using locally applied jets of electrolyte

Industry

CPC
C25D5/026

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Parent Industries

CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D5/00Electroplating characterised by the process Pretreatment or after-treatment of work-pieces

Current Industry

C25D5/026using locally applied jets of electrolyte

Industries

Patents Grantslast 30 patents

Information Patent Grant
Making multi-component structures using dynamic menisci
- Patent number 11,795,562
- Issue date Oct 24, 2023
- Rise Technology S.R.L.
- Marco Balucani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Massively-parallel micronozzle array for direct write electrodeposi...
- Patent number 11,639,556
- Issue date May 2, 2023
- Intel Corporation
- Joe Walczyk
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical three-dimensional printing and soldering
- Patent number 11,535,947
- Issue date Dec 27, 2022
- University of South Florida
- Arash Takshi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus for electro-forming and apparatus for horizontal electro-...
- Patent number 11,530,489
- Issue date Dec 20, 2022
- LG Display Co., Ltd.
- ByeongSun Yoo
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Surface treatment device
- Patent number 11,371,158
- Issue date Jun 28, 2022
- Honda Motor Co., Ltd.
- Yuki Furukawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus
- Patent number 11,365,487
- Issue date Jun 21, 2022
- Nippon Steel Corporation
- Masanari Kimoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical three-dimensional printing and soldering
- Patent number 11,214,884
- Issue date Jan 4, 2022
- University of South Florida
- Arash Takshi
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Electroplating apparatus
- Patent number 11,060,201
- Issue date Jul 13, 2021
- Nippon Steel Corporation
- Masanari Kimoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Device for vertical galvanic metal deposition on a substrate
- Patent number 10,604,861
- Issue date Mar 31, 2020
- Atotech Deutschland GmbH
- Ray Weinhold
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for surface electrolytic treatment of garment accessory part...
- Patent number 10,590,557
- Issue date Mar 17, 2020
- YKK Corporation
- Kenji Hasegawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Photovoltaic cell with porous semiconductor regions for anchoring c...
- Patent number 10,109,512
- Issue date Oct 23, 2018
- Rise Technology S.R.L.
- Marco Balucani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus for steel pipes
- Patent number 9,957,631
- Issue date May 1, 2018
- Nippon Steel & Sumitomo Metal Corporation
- Masanari Kimoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal plating method and apparatus
- Patent number 9,957,635
- Issue date May 1, 2018
- Pratt & Whitney Canada Corp.
- Jerome James
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Manufacturing a hardened formed part
- Patent number 9,938,600
- Issue date Apr 10, 2018
- Muhr und Bender KG
- Thomas Muhr
- C21 - METALLURGY OF IRON
Information Patent Grant
Localized, in-vacuum modification of small structures
- Patent number 9,812,286
- Issue date Nov 7, 2017
- FEI Company
- David H. Narum
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method
- Patent number 9,730,337
- Issue date Aug 8, 2017
- C. Uyemura & Co., Ltd.
- Toshihisa Isono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bipolar electrochemical printing
- Patent number 9,677,186
- Issue date Jun 13, 2017
- University of Washington
- Trevor Braun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High speed electroplating metallic conductors
- Patent number 9,530,653
- Issue date Dec 27, 2016
- Uri Cohen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plug gauge with maintenance line and round point and method of manu...
- Patent number 9,476,821
- Issue date Oct 25, 2016
- Niigata Seiki Co., Ltd.
- Toshiyuki Igarashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
System and method for electroplating of hole surfaces
- Patent number 9,303,328
- Issue date Apr 5, 2016
- Teledyne Instruments, Inc.
- John Bradley Hunter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroplated metallic conductors
- Patent number 9,273,409
- Issue date Mar 1, 2016
- Uri Cohen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal plating method and apparatus
- Patent number 8,747,639
- Issue date Jun 10, 2014
- Pratt & Whitney Canada Corp.
- Jerome James
- F05 - INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF...
Information Patent Grant
Systems and methods for in situ annealing of electro- and electrole...
- Patent number 8,496,799
- Issue date Jul 30, 2013
- The Trustees of Columbia University In the City of New York
- Robert J. Von Gutfeld
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroplating head and method for operating the same
- Patent number 8,419,917
- Issue date Apr 16, 2013
- Lam Research Corporation
- Yezdi Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for enhanced electrochemical deposition
- Patent number 8,349,149
- Issue date Jan 8, 2013
- Uri Cohen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for depositing and planarizing thin films of s...
- Patent number 7,947,157
- Issue date May 24, 2011
- Lam Research Corporation
- Mike Ravkin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for filling through hole
- Patent number 7,909,976
- Issue date Mar 22, 2011
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrochemical deposition method utilizing microdroplets of solution
- Patent number 7,628,902
- Issue date Dec 8, 2009
- Boise State University
- William B. Knowlton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrochemical micromanufacturing system and method
- Patent number 7,615,141
- Issue date Nov 10, 2009
- University of Washington
- Daniel T. Schwartz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroplating head and method for operating the same
- Patent number 7,563,348
- Issue date Jul 21, 2009
- Lam Research Corporation
