using marks formed on the semiconductor or solid-state body

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H01L2224/8513

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8513using marks formed on the semiconductor or solid-state body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices including recognition marks
- Patent number 12,278,193
- Issue date Apr 15, 2025
- SK hynix Inc.
- Hyun Chul Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for linearly moving movable body relative to o...
- Patent number 11,410,866
- Issue date Aug 9, 2022
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond clamp design and lead frame capable of engaging with same
- Patent number 10,861,777
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fiducial mark for chip bonding
- Patent number 10,438,897
- Issue date Oct 8, 2019
- 3M Innovative Properties Company
- Siang Sin Foo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,403,616
- Issue date Sep 3, 2019
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing wire bonding structure, wire bonding struc...
- Patent number 10,115,699
- Issue date Oct 30, 2018
- Rohm Co., Ltd.
- Kazuya Ikoma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,050,011
- Issue date Aug 14, 2018
- Renesas Electronics Corporation
- Kenya Hironaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing a semiconductor devic...
- Patent number 9,991,242
- Issue date Jun 5, 2018
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 9,837,340
- Issue date Dec 5, 2017
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a substrate strip with wiring
- Patent number 9,380,706
- Issue date Jun 28, 2016
- Unimicron Technology Corp.
- Tsung-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,257,408
- Issue date Feb 9, 2016
- Mitsubishi Electric Corporation
- Takayuki Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of chip positioning for multi-chip packaging
- Patent number 9,196,608
- Issue date Nov 24, 2015
- Cypress Semiconductor Corporation
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Brace for long wire bond
- Patent number 8,692,134
- Issue date Apr 8, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jie Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling at least one chip with a wire element, electr...
- Patent number 8,654,540
- Issue date Feb 18, 2014
- Commisariat A l'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-chip package and method of manufacturing thereof
- Patent number 8,362,624
- Issue date Jan 29, 2013
- Samsung Electronics Co., Ltd.
- Tae-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,169,087
- Issue date May 1, 2012
- Toyota Jidosha Kabushiki Kaisha
- Masaru Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit package having electrically discon...
- Patent number 7,851,907
- Issue date Dec 14, 2010
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit package having electrically discon...
- Patent number 7,468,559
- Issue date Dec 23, 2008
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit package having electrically discon...
- Patent number 7,342,319
- Issue date Mar 11, 2008
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding program
- Patent number 7,330,582
- Issue date Feb 12, 2008
- Kabushiki Kaisha Shinkawa
- Satoshi Enokido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding pattern discrimination device
- Patent number 7,324,683
- Issue date Jan 29, 2008
- Kabushiki Kaisha Shinkawa
- Satoshi Enokido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus
- Patent number 7,324,684
- Issue date Jan 29, 2008
- Kabushiki Kaisha Shinkawa
- Satoshi Enokido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding pattern discrimination program
- Patent number 7,321,681
- Issue date Jan 22, 2008
- Kabushiki Kaisha Shinkawa
- Satoshi Enokido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor integrated circuit package having electrically discon...
- Patent number 7,276,802
- Issue date Oct 2, 2007
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit package having electrically discon...
- Patent number 7,268,067
- Issue date Sep 11, 2007
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pattern discrimination method, bonding pattern discriminati...
- Patent number 7,224,829
- Issue date May 29, 2007
- Kabushiki Kaisha Shinkawa
- Satoshi Enokido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method, bonding apparatus and bonding program
- Patent number 7,209,583
- Issue date Apr 24, 2007
- Kabushiki Kaisha Shinkawa
- Satoshi Enokido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi chip package structure having a plurality of semiconductor ch...
- Patent number 6,972,487
- Issue date Dec 6, 2005
- Fujitsu Limited
- Yoshiharu Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus
- Patent number 6,814,121
- Issue date Nov 9, 2004
- Kabushiki Kaisha Shinkawa
- Shigeru Hayata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Offset measurement method, tool position detection method and bondi...
- Patent number 6,762,848
- Issue date Jul 13, 2004
- Kabushiki Kaisha Shinkawa
- Shigeru Hayata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS
- Publication number 20250210539
- Publication date Jun 26, 2025
- SK HYNIX INC.
- Hyun Chul SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bonding Method and Apparatus
- Publication number 20250096195
- Publication date Mar 20, 2025
- INFINEON TECHNOLOGIES AG
- Stefan Tophinke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR P...
- Publication number 20240038720
- Publication date Feb 1, 2024
- SK HYNIX INC.
- Su Ji UM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS MANUFACTURING M...
- Publication number 20230069967
- Publication date Mar 9, 2023
- Fuji Electric Co., Ltd.
- Nobuhiro HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS
- Publication number 20220415821
- Publication date Dec 29, 2022
- SK HYNIX INC.
- Hyun Chul SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR LINEARLY MOVING MOVABLE BODY RELATIVE TO OBJECT
- Publication number 20200411352
- Publication date Dec 31, 2020
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20180254267
- Publication date Sep 6, 2018
- Fuji Electric Co., Ltd.
- Kenichiro SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170162539
- Publication date Jun 8, 2017
- RENESAS ELECTRONICS CORPORATION
- Kenya HIRONAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRE BONDING STRUCTURE, WIRE BONDING STRUC...
- Publication number 20170062381
- Publication date Mar 2, 2017
- Kazuya IKOMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150262962
- Publication date Sep 17, 2015
- Mitsubishi Electric Corporation
- Takayuki Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVIC...
- Publication number 20150255444
- Publication date Sep 10, 2015
- Fuji Electric Co., Ltd.
- Kenichiro SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP POSITIONING IN MULTI-CHIP PACKAGE
- Publication number 20150056726
- Publication date Feb 26, 2015
- SPANSION LLC
- Sally FOONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Positioning in Multi-Chip Package
- Publication number 20140175613
- Publication date Jun 26, 2014
- SPANSION LLC
- Sally FOONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRACE FOR LONG WIRE BOND
- Publication number 20120145446
- Publication date Jun 14, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jie YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20120139125
- Publication date Jun 7, 2012
- Tae-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON...
- Publication number 20120024089
- Publication date Feb 2, 2012
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jeremiah Couey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRIP WITH WIRING AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110303442
- Publication date Dec 15, 2011
- Unimicron Technology Corp.
- Tsung-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Led lead frame structure
- Publication number 20110199749
- Publication date Aug 18, 2011
- Forward Electronics Co., Ltd.
- Pei-Hsuan Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ASSEMBLING AT LEAST ONE CHIP WITH A WIRE ELEMENT, ELECTR...
- Publication number 20110149540
- Publication date Jun 23, 2011
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean BRUN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100276817
- Publication date Nov 4, 2010
- Toyota Jidosha Kabushiki Kaisha
- Masaru Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit, Semiconductor Module and Method for Manufacturi...
- Publication number 20090189292
- Publication date Jul 30, 2009
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for wire bond integrity check on BGA substrate...
- Publication number 20090001573
- Publication date Jan 1, 2009
- Phontara Jirawongsapiwat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE HAVING ELECTRICALLY DISCON...
- Publication number 20080142950
- Publication date Jun 19, 2008
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding program
- Publication number 20070041632
- Publication date Feb 22, 2007
- KABUSHIKI KAISHA SHINKAWA
- Satoshi Enokido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding pattern discrimination program
- Publication number 20070036423
- Publication date Feb 15, 2007
- KABUSHIKI KAISHA SHINKAWA
- Satoshi Enokido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding apparatus
- Publication number 20070036425
- Publication date Feb 15, 2007
- KABUSHIKI KAISHA SHINKAWA
- Satoshi Enokido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding pattern discrimination device
- Publication number 20070036424
- Publication date Feb 15, 2007
- KABUSHIKI KAISHA SHINKAWA
- Satoshi Enokido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE HAVING ELECTRICALLY DISCON...
- Publication number 20060237845
- Publication date Oct 26, 2006
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE HAVING ELECTRICALLY DISCON...
- Publication number 20060237844
- Publication date Oct 26, 2006
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method for manufacturing the semiconductor de...
- Publication number 20060226529
- Publication date Oct 12, 2006
- FUJITSU LIMITED
- Yoshiharu Kato
- H01 - BASIC ELECTRIC ELEMENTS

