system
- Patent number 12,224,192
- Issue date Feb 11, 2025
- Applied Materials, Inc.
- Arvinder S. Chadha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature manifold assembly for substrate processing systems
- Patent number 12,224,161
- Issue date Feb 11, 2025
- Lam Research Corporation
- Gabriel De Jesus Soto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing device and method of manufacturing substrate p...
- Patent number 12,211,706
- Issue date Jan 28, 2025
- Tokyo Electron Limited
- Manabu Nakagawasai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor processing chamber to accommodate parasitic plasma fo...
- Patent number 12,205,845
- Issue date Jan 21, 2025
- Applied Materials, Inc.
- Khokan Chandra Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rating substrate support assemblies based on impedance circuit elec...
- Patent number 12,205,791
- Issue date Jan 21, 2025
- Applied Materials, Inc.
- Arvind Shankar Raman
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
PLASMA PROCESSING APPARATUS AND MOUNTING TABLE THEREOF
- Publication number 20250233008
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Yohei UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SENSOR AND WAFER ALIGNMENT SYSTEM INCLUDING THE SAME
- Publication number 20250232998
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Junghyun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGE AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250226190
- Publication date Jul 10, 2025
- TOKYO ELECTRON LIMITED
- Takayuki ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONSTRUCTING A SUBSTRATE TOPOLOGY MAP BASED ON MEASURED PROPERTIES
- Publication number 20250218831
- Publication date Jul 3, 2025
- Applied Materials, Inc.
- Saitanay Naribole
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
METHOD OF PROVIDING A WAFER
- Publication number 20250201614
- Publication date Jun 19, 2025
- SMART PHOTONICS HOLDING B.V.
- Alonso Jesús MILLÁN-MEJÍA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF VERIFYING WORKPIECE ALIGNMENT
- Publication number 20250191944
- Publication date Jun 12, 2025
- Axcelis Technologies, Inc.
- Yusef Nouri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR DEVICE FOR SEMICONDUCTOR EQUIPMENT, METHOD OF OPERATING A SE...
- Publication number 20250189347
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Gyoseon Choo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFICATION OF BACKSIDE STRESS MITIGATION WITH FRONTSIDE PROTECTION...
- Publication number 20250194165
- Publication date Jun 12, 2025
- Applied Materials, Inc.
- Changwoo Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CLEANING PROCESS FOR SUBSTRATE ETCHING
- Publication number 20250183016
- Publication date Jun 5, 2025
- Applied Materials, Inc.
- Yi Zhou
- B08 - CLEANING
Information Patent Application
CHIP ATTACHING DEVICE, CHIP PROCESSING SYSTEM, AND CHIP PROCESSING...
- Publication number 20250183222
- Publication date Jun 5, 2025
- TOKYO ELECTRON LIMITED
- Yasutaka Mizomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RATING SUBSTRATE SUPPORT ASSEMBLIES BASED ON IMPEDANCE CIRCUIT ELEC...
- Publication number 20250157788
- Publication date May 15, 2025
- Applied Materials, Inc.
- Arvind Shankar Raman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Bowed Substrate Clamping Method, Apparatus, and System
- Publication number 20250149361
- Publication date May 8, 2025
- Applied Materials, Inc.
- Arvinder S. CHADHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS OF CONTROL FOR PLASMA PROCESSING
- Publication number 20250149295
- Publication date May 8, 2025
- TOKYO ELECTRON LIMITED
- Alok Ranjan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ETCH UNIFORMITY IMPROVEMENT IN RADICAL ETCH USING CONFINEMENT RING
- Publication number 20250140529
- Publication date May 1, 2025
- LAM RESEARCH CORPORATION
- Andreas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS SUPPLY ASSEMBLY AND SEMICONDUCTOR WAFER PROCESSING APPARATUS US...
- Publication number 20250132134
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Taeil Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING RING
- Publication number 20250116332
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jihwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM
- Publication number 20250104979
- Publication date Mar 27, 2025
- TOKYO ELECTRON LIMITED
- Toshiki AKAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20250107424
- Publication date Mar 27, 2025
- SAMSUNG DISPLAY CO., LTD.
- Hyoungjun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RETICLE CARRIER AND ASSOCIATED METHODS
- Publication number 20250093789
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Hsun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETERMINING A CENTER POSITION OF A TRANSFERRED SEMICONDU...
- Publication number 20250087511
- Publication date Mar 13, 2025
- VM Inc.
- Tae Jin KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RING ASSEMBLY FOR SEMICONDUCTOR PROCESS, SUBSTRATE PROCESSING APPAR...
- Publication number 20250087465
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Hyungsik KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONITORING DEVICE FOR MEASURING CHARACTERISTICS OF EDGE AREA AND ME...
- Publication number 20250087508
- Publication date Mar 13, 2025
- WIT CORPORATION
- Jae Hwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROWAVE ANNEALING FOR LOW THERMAL BUDGET APPLICATIONS
- Publication number 20250087505
- Publication date Mar 13, 2025
- Applied Materials, Inc.
- Shashank Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATING DEVICE AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250069912
- Publication date Feb 27, 2025
- TOKYO ELECTRON LIMITED
- Einosuke TSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN SITU REAL-TIME SENSING AND COMPENSATION OF NON-UNIFORMITIES IN S...
- Publication number 20250069866
- Publication date Feb 27, 2025
- LAM RESEARCH CORPORATION
- Changyou JING
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TRANSFER DEVICE, TRANSFER SYSTEM, AND END EFFECTOR
- Publication number 20250069940
- Publication date Feb 27, 2025
- TOKYO ELECTRON LIMITED
- Norihiko AMIKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTIVE WAFER BOW MANAGEMENT
- Publication number 20250069959
- Publication date Feb 27, 2025
- Applied Materials, Inc.
- Mayur Govind Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK WITH SEAL SURFACE
- Publication number 20250062150
- Publication date Feb 20, 2025
- LAM RESEARCH CORPORATION
- Patrick Girard Breiling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CLAMPING METHOD AND SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20250029865
- Publication date Jan 23, 2025
- NISSIN ION EQUIPMENT CO., LTD.
- Takayuki MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE
- Publication number 20250022738
- Publication date Jan 16, 2025
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H01 - BASIC ELECTRIC ELEMENTS

