using marks formed on the semiconductor or solid-state body

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H01L2224/8113

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8113using marks formed on the semiconductor or solid-state body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Window assemblies, imaging system including the same, method of man...
- Patent number 12,270,987
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Duhyun Lee
- G02 - OPTICS
Information Patent Grant
Semiconductor device having through parts of different shapes
- Patent number 12,230,600
- Issue date Feb 18, 2025
- Fuji Electric Co., Ltd.
- Narumi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 12,142,603
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillars as stops for precise chip-to-chip separation
- Patent number 12,142,590
- Issue date Nov 12, 2024
- Google LLC
- Erik Anthony Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,074,121
- Issue date Aug 27, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 12,074,106
- Issue date Aug 27, 2024
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip fabrication method and product including raised and recessed a...
- Patent number 12,074,114
- Issue date Aug 27, 2024
- IQM Finland Oy
- Máté Jenei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and method of mounting integrated circuit using the...
- Patent number 11,967,597
- Issue date Apr 23, 2024
- Samsung Display Co., Ltd.
- Dae Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device interconnection systems and methods
- Patent number 11,916,039
- Issue date Feb 27, 2024
- Teledyne FLIR Commercial Systems, Inc.
- Richard E. Bornfreund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid felts of electrospun nanofibers
- Patent number RE49773
- Issue date Jan 2, 2024
- NANOPAREIL, LLC
- Todd J. Menkhaus
Information Patent Grant
Pillars as stops for precise chip-to-chip separation
- Patent number 11,842,973
- Issue date Dec 12, 2023
- Google LLC
- Erik Anthony Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,749,667
- Issue date Sep 5, 2023
- Kioxia Corporation
- Toshihiko Ohda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 11,735,575
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aligned core balls for interconnect joint stability
- Patent number 11,735,551
- Issue date Aug 22, 2023
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 11,699,651
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 11,626,372
- Issue date Apr 11, 2023
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip transfer method, display device, chip and target substrate
- Patent number 11,616,043
- Issue date Mar 28, 2023
- BOE Technology Group Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder member mounting system
- Patent number 11,583,948
- Issue date Feb 21, 2023
- Samsung Electronics Co., Ltd.
- Soo-Hwan Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting system
- Patent number 11,587,804
- Issue date Feb 21, 2023
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillars as stops for precise chip-to-chip separation
- Patent number 11,574,885
- Issue date Feb 7, 2023
- Google LLC
- Erik Anthony Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,569,190
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic-assisted solder transfer
- Patent number 11,541,472
- Issue date Jan 3, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 11,488,882
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit (3DIC) with support structures
- Patent number 11,424,194
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for processing semiconductor devices
- Patent number 11,355,471
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding tools for bonding machines, bonding machines for bonding se...
- Patent number 11,342,301
- Issue date May 24, 2022
- Kulicke and Soffa Industries, Inc.
- Ai Jun Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...
- Publication number 20250157982
- Publication date May 15, 2025
- STMicroelectronics International N.V.
- Guendalina CATALANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP DIE BACK-SIDE MARKING FOR MEMORY SYSTEMS
- Publication number 20250149463
- Publication date May 8, 2025
- Micron Technology, Inc.
- Po Chien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEMS, AND METHODS OF BONDING A SEMICONDUCTOR ELEMENT TO...
- Publication number 20250112201
- Publication date Apr 3, 2025
- KULICKE AND SOFFA INDUSTRIES, INC.
- Andreas Marte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20250096192
- Publication date Mar 20, 2025
- Kore Semiconductor Co., Ltd.
- Ghang-Chun LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES
- Publication number 20250079376
- Publication date Mar 6, 2025
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20250070056
- Publication date Feb 27, 2025
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...
- Publication number 20240395767
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR POSITIONING SEMICONDUCTOR DEVICES AND CORRESPONDING POSI...
- Publication number 20240329125
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Moise AVOCI UGWIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240312940
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Wei TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DE...
- Publication number 20240243094
- Publication date Jul 18, 2024
- Canon Kabushiki Kaisha
- MASAHIRO KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...
- Publication number 20240234443
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- Dae Geun LEE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Adaptive Flip Chip Bonding for Semiconductor Packages
- Publication number 20240213035
- Publication date Jun 27, 2024
- INFINEON TECHNOLOGIES AG
- Chew Yeek Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD
- Publication number 20240194636
- Publication date Jun 13, 2024
- Canon Kabushiki Kaisha
- KENICHIRO MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION
- Publication number 20240162179
- Publication date May 16, 2024
- Google LLC
- Erik Anthony Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...
- Publication number 20240153908
- Publication date May 9, 2024
- HKC Corporation Limited
- YANG PU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP FABRICATION METHOD AND PRODUCT
- Publication number 20240071944
- Publication date Feb 29, 2024
- IQM Finland Oy
- Máté JENEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF PRODUCING THE SAME, AND ELECTRONIC...
- Publication number 20230343803
- Publication date Oct 26, 2023
- Sony Semiconductor Solutions Corporation
- Toshiaki IWAFUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20230299067
- Publication date Sep 21, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS R...
- Publication number 20230282607
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Ting Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20230223361
- Publication date Jul 13, 2023
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
- Publication number 20230197536
- Publication date Jun 22, 2023
- AUO Corporation
- Chung-Chan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION
- Publication number 20230187401
- Publication date Jun 15, 2023
- Google LLC
- Erik Anthony Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WINDOW ASSEMBLIES, IMAGING SYSTEM INCLUDING THE SAME, METHOD OF MAN...
- Publication number 20230111183
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Duhyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER CREEP LIMITING RIGID SPACER FOR STACKED DIE C4 PACKAGING
- Publication number 20230058638
- Publication date Feb 23, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230049315
- Publication date Feb 16, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jin Woo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF
- Publication number 20230053037
- Publication date Feb 16, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jin Woo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR ARRANGEMENT
- Publication number 20230005877
- Publication date Jan 5, 2023
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20220384412
- Publication date Dec 1, 2022
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF DISPLAY DEVICE AND HOLDING SUBSTRATE
- Publication number 20220375895
- Publication date Nov 24, 2022
- Japan Display Inc.
- Keisuke Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20220302079
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS

using marks formed on the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Window assemblies, imaging system including the same, method of man...

Semiconductor device having through parts of different shapes

Metal-free frame design for silicon bridges for semiconductor packages

Semiconductor device assembly with die support structures

Bonding of bridge to multiple semiconductor chips

Tools and systems for processing semiconductor devices, and methods...

Pillars as stops for precise chip-to-chip separation

Metal-free frame design for silicon bridges for semiconductor packages

Fan-out interconnect integration processes and structures

Chip fabrication method and product including raised and recessed a...

Array substrate and method of mounting integrated circuit using the...

Semiconductor device interconnection systems and methods

Hybrid felts of electrospun nanofibers

Pillars as stops for precise chip-to-chip separation

Circuit board structure and method for manufacturing a circuit boar...

Semiconductor manufacturing apparatus

Bonding of bridge to multiple semiconductor chips

Aligned core balls for interconnect joint stability

Fan-out interconnect integration processes and structures

Metal-free frame design for silicon bridges for semiconductor packages

Chip transfer method, display device, chip and target substrate

Solder member mounting system

Component mounting system

Pillars as stops for precise chip-to-chip separation

Semiconductor structure and manufacturing method thereof

Ultrasonic-assisted solder transfer

Die-on-interposer assembly with dam structure and method of manufac...

Three dimensional integrated circuit (3DIC) with support structures

System for processing semiconductor devices

Bonding tools for bonding machines, bonding machines for bonding se...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...

TOP DIE BACK-SIDE MARKING FOR MEMORY SYSTEMS

BONDING SYSTEMS, AND METHODS OF BONDING A SEMICONDUCTOR ELEMENT TO...

PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...

METHOD FOR POSITIONING SEMICONDUCTOR DEVICES AND CORRESPONDING POSI...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DE...

ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...

Adaptive Flip Chip Bonding for Semiconductor Packages

BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD

PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION

DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...

CHIP FABRICATION METHOD AND PRODUCT

SEMICONDUCTOR DEVICE, METHOD OF PRODUCING THE SAME, AND ELECTRONIC...

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS R...

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION

WINDOW ASSEMBLIES, IMAGING SYSTEM INCLUDING THE SAME, METHOD OF MAN...

SOLDER CREEP LIMITING RIGID SPACER FOR STACKED DIE C4 PACKAGING

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF

METHOD FOR MANUFACTURING A SEMICONDUCTOR ARRANGEMENT

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

MANUFACTURING METHOD OF DISPLAY DEVICE AND HOLDING SUBSTRATE

Tools and Systems for Processing Semiconductor Devices, and Methods...