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H01L21/31144

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/31144using masks

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of removing step height on gate structure
- Patent number 12,211,699
- Issue date Jan 28, 2025
- United Microelectronics Corp.
- Yeh-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 12,211,692
- Issue date Jan 28, 2025
- Tokyo Electron Limited
- Noriaki Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective removal of an etching stop layer for improving overlay sh...
- Patent number 12,211,700
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for semiconductor devices
- Patent number 12,205,816
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning material including silicon-containing layer and method f...
- Patent number 12,205,824
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preparing semiconductor structure having low dielectric c...
- Patent number 12,205,825
- Issue date Jan 21, 2025
- NANYA TECHNOLOGY CORPORATION
- Yu-Kai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanostructure and manufacturing method thereof
- Patent number 12,205,822
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Cheng Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion implantation method for reducing roughness of patterned resist...
- Patent number 12,198,931
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoresist and method
- Patent number 12,197,128
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Liang-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate line plug structures for advanced integrated circuit structure...
- Patent number 12,199,167
- Issue date Jan 14, 2025
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structure
- Patent number 12,198,985
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Wenhui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,198,930
- Issue date Jan 14, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Libin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plugs for interconnect lines for advanced integrated circuit struct...
- Patent number 12,199,168
- Issue date Jan 14, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a wiring and method of manufacturing a semiconduc...
- Patent number 12,193,210
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Hyunchul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch method for opening a source line in flash memory
- Patent number 12,193,227
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yong-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,191,158
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon beam plasma enhanced chemical vapor deposition system for an...
- Patent number 12,191,156
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- John Hautala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching method using perfluoroisopropyl vinyl ether
- Patent number 12,191,141
- Issue date Jan 7, 2025
- Ajou University Industry-Academic Cooperation Foundation
- Chang-Koo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal hard masks for reducing line bending
- Patent number 12,183,577
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming and patterning a layer and/or substrate
- Patent number 12,183,578
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- Takehito Koshizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device structure with isolation...
- Patent number 12,183,587
- Issue date Dec 31, 2024
- NANYA TECHNOLOGY CORPORATION
- Ching-Cheng Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming capacitor via
- Patent number 12,183,776
- Issue date Dec 31, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chunyang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,183,580
- Issue date Dec 31, 2024
- SK Hynix Inc.
- Ji Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,183,586
- Issue date Dec 31, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jun Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bevel etching method
- Patent number 12,176,218
- Issue date Dec 24, 2024
- NANYA TECHNOLOGY CORPORATION
- Sheng-Hui Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide composite as etch stop layer
- Patent number 12,176,247
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of three-dimensional structures using grey-scale photolit...
- Patent number 12,174,548
- Issue date Dec 24, 2024
- ams AG
- Gerhard Eilmsteiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating semiconductor structures
- Patent number 12,170,205
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad fabrication process for a semiconductor product
- Patent number 12,170,256
- Issue date Dec 17, 2024
- Texas Instruments Incorporated
- Sudtida Lavangkul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective passivation and selective deposition
- Patent number 12,170,197
- Issue date Dec 17, 2024
- ASM IP Holding B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL-RESISTANT PROTECTIVE FILM-FORMING COMPOSITION HAVING CATEC...
- Publication number 20250034427
- Publication date Jan 30, 2025
- NISSAN CHEMICAL CORPORATION
- Shun KUBODERA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING SAME
- Publication number 20250040224
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250031375
- Publication date Jan 23, 2025
- SK HYNIX INC.
- Sung-Lae OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE STRUCTURE FOR MEMORY DEVICE
- Publication number 20250031366
- Publication date Jan 23, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250024679
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yali SONG
- G11 - INFORMATION STORAGE
Information Patent Application
GAS CLUSTER ASSISTED PLASMA PROCESSING
- Publication number 20250022689
- Publication date Jan 16, 2025
- TOKYO ELECTRON LIMITED
- Peter Ventzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTORESIST COMPOSITIONS AND METHODS OF MANUFACTURING INTEGRATED CI...
- Publication number 20250020998
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Kyungoh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20250022716
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Eun Jung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20250022939
- Publication date Jan 16, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PREVENTING PATTERN COLLAPSE
- Publication number 20250013153
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- Lior HULI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHODS AND SYSTEMS FOR TOPOGRAPHY-SELECTIVE DEPOSITIONS
- Publication number 20250014908
- Publication date Jan 9, 2025
- ASM IP HOLDING, B.V.
- Timothee Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE WITH FEATURES A...
- Publication number 20250014900
- Publication date Jan 9, 2025
- NANYA TECHNOLOGY CORPORATION
- CHIH-TSUNG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20250015010
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wang Kuo LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composition For Forming Organic Film, Method For Forming Organic Fi...
- Publication number 20250011623
- Publication date Jan 9, 2025
- Shin-Etsu Chemical Co., Ltd.
- Daisuke KORI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND REWORKING PROCESS
- Publication number 20250014910
- Publication date Jan 9, 2025
- NANYA TECHNOLOGY CORPORATION
- WEI-CHEN PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING UPPER PART OF SACRIFICIAL LAYER, AND SACRIFICIA...
- Publication number 20250014899
- Publication date Jan 9, 2025
- Merck Patent GmbH
- Takashi SEKITO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SELECTIVE ETCH USING FLUOROCARBON-BASED DEPOSITION OF A METALLOID O...
- Publication number 20250014909
- Publication date Jan 9, 2025
- LAM RESEARCH CORPORATION
- Eric HUDSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOALIGNMENT OF SEMICONDUCTOR STRUCTURES USING AN OPAQUE HARDMASK
- Publication number 20250006655
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Shruthi Kumara Vadivel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250006504
- Publication date Jan 2, 2025
- TOKYO ELECTRON LIMITED
- Jason MARION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CONTACT INTEGRATION IN GALLIUM NITRIDE DEVICES
- Publication number 20250006593
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Dong Seup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING METHODS, SEMICONDUCTOR STRUCTURES AND MEMORY
- Publication number 20250006494
- Publication date Jan 2, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zijin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING DEVICES WITH DIFFERENT CHANNEL LE...
- Publication number 20250006505
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Hsiang HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING CRITICAL DIMENSION OF PATTERNS GENERATED USING...
- Publication number 20240429053
- Publication date Dec 26, 2024
- Silicon Laboratories Inc.
- Jiye Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING TERMINATED PO...
- Publication number 20240427246
- Publication date Dec 26, 2024
- NISSAN CHEMICAL CORPORATION
- Tomotada HIROHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPRINT METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240427234
- Publication date Dec 26, 2024
- KIOXIA Corporation
- Kazuya FUKUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIST UNDERLAYER FILM-FORMING COMPOSITION
- Publication number 20240427238
- Publication date Dec 26, 2024
- NISSAN CHEMICAL CORPORATION
- Tetsuya KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240429052
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Sangjun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PATTERNS WITH DIFFERENT CRITICAL DIMENSIONS
- Publication number 20240429054
- Publication date Dec 26, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Patricia PIMENTA BARROS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITION IN HIGH ASPECT RATIO (HAR) FEATURES
- Publication number 20240420965
- Publication date Dec 19, 2024
- TOKYO ELECTRON LIMITED
- Shihsheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICALLY SELECTIVE ADHESION AND STRENGTH PROMOTERS IN SEMICONDUCT...
- Publication number 20240419079
- Publication date Dec 19, 2024
- Geminatio, Inc.
- Brennan Peterson
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

