Membership
Tour
Register
Log in
using electrostatic chucks
Follow
Industry
CPC
H01L21/6831
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Current Industry
H01L21/6831
using electrostatic chucks
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Plasma processing apparatus and plasma processing method
Patent number
11,972,925
Issue date
Apr 30, 2024
Tokyo Electron Limited
Bong seong Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate support for reduced damage substrate backside
Patent number
11,955,362
Issue date
Apr 9, 2024
Applied Materials, Inc.
Joel M Huston
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Automatic electrostatic chuck bias compensation during plasma proce...
Patent number
11,948,780
Issue date
Apr 2, 2024
Applied Materials, Inc.
Linying Cui
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrostatic chucks with coolant gas zones and corresponding groov...
Patent number
11,942,351
Issue date
Mar 26, 2024
Lam Research Corporation
Alexander Matyushkin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Workpiece placement apparatus and processing apparatus
Patent number
11,942,357
Issue date
Mar 26, 2024
Tokyo Electron Limited
Yohei Uchida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pixelated electrostatic adhesion
Patent number
11,936,308
Issue date
Mar 19, 2024
The Boeing Company
David M. Bain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrostatically clamped edge ring
Patent number
11,935,776
Issue date
Mar 19, 2024
Lam Research Corporation
Christopher Kimball
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Preventive maintenance method for chamber of metal etching machine
Patent number
11,911,809
Issue date
Feb 27, 2024
Shanghai Huali Microelectronics Corporation
Minjie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate support with real time force and film stress control
Patent number
11,915,913
Issue date
Feb 27, 2024
Applied Materials, Inc.
Wendell Glenn Boyd
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Electrostatic chuck and substrate fixing device
Patent number
11,909,335
Issue date
Feb 20, 2024
Shinko Electric Industries Co., Ltd.
Takashi Onuma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stage and plasma processing apparatus
Patent number
11,908,666
Issue date
Feb 20, 2024
Tokyo Electron Limited
Yasuharu Sasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Support table for a lithographic apparatus, method of loading a sub...
Patent number
11,898,601
Issue date
Feb 13, 2024
ASML Netherlands B.V.
Siegfried Alexander Tromp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Single wafer processing environments with spatial separation
Patent number
11,894,257
Issue date
Feb 6, 2024
Applied Materials, Inc.
Michael Rice
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
In-situ apparatus for semiconductor process module
Patent number
11,887,879
Issue date
Jan 30, 2024
Applied Materials, Inc.
Yogananda Sarode Vishwanath
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Apparatus and method for treating substrate
Patent number
11,881,382
Issue date
Jan 23, 2024
Semes Co., Ltd.
Jun Pyo Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Radio frequency electrode assembly for plasma processing apparatus,...
Patent number
11,875,970
Issue date
Jan 16, 2024
ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA
Longbao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate processing apparatus and charge neutralization method for...
Patent number
11,862,439
Issue date
Jan 2, 2024
Tokyo Electron Limited
Takahiro Kawawa
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Adjustable fastening device for plasma gas injectors
Patent number
11,854,769
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Yung-Shun Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate stage, substrate processing apparatus, and temperature co...
Patent number
11,854,843
Issue date
Dec 26, 2023
Tokyo Electron Limited
Hajime Tamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-plate electrostatic chucks with ceramic baseplates
Patent number
11,848,177
Issue date
Dec 19, 2023
Lam Research Corporation
Feng Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plasma processing using pulsed-voltage and radio-frequency power
Patent number
11,848,176
Issue date
Dec 19, 2023
Applied Materials, Inc.
Leonid Dorf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked substrate manufacturing method, stacked substrate manufactu...
Patent number
11,842,905
Issue date
Dec 12, 2023
Nikon Corporation
Isao Sugaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Protective coating for electrostatic chucks
Patent number
11,835,868
Issue date
Dec 5, 2023
Lam Research Corporation
Stephen Topping
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Plasma reactor having a function of tuning low frequency RF power d...
Patent number
11,830,747
Issue date
Nov 28, 2023
ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA
Kui Zhao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacking apparatus and stacking method
Patent number
11,823,935
Issue date
Nov 21, 2023
Nikon Corporation
Hajime Mitsuishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate bonding apparatus and substrate bonding method
Patent number
11,791,223
Issue date
Oct 17, 2023
Nikon Corporation
Isao Sugaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer placement apparatus
Patent number
11,784,078
Issue date
Oct 10, 2023
NGK Insulators, Ltd.
Joyo Ito
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatuses and methods for avoiding electrical breakdown from RF t...
Patent number
11,784,027
Issue date
Oct 10, 2023
Lam Research Corporation
Hyungjoon Kim
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Edge seal for lower electrode assembly
Patent number
11,781,650
Issue date
Oct 10, 2023
Lam Research Corporation
David Schaefer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plasma processing assembly using pulsed-voltage and radio-frequency...
Patent number
11,776,789
Issue date
Oct 3, 2023
Applied Materials, Inc.
Leonid Dorf
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF ADJUSTING HEAT UNIFORMITY ON WAFER MOUNT AND METHOD OF MA...
Publication number
20240120216
Publication date
Apr 11, 2024
NGK Insulators, Ltd.
Hiroya SUGIMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VACUUM PROCESSING APPARATUS
Publication number
20240120233
Publication date
Apr 11, 2024
Ulvac, Inc.