- Yezdi Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTROCHEMICAL ASSEMBLY FOR FORMING SEMICONDUCTOR FEATURES
- Publication number 20240084473
- Publication date Mar 14, 2024
- LAM RESEARCH CORPORATION
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SHIELD BODY SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTROL...
- Publication number 20230313407
- Publication date Oct 5, 2023
- Semsysco GmbH
- Herbert ÖTZLINGER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL THREE-DIMENSIONAL PRINTING AND SOLDERING
- Publication number 20230129434
- Publication date Apr 27, 2023
- University of South Florida
- Arash Takshi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SURFACE TREATMENT DEVICE
- Publication number 20220267922
- Publication date Aug 25, 2022
- Honda Motor Co., Ltd.
- Yuki Furukawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MAKING MULTI-COMPONENT STRUCTURES USING DYNAMIC MENISCI
- Publication number 20220010449
- Publication date Jan 13, 2022
- Rise Technology S.R.L.
- Marco Balucani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURFACE TREATMENT DEVICE
- Publication number 20200407868
- Publication date Dec 31, 2020
- Honda Motor Co., Ltd.
- Yuki Furukawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating Apparatus
- Publication number 20200318250
- Publication date Oct 8, 2020
- NIPPON STEEL CORPORATION
- Masanari Kimoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS FOR ELECTRO-FORMING AND APPARATUS FOR HORIZONTAL ELECTRO-...
- Publication number 20200208288
- Publication date Jul 2, 2020
- LG Display Co., Ltd.
- ByeongSun Yoo
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
ELECTROFORMING APPARATUS AND METHOD FOR FORMING A RIB
- Publication number 20200190681
- Publication date Jun 18, 2020
- UNISON INDUSTRIES, LLC
- Gordon Tajiri
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DEVICE FOR VERTICAL GALVANIC METAL DEPOSITION ON A SUBSTRATE
- Publication number 20190292679
- Publication date Sep 26, 2019
- Atotech Deutschland GmbH
- Ray WEINHOLD
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MASSIVELY-PARALLEL MICRONOZZLE ARRAY FOR DIRECT WRITE ELECTRODEPOSI...
- Publication number 20190203370
- Publication date Jul 4, 2019
- Intel Corporation
- Joe Walczyk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electroplating Apparatus
- Publication number 20190078225
- Publication date Mar 14, 2019
- NIPPON STEEL & SUMITOMO METAL CORPORATION
- Masanari Kimoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS AND METHODS UTILIZING INDEPENDENT CONTROL...
- Publication number 20180258546
- Publication date Sep 13, 2018
- LAM RESEARCH CORPORATION
- Gabriel Hay Graham
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEM AND METHOD FOR LOCAL SURFACE TREATMENT
- Publication number 20180195191
- Publication date Jul 12, 2018
- STELIA AEROSPACE
- Bertrand RIVES
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
3D PRINTING APPARATUS USING SELECTIVE ELECTROCHEMICAL DEPOSITION
- Publication number 20180178461
- Publication date Jun 28, 2018
- ANYCASTING CO., LTD.
- Sungbin KIM
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Wet Surface Treatment Apparatus
- Publication number 20180087170
- Publication date Mar 29, 2018
- HITACHI, LTD.
- Toshinori KAWAMURA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PHOTOVOLTAIC CELL WITH POROUS SEMICONDUCTOR REGIONS FOR ANCHORING C...
- Publication number 20180012782
- Publication date Jan 11, 2018
- Rise Technology S.R.L.
- Marco Balucani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for Surface Electrolytic Treatment of Garment Accessory Part...
- Publication number 20170321341
- Publication date Nov 9, 2017
- Kenji Hasegawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS FOR ELECTROCHEMICAL ETCHING AND APPARATUS FOR ELECTROPLATING
- Publication number 20170121842
- Publication date May 4, 2017
- Industrial Technology Research Institute
- Teng-Yu Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS FOR STEEL PIPES
- Publication number 20160298251
- Publication date Oct 13, 2016
- NIPPON STEEL & SUMITOMO METAL CORPORATION
- Masanari KIMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEM AND METHOD FOR ELECTROPLATING OF HOLE SURFACES
- Publication number 20160174389
- Publication date Jun 16, 2016
- TELEDYNE INSTRUMENTS, INC.
- John Bradley Hunter
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150303105
- Publication date Oct 22, 2015
- Tokyo Electron Limited
- Haruo IWATSU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
BIPOLAR ELECTROCHEMICAL PRINTING
- Publication number 20150267311
- Publication date Sep 24, 2015
- University of Washington
- Trevor Braun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplated Metallic Conductors
- Publication number 20150233005
- Publication date Aug 20, 2015
- Uri Cohen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEM AND METHOD FOR ELECTROPLATING OF HOLE SURFACES
- Publication number 20150191844
- Publication date Jul 9, 2015
- TELEDYNE INSTRUMENTS, INC.
- John Bradley Hunter
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLUG GAUGE WITH MAINTENANCE LINE AND ROUND POINT AND METHOD OF MANU...
- Publication number 20140299042
- Publication date Oct 9, 2014
- Niigata Seiki Co., Ltd.
- Toshiyuki IGARASHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METAL PLATING METHOD AND APPARATUS
- Publication number 20140231247
- Publication date Aug 21, 2014
- Pratt & Whitney Canada Corp.
- JEROME JAMES
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Void-Free Metallic Filled High Aspect Ratio Openings
- Publication number 20140197537
- Publication date Jul 17, 2014
- Uri Cohen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING METHOD
- Publication number 20140120245
- Publication date May 1, 2014
- C. Uyemura & Co., Ltd.
- Toshihisa Isono
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ENHANCED ELECTROCHEMICAL DEPOSITION FILLING
- Publication number 20140103538
- Publication date Apr 17, 2014
- Uri Cohen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