using marks formed on the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices including recognition marks

Apparatus and method for linearly moving movable body relative to o...

Wire bond clamp design and lead frame capable of engaging with same

Fiducial mark for chip bonding

Method of manufacturing a semiconductor device

Method for manufacturing wire bonding structure, wire bonding struc...

Method of manufacturing semiconductor device

Semiconductor device, method of manufacturing a semiconductor devic...

Apparatus, system, and method for wireless connection in integrated...

Method of manufacturing a substrate strip with wiring

Semiconductor device and method of manufacturing the same

Method of chip positioning for multi-chip packaging

Brace for long wire bond

Method for assembling at least one chip with a wire element, electr...

Multi-chip package and method of manufacturing thereof

Semiconductor device

Semiconductor integrated circuit package having electrically discon...

Semiconductor integrated circuit package having electrically discon...

Semiconductor integrated circuit package having electrically discon...

Bonding program

Bonding pattern discrimination device

Bonding apparatus

Bonding pattern discrimination program

Semiconductor integrated circuit package having electrically discon...

Semiconductor integrated circuit package having electrically discon...

Bonding pattern discrimination method, bonding pattern discriminati...

Bonding method, bonding apparatus and bonding program

Multi chip package structure having a plurality of semiconductor ch...

Bonding apparatus

Offset measurement method, tool position detection method and bondi...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS

Wire Bonding Method and Apparatus

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR P...

SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS MANUFACTURING M...

SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS

DEVICE AND METHOD FOR LINEARLY MOVING MOVABLE BODY RELATIVE TO OBJECT

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING WIRE BONDING STRUCTURE, WIRE BONDING STRUC...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVIC...

CHIP POSITIONING IN MULTI-CHIP PACKAGE

Chip Positioning in Multi-Chip Package

BRACE FOR LONG WIRE BOND

MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THEREOF

METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON...

SUBSTRATE STRIP WITH WIRING AND METHOD OF MANUFACTURING THE SAME

Led lead frame structure

METHOD FOR ASSEMBLING AT LEAST ONE CHIP WITH A WIRE ELEMENT, ELECTR...

SEMICONDUCTOR DEVICE

Integrated Circuit, Semiconductor Module and Method for Manufacturi...

Structure and method for wire bond integrity check on BGA substrate...

SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE HAVING ELECTRICALLY DISCON...

Bonding program

Bonding pattern discrimination program

Bonding apparatus

Bonding pattern discrimination device

SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE HAVING ELECTRICALLY DISCON...

SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE HAVING ELECTRICALLY DISCON...

Semiconductor device, method for manufacturing the semiconductor de...