Tetsushi Fujinaga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
System and Method for Plasma Process Uniformity Control
Publication number
20240120181
Publication date
Apr 11, 2024
TOKYO ELECTRON LIMITED
Sergey Voronin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-PLATE ELECTROSTATIC CHUCKS WITH CERAMIC BASEPLATES
Publication number
20240112893
Publication date
Apr 4, 2024
LAM RESEARCH CORPORATION
Feng WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOFT-CHUCKING SCHEME FOR IMPROVED BACKSIDE PARTICLE PERFORMANCE
Publication number
20240112939
Publication date
Apr 4, 2024
Applied Materials, Inc.
Tony Jefferson GNANAPRAKASA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TEMPERATURE CONTROL METHOD
Publication number
20240103482
Publication date
Mar 28, 2024
TOKYO ELECTRON LIMITED
Takari Yamamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURI...
Publication number
20240105470
Publication date
Mar 28, 2024
Samsung Electronics Co., Ltd.
Dong Il PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINGLE WAFER PROCESSING ENVIRONMENTS WITH SPATIAL SEPARATION
Publication number
20240096688
Publication date
Mar 21, 2024
Applied Materials, Inc.
Michael Robert Rice
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USIN...
Publication number
20240096637
Publication date
Mar 21, 2024
Samsung Electronics Co., Ltd.
Hyungsik KO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Publication number
20240082956
Publication date
Mar 14, 2024
TOKYO ELECTRON LIMITED
Susumu HAYAKAWA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
EDGE SEAL FOR LOWER ELECTRODE ASSEMBLY
Publication number
20240077138
Publication date
Mar 7, 2024
LAM RESEARCH CORPORATION
David SCHAEFER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP-TO-WAFER STACKING METHOD
Publication number
20240047416
Publication date
Feb 8, 2024
WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
Tanlin CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROTECTIVE COATING FOR ELECTROSTATIC CHUCKS
Publication number
20240045344
Publication date
Feb 8, 2024
LAM RESEARCH CORPORATION
Stephen TOPPING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
Publication number
20240038501
Publication date
Feb 1, 2024
TOKYO ELECTRON LIMITED
Akira NAKAGAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLASMA PROCESSING ASSEMBLY USING PULSED-VOLTAGE AND RADIO-FREQUENCY...
Publication number
20240030002
Publication date
Jan 25, 2024
Applied Materials, Inc.
Leonid DORF
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FOCUS RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND...
Publication number
20240021417
Publication date
Jan 18, 2024
Samsung Electronics Co., Ltd.
Hyungsik KO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SUBSTRATE MANUFACTURING METHOD, STACKED SUBSTRATE MANUFACTU...
Publication number
20240021447
Publication date
Jan 18, 2024
Nikon Corporation
Isao SUGAYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
Publication number
20240014079
Publication date
Jan 11, 2024
Nikon Corporation
Isao SUGAYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUSES AND METHODS FOR AVOIDING ELECTRICAL BREAKDOWN FROM RF T...
Publication number
20230420218
Publication date
Dec 28, 2023
LAM RESEARCH CORPORATION
Hyungjoon Kim
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
COMPONENT CARRIER FOR SEMICONDUCTOR MANUFACTURING AND COMPONENT TRA...
Publication number
20230411196
Publication date
Dec 21, 2023
SEMES CO., LTD.
Jae Won SHIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ETCHING METHOD AND PLASMA PROCESSING SYSTEM
Publication number
20230402289
Publication date
Dec 14, 2023
TOKYO ELECTRON LIMITED
Kae TAKAHASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Publication number
20230395390
Publication date
Dec 7, 2023
TOKYO ELECTRON LIMITED
Maju TOMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AUTO-CALIBRATION TO A STATION OF A PROCESS MODULE THAT SPINS A WAFER
Publication number
20230395410
Publication date
Dec 7, 2023
LAM RESEARCH CORPORATION
Jacob L. Hiester
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Plasma-Assisted Etching Of Metal Oxides
Publication number
20230386854
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chansyun David YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ETCHING METHOD AND PLASMA PROCESSING SYSTEM
Publication number
20230377850
Publication date
Nov 23, 2023
TOKYO ELECTRON LIMITED
Satoshi OHUCHIDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRO ASSEMBLER WITH FINE ANGLE CONTROL
Publication number
20230369089
Publication date
Nov 16, 2023
Palo Alto Research Center Incorporated
JengPing Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR MANUFACTURING DISPLAY DEVICE AND METHOD OF MANUFACTUR...
Publication number
20230363246
Publication date
Nov 9, 2023
SAMSUNG DISPLAY CO., LTD.
Youngsun Cho
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
INCREASING THE GAS EFFICIENCY FOR AN ELECTROSTATIC CHUCK
Publication number
20230350435
Publication date
Nov 2, 2023
Applied Materials, Inc.
Vijay D. Parkhe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-LAYER CERAMIC PLATE DEVICE
Publication number
20230347436
Publication date
Nov 2, 2023
WATLOW ELECTRIC MANUFACTURING COMPANY
Michael PARKER
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
Publication number
20230343647
Publication date
Oct 26, 2023
Plasma-Therm LLC
Russell Westerman
H01 - BASIC ELECTRIC ELEMENTS