using locally applied jets of electrolyte

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Making multi-component structures using dynamic menisci

Massively-parallel micronozzle array for direct write electrodeposi...

Electrochemical three-dimensional printing and soldering

Apparatus for electro-forming and apparatus for horizontal electro-...

Surface treatment device

Electroplating apparatus

Electrochemical three-dimensional printing and soldering

Electroplating apparatus

Device for vertical galvanic metal deposition on a substrate

Method for surface electrolytic treatment of garment accessory part...

Photovoltaic cell with porous semiconductor regions for anchoring c...

Electroplating apparatus for steel pipes

Metal plating method and apparatus

Manufacturing a hardened formed part

Localized, in-vacuum modification of small structures

Plating method

Bipolar electrochemical printing

High speed electroplating metallic conductors

Plug gauge with maintenance line and round point and method of manu...

System and method for electroplating of hole surfaces

Electroplated metallic conductors

Metal plating method and apparatus

Systems and methods for in situ annealing of electro- and electrole...

Electroplating head and method for operating the same

Apparatus for enhanced electrochemical deposition

Apparatus and method for depositing and planarizing thin films of s...

Method for filling through hole

Electrochemical deposition method utilizing microdroplets of solution

Electrochemical micromanufacturing system and method

Electroplating head and method for operating the same

Patents Applicationslast 30 patents

ELECTROCHEMICAL ASSEMBLY FOR FORMING SEMICONDUCTOR FEATURES

SHIELD BODY SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTROL...

ELECTROCHEMICAL THREE-DIMENSIONAL PRINTING AND SOLDERING

SURFACE TREATMENT DEVICE

MAKING MULTI-COMPONENT STRUCTURES USING DYNAMIC MENISCI

SURFACE TREATMENT DEVICE

Electroplating Apparatus

APPARATUS FOR ELECTRO-FORMING AND APPARATUS FOR HORIZONTAL ELECTRO-...

ELECTROFORMING APPARATUS AND METHOD FOR FORMING A RIB

DEVICE FOR VERTICAL GALVANIC METAL DEPOSITION ON A SUBSTRATE

MASSIVELY-PARALLEL MICRONOZZLE ARRAY FOR DIRECT WRITE ELECTRODEPOSI...

Electroplating Apparatus

ELECTROPLATING APPARATUS AND METHODS UTILIZING INDEPENDENT CONTROL...

SYSTEM AND METHOD FOR LOCAL SURFACE TREATMENT

3D PRINTING APPARATUS USING SELECTIVE ELECTROCHEMICAL DEPOSITION

Wet Surface Treatment Apparatus

PHOTOVOLTAIC CELL WITH POROUS SEMICONDUCTOR REGIONS FOR ANCHORING C...

Method for Surface Electrolytic Treatment of Garment Accessory Part...

APPARATUS FOR ELECTROCHEMICAL ETCHING AND APPARATUS FOR ELECTROPLATING

ELECTROPLATING APPARATUS FOR STEEL PIPES

SYSTEM AND METHOD FOR ELECTROPLATING OF HOLE SURFACES

METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE

BIPOLAR ELECTROCHEMICAL PRINTING

Electroplated Metallic Conductors

SYSTEM AND METHOD FOR ELECTROPLATING OF HOLE SURFACES

PLUG GAUGE WITH MAINTENANCE LINE AND ROUND POINT AND METHOD OF MANU...

METAL PLATING METHOD AND APPARATUS

Void-Free Metallic Filled High Aspect Ratio Openings

PLATING METHOD

ENHANCED ELECTROCHEMICAL DEPOSITION FILLING