using electrostatic chucks

Industry

CPC
H01L21/6831

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/6831using electrostatic chucks

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated cleaning process for substrate etching
- Patent number 12,255,055
- Issue date Mar 18, 2025
- Applied Materials, Inc.
- Yi Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Antenna member and apparatus for treating substrate
- Patent number 12,255,050
- Issue date Mar 18, 2025
- Semes Co., Ltd.
- Yoon Seok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet etch apparatus
- Patent number 12,249,520
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hong-Ting Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature controlled substrate support assembly
- Patent number 12,243,756
- Issue date Mar 4, 2025
- Applied Materials, Inc.
- Vijay D. Parkhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing assembly using pulsed-voltage and radio-frequency...
- Patent number 12,237,148
- Issue date Feb 25, 2025
- Applied Materials, Inc.
- Leonid Dorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic shielding for plasma sources
- Patent number 12,237,155
- Issue date Feb 25, 2025
- Lam Research Corporation
- Hema Swaroop Mopidevi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chucks with coolant gas zones and corresponding groov...
- Patent number 12,237,201
- Issue date Feb 25, 2025
- Lam Research Corporation
- Alexander Matyushkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods of control for plasma processing
- Patent number 12,230,475
- Issue date Feb 18, 2025
- Tokyo Electron Limited
- Alok Ranjan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bowed substrate clamping method, apparatus, and system
- Patent number 12,224,192
- Issue date Feb 11, 2025
- Applied Materials, Inc.
- Arvinder S. Chadha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature manifold assembly for substrate processing systems
- Patent number 12,224,161
- Issue date Feb 11, 2025
- Lam Research Corporation
- Gabriel De Jesus Soto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing device and method of manufacturing substrate p...
- Patent number 12,211,706
- Issue date Jan 28, 2025
- Tokyo Electron Limited
- Manabu Nakagawasai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor processing chamber to accommodate parasitic plasma fo...
- Patent number 12,205,845
- Issue date Jan 21, 2025
- Applied Materials, Inc.
- Khokan Chandra Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rating substrate support assemblies based on impedance circuit elec...
- Patent number 12,205,791
- Issue date Jan 21, 2025
- Applied Materials, Inc.
- Arvind Shankar Raman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Plasma control method in semiconductor wafer fabrication
- Patent number 12,205,844
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huang-Shao Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Multi-layer composite ceramic plate and manufacturing method thereof
- Patent number 12,195,402
- Issue date Jan 14, 2025
- RAYCER ADVANCED MATERIALS TECHNOLOGY CO., LTD
- Juxian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measuring device and optical fiber strain measuring jig thereof
- Patent number 12,196,629
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Tong Wu
- G01 - MEASURING TESTING
Information Patent Grant
Reticle carrier and associated methods
- Patent number 12,189,311
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer device, transfer system, and end effector
- Patent number 12,191,188
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Norihiko Amikura
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Apparatus and method for inspecting electrostatic chuck
- Patent number 12,181,504
- Issue date Dec 31, 2024
- Semes Co., Ltd.
- Su Hyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment apparatus, a method of monitoring a process of man...
- Patent number 12,170,233
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Meehyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece holding tool
- Patent number 12,165,897
- Issue date Dec 10, 2024
- Kyocera Corporation
- Naoki Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate processing apparatus and semiconductor subs...
- Patent number 12,165,933
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Inkeun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sample holder
- Patent number 12,162,110
- Issue date Dec 10, 2024
- Kyocera Corporation
- Hiromasa Takemori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of clamping a substrate to a clamping system, a substrate ho...
- Patent number 12,158,704
- Issue date Dec 3, 2024
- ASML Netherlands B.V.
- Abraham Alexander Soethoudt
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Integrated substrate measurement system
- Patent number 12,148,647
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Patricia Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system and temperature control method
- Patent number 12,142,501
- Issue date Nov 12, 2024
- Tokyo Electron Limited
- Kenichiro Yamada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In situ real-time sensing and compensation of non-uniformities in s...
- Patent number 12,142,464
- Issue date Nov 12, 2024
- Lam Research Corporation
- Changyou Jing
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing chambers configured for tunable substrate and edg...
- Patent number 12,142,469
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck with seal surface
- Patent number 12,142,509
- Issue date Nov 12, 2024
- Lam Research Corporation
- Patrick G. Breiling
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