using electrostatic chucks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plasma etching apparatus and method

Alignment apparatus, deposition apparatus, electronic device manufa...

Plasma processing apparatus

Cooled substrate support assembly for radio frequency environments

Filter device and plasma processing apparatus

Tunable temperature controlled substrate support assembly

Metal contamination reduction in substrate processing systems with...

Plasma processing apparatus, and method and program for controlling...

Control method for multi-zone active-matrix temperature control in...

Method and apparatus

Plasma processing apparatus and mounting table thereof

Stage and substrate processing apparatus

Mounting table and plasma processing apparatus

Plasma processing apparatus, thermal resistance acquisition method,...

Wafer clamping method and semiconductor manufacturing apparatus

Process control enabled VDC sensor for plasma process

Stage and plasma processing apparatus

Integrated cleaning process for substrate etching

Antenna member and apparatus for treating substrate

Wet etch apparatus

Temperature controlled substrate support assembly

Plasma processing assembly using pulsed-voltage and radio-frequency...

Magnetic shielding for plasma sources

Electrostatic chucks with coolant gas zones and corresponding groov...

Systems and methods of control for plasma processing

Bowed substrate clamping method, apparatus, and system

Low temperature manifold assembly for substrate processing systems

Substrate processing device and method of manufacturing substrate p...

Semiconductor processing chamber to accommodate parasitic plasma fo...

Rating substrate support assemblies based on impedance circuit elec...

Patents Applicationslast 30 patents

PLASMA PROCESSING APPARATUS AND MOUNTING TABLE THEREOF

WAFER SENSOR AND WAFER ALIGNMENT SYSTEM INCLUDING THE SAME

STAGE AND SUBSTRATE PROCESSING APPARATUS

CONSTRUCTING A SUBSTRATE TOPOLOGY MAP BASED ON MEASURED PROPERTIES

METHOD OF PROVIDING A WAFER

SYSTEM AND METHOD OF VERIFYING WORKPIECE ALIGNMENT

SENSOR DEVICE FOR SEMICONDUCTOR EQUIPMENT, METHOD OF OPERATING A SE...

UNIFICATION OF BACKSIDE STRESS MITIGATION WITH FRONTSIDE PROTECTION...

INTEGRATED CLEANING PROCESS FOR SUBSTRATE ETCHING

CHIP ATTACHING DEVICE, CHIP PROCESSING SYSTEM, AND CHIP PROCESSING...

RATING SUBSTRATE SUPPORT ASSEMBLIES BASED ON IMPEDANCE CIRCUIT ELEC...

Bowed Substrate Clamping Method, Apparatus, and System

SYSTEMS AND METHODS OF CONTROL FOR PLASMA PROCESSING

ETCH UNIFORMITY IMPROVEMENT IN RADICAL ETCH USING CONFINEMENT RING

GAS SUPPLY ASSEMBLY AND SEMICONDUCTOR WAFER PROCESSING APPARATUS US...

SEALING RING

SUBSTRATE PROCESSING SYSTEM

APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE

RETICLE CARRIER AND ASSOCIATED METHODS

METHOD FOR DETERMINING A CENTER POSITION OF A TRANSFERRED SEMICONDU...

RING ASSEMBLY FOR SEMICONDUCTOR PROCESS, SUBSTRATE PROCESSING APPAR...

MONITORING DEVICE FOR MEASURING CHARACTERISTICS OF EDGE AREA AND ME...

MICROWAVE ANNEALING FOR LOW THERMAL BUDGET APPLICATIONS

HEATING DEVICE AND SUBSTRATE PROCESSING APPARATUS

IN SITU REAL-TIME SENSING AND COMPENSATION OF NON-UNIFORMITIES IN S...

TRANSFER DEVICE, TRANSFER SYSTEM, AND END EFFECTOR

ADAPTIVE WAFER BOW MANAGEMENT

ELECTROSTATIC CHUCK WITH SEAL SURFACE

WAFER CLAMPING METHOD AND SEMICONDUCTOR MANUFACTURING APPARATUS

ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE