using electrostatic chucks

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CPC
H01L21/6831

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/6831using electrostatic chucks

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Plasma treatment apparatus, a method of monitoring a process of man...
- Patent number 12,170,233
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Meehyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sample holder
- Patent number 12,162,110
- Issue date Dec 10, 2024
- Kyocera Corporation
- Hiromasa Takemori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Workpiece holding tool
- Patent number 12,165,897
- Issue date Dec 10, 2024
- Kyocera Corporation
- Naoki Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate processing apparatus and semiconductor subs...
- Patent number 12,165,933
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Inkeun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of clamping a substrate to a clamping system, a substrate ho...
- Patent number 12,158,704
- Issue date Dec 3, 2024
- ASML Netherlands B.V.
- Abraham Alexander Soethoudt
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Integrated substrate measurement system
- Patent number 12,148,647
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Patricia Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system and temperature control method
- Patent number 12,142,501
- Issue date Nov 12, 2024
- Tokyo Electron Limited
- Kenichiro Yamada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In situ real-time sensing and compensation of non-uniformities in s...
- Patent number 12,142,464
- Issue date Nov 12, 2024
- Lam Research Corporation
- Changyou Jing
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing chambers configured for tunable substrate and edg...
- Patent number 12,142,469
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck with seal surface
- Patent number 12,142,509
- Issue date Nov 12, 2024
- Lam Research Corporation
- Patrick G. Breiling
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Micro device mass transfer tool
- Patent number 12,131,922
- Issue date Oct 29, 2024
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithographic apparatus
- Patent number 12,117,736
- Issue date Oct 15, 2024
- ASML Netherlands B.V.
- Marcus Adrianus Van De Kerkhof
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and method for dechucking wafer in the...
- Patent number 12,106,942
- Issue date Oct 1, 2024
- Samsung Electronics Co., Ltd.
- Yi Rop Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Turbomolecular pump and cathode assembly for etching reactor
- Patent number 12,106,946
- Issue date Oct 1, 2024
- Lam Research Corporation
- Thorsten Lill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chucking process
- Patent number 12,100,609
- Issue date Sep 24, 2024
- Applied Materials, Inc.
- Sarah Michelle Bobek
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for stacking substrates and method for the same
- Patent number 12,100,667
- Issue date Sep 24, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer edge ring lifting solution
- Patent number 12,094,752
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Michael R. Rice
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for cleaning a process chamber
- Patent number 12,087,555
- Issue date Sep 10, 2024
- Applied Materials, Inc.
- Kalyanjit Ghosh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus, temperature control method, and temper...
- Patent number 12,087,559
- Issue date Sep 10, 2024
- Tokyo Electron Limited
- Shinsuke Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer placement table
- Patent number 12,087,609
- Issue date Sep 10, 2024
- NGK Insulators, Ltd.
- Tatsuya Kuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method, bonding device, and holding member
- Patent number 12,080,554
- Issue date Sep 3, 2024
- Nikon Corporation
- Hajime Mitsuishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Permanent secondary erosion containment for electrostatic chuck bonds
- Patent number 12,074,049
- Issue date Aug 27, 2024
- Lam Research Corporation
- Eric A. Pape
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and system for monitoring substrate processing apparatus
- Patent number 12,068,140
- Issue date Aug 20, 2024
- Samsung Electronics Co., Ltd.
- Sejin Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma reactor having a variable coupling of low frequency RF power...
- Patent number 12,062,524
- Issue date Aug 13, 2024
- ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA
- Kui Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Feedback loop for controlling a pulsed voltage waveform
- Patent number 12,057,292
- Issue date Aug 6, 2024
- Applied Materials, Inc.
- Leonid Dorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etch using material modification and RF pulsing
- Patent number 12,057,329
- Issue date Aug 6, 2024
- Applied Materials, Inc.
- Bhargav Citla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro assembler with fine angle control
- Patent number 12,051,610
- Issue date Jul 30, 2024
- Xerox Corporation
- JengPing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 12,051,568
- Issue date Jul 30, 2024
- Toto Ltd.
- Yasutaka Nitta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal dynamic response sensing systems for heaters
- Patent number 12,040,204
- Issue date Jul 16, 2024
- Watlow Electric Manufacturing Company
- Louis P. Steinhauser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer holding body
- Patent number 12,033,880
- Issue date Jul 9, 2024
- Sumitomo Electric Industries, Ltd.
- Koichi Kimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20240411235
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Dae Geun YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
- Publication number 20240413093
- Publication date Dec 12, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FEEDBACK LOOP FOR CONTROLLING A PULSED VOLTAGE WAVEFORM
- Publication number 20240395502
- Publication date Nov 28, 2024
- Applied Materials, Inc.
- Leonid DORF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ETCH APPARATUS
- Publication number 20240395572
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hong-Ting LU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
- Publication number 20240387177
- Publication date Nov 21, 2024
- Nikon Corporation
- Hajime MITSUISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL DYNAMIC RESPONSE SENSING SYSTEMS FOR HEATERS
- Publication number 20240371665
- Publication date Nov 7, 2024
- WATLOW ELECTRIC MANUFACTURING COMPANY
- Louis P. STEINHAUSER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR MONITORING SUBSTRATE PROCESSING APPARATUS
- Publication number 20240371611
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- SEJIN OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TURBOMOLECULAR PUMP AND CATHODE ASSEMBLY FOR ETCHING REACTOR
- Publication number 20240355596
- Publication date Oct 24, 2024
- LAM RESEARCH CORPORATION
- Thorsten Lill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCKS WITH COOLANT GAS ZONES AND CORRESPONDING GROOV...
- Publication number 20240347366
- Publication date Oct 17, 2024
- LAM RESEARCH CORPORATION
- Alexander MATYUSHKIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20240347325
- Publication date Oct 17, 2024
- TOKYO ELECTRON LIMITED
- Yuki ONODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SUBSTRATE MEASUREMENT SYSTEM
- Publication number 20240339347
- Publication date Oct 10, 2024
- Applied Materials, Inc.
- Patricia Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20240331982
- Publication date Oct 3, 2024
- TOTO LTD.
- Yasutaka NITTA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROBER AND TEMPERATURE MEASUREMENT METHOD
- Publication number 20240329118
- Publication date Oct 3, 2024
- TOKYO SEIMITSU CO., LTD.
- Hiroo Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND RELATED DEVICE FOR REMOVING BY-PRODUCT ON SEMICONDUCTOR...
- Publication number 20240331988
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Liao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TUNABLE TEMPERATURE CONTROLLED SUBSTRATE SUPPORT ASSEMBLY
- Publication number 20240321620
- Publication date Sep 26, 2024
- Applied Materials, Inc.
- Vijay D. PARKHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE AS WELL AS METHOD FOR BONDING SUBSTRATES
- Publication number 20240312806
- Publication date Sep 19, 2024
- George GREGORY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UPPER ELECTRODE UNIT AND SUBSTRATE PROCESSING APPARATUS INCLUDING T...
- Publication number 20240297023
- Publication date Sep 5, 2024
- PSK INC.
- Kwang Sung YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PROCESSING AN ELECTROSTATIC CHUCK
- Publication number 20240286398
- Publication date Aug 29, 2024
- Entegris, Inc.
- Chiranjeevi PYDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT WITH IMPROVED PROCESS UNIFORMITY
- Publication number 20240282551
- Publication date Aug 22, 2024
- LAM RESEARCH CORPORATION
- Fangli Hao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HOLDER AND METHOD
- Publication number 20240264540
- Publication date Aug 8, 2024
- ASML NETHERLANDS B.V.
- Marcus Adrianus Van de Kerkhof
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIFT PIN ASSEMBLY
- Publication number 20240266206
- Publication date Aug 8, 2024
- Applied Materials, Inc.
- Yogananda SARODE VISHWANATH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE SUPPORT WITH REAL TIME FORCE AND FILM STRESS CONTROL
- Publication number 20240258075
- Publication date Aug 1, 2024
- Applied Materials, Inc.
- Wendell Glenn BOYD
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ROBOT, APPARATUS INCLUDING ROBOT, AND METHOD FOR MANUFACTURING SEMI...
- Publication number 20240243001
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yun CHENG
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
TEMPERATURE CONTROL DEVICE, SUBSTRATE PROCESSING APPARATUS, AND LIQ...
- Publication number 20240222169
- Publication date Jul 4, 2024
- TOKYO ELECTRON LIMITED
- Kei KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETERMINING AMOUNT OF WEAR OF EDGE RING, PLASMA PROCESSI...
- Publication number 20240212979
- Publication date Jun 27, 2024
- TOKYO ELECTRON LIMITED
- Ikko TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20240178047
- Publication date May 30, 2024
- SEMES CO., LTD.
- Yungi KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT FOR SEMICONDUCTOR DEVICE FABRICATION APPARATUS, SEMICONDU...
- Publication number 20240170266
- Publication date May 23, 2024
- SK enpulse Co., Ltd.
- Hyun Soo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLS AND METHODS FOR SUBTRACTIVE METAL PATTERNING
- Publication number 20240162058
- Publication date May 16, 2024
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOWED SUBSTRATE CLAMPING METHOD, APPARATUS, AND SYSTEM
- Publication number 20240162066
- Publication date May 16, 2024
- Arvinder S. CHADHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGE AND PLASMA PROCESSING APPARATUS
- Publication number 20240153749
- Publication date May 9, 2024
- TOKYO ELECTRON LIMITED
- Yasuharu SASAKI
- H01 - BASIC ELECTRIC ELEMENTS