RETICLE CARRIER AND ASSOCIATED METHODS
- Publication number 20250093789
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Hsun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETERMINING A CENTER POSITION OF A TRANSFERRED SEMICONDU...
- Publication number 20250087511
- Publication date Mar 13, 2025
- VM Inc.
- Tae Jin KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RING ASSEMBLY FOR SEMICONDUCTOR PROCESS, SUBSTRATE PROCESSING APPAR...
- Publication number 20250087465
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Hyungsik KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONITORING DEVICE FOR MEASURING CHARACTERISTICS OF EDGE AREA AND ME...
- Publication number 20250087508
- Publication date Mar 13, 2025
- WIT CORPORATION
- Jae Hwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROWAVE ANNEALING FOR LOW THERMAL BUDGET APPLICATIONS
- Publication number 20250087505
- Publication date Mar 13, 2025
- Applied Materials, Inc.
- Shashank Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATING DEVICE AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250069912
- Publication date Feb 27, 2025
- TOKYO ELECTRON LIMITED
- Einosuke TSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN SITU REAL-TIME SENSING AND COMPENSATION OF NON-UNIFORMITIES IN S...
- Publication number 20250069866
- Publication date Feb 27, 2025
- LAM RESEARCH CORPORATION
- Changyou JING
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TRANSFER DEVICE, TRANSFER SYSTEM, AND END EFFECTOR
- Publication number 20250069940
- Publication date Feb 27, 2025
- TOKYO ELECTRON LIMITED
- Norihiko AMIKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTIVE WAFER BOW MANAGEMENT
- Publication number 20250069959
- Publication date Feb 27, 2025
- Applied Materials, Inc.
- Mayur Govind Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK WITH SEAL SURFACE
- Publication number 20250062150
- Publication date Feb 20, 2025
- LAM RESEARCH CORPORATION
- Patrick Girard Breiling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CLAMPING METHOD AND SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20250029865
- Publication date Jan 23, 2025
- NISSIN ION EQUIPMENT CO., LTD.
- Takayuki MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE
- Publication number 20250022738
- Publication date Jan 16, 2025
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20250015030
- Publication date Jan 9, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING SYSTEM, ELECTROSTATIC CARRIER, AND PROCESSING METHOD
- Publication number 20240429073
- Publication date Dec 26, 2024
- TOKYO ELECTRON LIMITED
- Susumu HAYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER EDGE RING LIFTING SOLUTION
- Publication number 20240429088
- Publication date Dec 26, 2024
- Applied Materials, Inc.
- Michael R. RICE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
- Publication number 20240413093
- Publication date Dec 12, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20240411235
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Dae Geun YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FEEDBACK LOOP FOR CONTROLLING A PULSED VOLTAGE WAVEFORM
- Publication number 20240395502
- Publication date Nov 28, 2024
- Applied Materials, Inc.
- Leonid DORF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ETCH APPARATUS
- Publication number 20240395572
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hong-Ting LU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
- Publication number 20240387177
- Publication date Nov 21, 2024
- Nikon Corporation
- Hajime MITSUISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL DYNAMIC RESPONSE SENSING SYSTEMS FOR HEATERS
- Publication number 20240371665
- Publication date Nov 7, 2024
- WATLOW ELECTRIC MANUFACTURING COMPANY
- Louis P. STEINHAUSER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR MONITORING SUBSTRATE PROCESSING APPARATUS
- Publication number 20240371611
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- SEJIN OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TURBOMOLECULAR PUMP AND CATHODE ASSEMBLY FOR ETCHING REACTOR
- Publication number 20240355596
- Publication date Oct 24, 2024
- LAM RESEARCH CORPORATION
- Thorsten Lill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCKS WITH COOLANT GAS ZONES AND CORRESPONDING GROOV...
- Publication number 20240347366
- Publication date Oct 17, 2024
- LAM RESEARCH CORPORATION
- Alexander MATYUSHKIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20240347325
- Publication date Oct 17, 2024
- TOKYO ELECTRON LIMITED
- Yuki ONODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SUBSTRATE MEASUREMENT SYSTEM
- Publication number 20240339347
- Publication date Oct 10, 2024
- Applied Materials, Inc.
- Patricia Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20240331982
- Publication date Oct 3, 2024
- TOTO LTD.
- Yasutaka NITTA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROBER AND TEMPERATURE MEASUREMENT METHOD
- Publication number 20240329118
- Publication date Oct 3, 2024
- TOKYO SEIMITSU CO., LTD.
- Hiroo Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND RELATED DEVICE FOR REMOVING BY-PRODUCT ON SEMICONDUCTOR...
- Publication number 20240331988
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Liao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TUNABLE TEMPERATURE CONTROLLED SUBSTRATE SUPPORT ASSEMBLY
- Publication number 20240321620
- Publication date Sep 26, 2024
- Applied Materials, Inc.
- Vijay D. PARKHE
- H01 - BASIC ELECTRIC ELEMENTS

using electrostatic chucks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated cleaning process for substrate etching

Antenna member and apparatus for treating substrate

Wet etch apparatus

Temperature controlled substrate support assembly

Plasma processing assembly using pulsed-voltage and radio-frequency...

Magnetic shielding for plasma sources

Electrostatic chucks with coolant gas zones and corresponding groov...

Systems and methods of control for plasma processing

Bowed substrate clamping method, apparatus, and system

Low temperature manifold assembly for substrate processing systems

Substrate processing device and method of manufacturing substrate p...

Semiconductor processing chamber to accommodate parasitic plasma fo...

Rating substrate support assemblies based on impedance circuit elec...

Plasma control method in semiconductor wafer fabrication

Selective micro device transfer to receiver substrate

Multi-layer composite ceramic plate and manufacturing method thereof

Measuring device and optical fiber strain measuring jig thereof

Reticle carrier and associated methods

Transfer device, transfer system, and end effector

Apparatus and method for inspecting electrostatic chuck

Plasma treatment apparatus, a method of monitoring a process of man...

Workpiece holding tool

Semiconductor substrate processing apparatus and semiconductor subs...

Sample holder

Method of clamping a substrate to a clamping system, a substrate ho...

Integrated substrate measurement system

Substrate processing system and temperature control method

In situ real-time sensing and compensation of non-uniformities in s...

Plasma processing chambers configured for tunable substrate and edg...

Electrostatic chuck with seal surface

Patents Applicationslast 30 patents

RETICLE CARRIER AND ASSOCIATED METHODS

METHOD FOR DETERMINING A CENTER POSITION OF A TRANSFERRED SEMICONDU...

RING ASSEMBLY FOR SEMICONDUCTOR PROCESS, SUBSTRATE PROCESSING APPAR...

MONITORING DEVICE FOR MEASURING CHARACTERISTICS OF EDGE AREA AND ME...

MICROWAVE ANNEALING FOR LOW THERMAL BUDGET APPLICATIONS

HEATING DEVICE AND SUBSTRATE PROCESSING APPARATUS

IN SITU REAL-TIME SENSING AND COMPENSATION OF NON-UNIFORMITIES IN S...

TRANSFER DEVICE, TRANSFER SYSTEM, AND END EFFECTOR

ADAPTIVE WAFER BOW MANAGEMENT

ELECTROSTATIC CHUCK WITH SEAL SURFACE

WAFER CLAMPING METHOD AND SEMICONDUCTOR MANUFACTURING APPARATUS

ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

PROCESSING SYSTEM, ELECTROSTATIC CARRIER, AND PROCESSING METHOD

WAFER EDGE RING LIFTING SOLUTION

APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME

SEMICONDUCTOR MANUFACTURING APPARATUS

FEEDBACK LOOP FOR CONTROLLING A PULSED VOLTAGE WAVEFORM

WET ETCH APPARATUS

BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER

THERMAL DYNAMIC RESPONSE SENSING SYSTEMS FOR HEATERS

METHOD AND SYSTEM FOR MONITORING SUBSTRATE PROCESSING APPARATUS

TURBOMOLECULAR PUMP AND CATHODE ASSEMBLY FOR ETCHING REACTOR

ELECTROSTATIC CHUCKS WITH COOLANT GAS ZONES AND CORRESPONDING GROOV...

PLASMA PROCESSING APPARATUS

INTEGRATED SUBSTRATE MEASUREMENT SYSTEM

SEMICONDUCTOR MANUFACTURING APPARATUS

PROBER AND TEMPERATURE MEASUREMENT METHOD

PROCESS AND RELATED DEVICE FOR REMOVING BY-PRODUCT ON SEMICONDUCTOR...

TUNABLE TEMPERATURE CONTROLLED SUBSTRATE SUPPORT ASSEMBLY