using electrostatic chucks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plasma treatment apparatus, a method of monitoring a process of man...

Sample holder

Workpiece holding tool

Semiconductor substrate processing apparatus and semiconductor subs...

Method of clamping a substrate to a clamping system, a substrate ho...

Integrated substrate measurement system

Substrate processing system and temperature control method

In situ real-time sensing and compensation of non-uniformities in s...

Plasma processing chambers configured for tunable substrate and edg...

Electrostatic chuck with seal surface

Micro device mass transfer tool

Lithographic apparatus

Plasma processing apparatus and method for dechucking wafer in the...

Turbomolecular pump and cathode assembly for etching reactor

Electrostatic chucking process

Apparatus for stacking substrates and method for the same

Wafer edge ring lifting solution

Method and system for cleaning a process chamber

Plasma processing apparatus, temperature control method, and temper...

Wafer placement table

Bonding method, bonding device, and holding member

Permanent secondary erosion containment for electrostatic chuck bonds

Method and system for monitoring substrate processing apparatus

Plasma reactor having a variable coupling of low frequency RF power...

Feedback loop for controlling a pulsed voltage waveform

Selective etch using material modification and RF pulsing

Micro assembler with fine angle control

Semiconductor manufacturing apparatus

Thermal dynamic response sensing systems for heaters

Wafer holding body

Patents Applicationslast 30 patents

SEMICONDUCTOR MANUFACTURING APPARATUS

APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME

FEEDBACK LOOP FOR CONTROLLING A PULSED VOLTAGE WAVEFORM

WET ETCH APPARATUS

BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER

THERMAL DYNAMIC RESPONSE SENSING SYSTEMS FOR HEATERS

METHOD AND SYSTEM FOR MONITORING SUBSTRATE PROCESSING APPARATUS

TURBOMOLECULAR PUMP AND CATHODE ASSEMBLY FOR ETCHING REACTOR

ELECTROSTATIC CHUCKS WITH COOLANT GAS ZONES AND CORRESPONDING GROOV...

PLASMA PROCESSING APPARATUS

INTEGRATED SUBSTRATE MEASUREMENT SYSTEM

SEMICONDUCTOR MANUFACTURING APPARATUS

PROBER AND TEMPERATURE MEASUREMENT METHOD

PROCESS AND RELATED DEVICE FOR REMOVING BY-PRODUCT ON SEMICONDUCTOR...

TUNABLE TEMPERATURE CONTROLLED SUBSTRATE SUPPORT ASSEMBLY

BONDING DEVICE AS WELL AS METHOD FOR BONDING SUBSTRATES

UPPER ELECTRODE UNIT AND SUBSTRATE PROCESSING APPARATUS INCLUDING T...

METHODS AND APPARATUS FOR PROCESSING AN ELECTROSTATIC CHUCK

SUBSTRATE SUPPORT WITH IMPROVED PROCESS UNIFORMITY

SUBSTRATE HOLDER AND METHOD

LIFT PIN ASSEMBLY

SUBSTRATE SUPPORT WITH REAL TIME FORCE AND FILM STRESS CONTROL

ROBOT, APPARATUS INCLUDING ROBOT, AND METHOD FOR MANUFACTURING SEMI...

TEMPERATURE CONTROL DEVICE, SUBSTRATE PROCESSING APPARATUS, AND LIQ...

METHOD FOR DETERMINING AMOUNT OF WEAR OF EDGE RING, PLASMA PROCESSI...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

COMPONENT FOR SEMICONDUCTOR DEVICE FABRICATION APPARATUS, SEMICONDU...

TOOLS AND METHODS FOR SUBTRACTIVE METAL PATTERNING

BOWED SUBSTRATE CLAMPING METHOD, APPARATUS, AND SYSTEM

STAGE AND PLASMA PROCESSING APPARATUS