using masks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of removing step height on gate structure

Wafer processing method

Selective removal of an etching stop layer for improving overlay sh...

Interconnect structure for semiconductor devices

Patterning material including silicon-containing layer and method f...

Method of preparing semiconductor structure having low dielectric c...

Nanostructure and manufacturing method thereof

Ion implantation method for reducing roughness of patterned resist...

Photoresist and method

Gate line plug structures for advanced integrated circuit structure...

Contact over active gate structure

Method for manufacturing semiconductor device

Plugs for interconnect lines for advanced integrated circuit struct...

Method of forming a wiring and method of manufacturing a semiconduc...

Etch method for opening a source line in flash memory

Semiconductor device and method

Ribbon beam plasma enhanced chemical vapor deposition system for an...

Plasma etching method using perfluoroisopropyl vinyl ether

Metal hard masks for reducing line bending

Method for forming and patterning a layer and/or substrate

Method for preparing semiconductor device structure with isolation...

Method for forming capacitor via

Method of manufacturing a semiconductor device

Method for forming semiconductor structure

Bevel etching method

Metal oxide composite as etch stop layer

Formation of three-dimensional structures using grey-scale photolit...

Methods for fabricating semiconductor structures

Contact pad fabrication process for a semiconductor product

Selective passivation and selective deposition

Patents Applicationslast 30 patents

CHEMICAL-RESISTANT PROTECTIVE FILM-FORMING COMPOSITION HAVING CATEC...

INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING SAME

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

STAIRCASE STRUCTURE FOR MEMORY DEVICE

3D NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME

GAS CLUSTER ASSISTED PLASMA PROCESSING

PHOTORESIST COMPOSITIONS AND METHODS OF MANUFACTURING INTEGRATED CI...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...

METHOD OF PREVENTING PATTERN COLLAPSE

METHODS AND SYSTEMS FOR TOPOGRAPHY-SELECTIVE DEPOSITIONS

METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE WITH FEATURES A...

SEMICONDUCTOR STRUCTURE AND FABRICATING METHOD THEREOF

Composition For Forming Organic Film, Method For Forming Organic Fi...

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND REWORKING PROCESS

METHOD FOR REMOVING UPPER PART OF SACRIFICIAL LAYER, AND SACRIFICIA...

SELECTIVE ETCH USING FLUOROCARBON-BASED DEPOSITION OF A METALLOID O...

PHOTOALIGNMENT OF SEMICONDUCTOR STRUCTURES USING AN OPAQUE HARDMASK

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME

SUBSTRATE CONTACT INTEGRATION IN GALLIUM NITRIDE DEVICES

PATTERNING METHODS, SEMICONDUCTOR STRUCTURES AND MEMORY

SEMICONDUCTOR STRUCTURE INCLUDING DEVICES WITH DIFFERENT CHANNEL LE...

METHOD FOR REDUCING CRITICAL DIMENSION OF PATTERNS GENERATED USING...

RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING TERMINATED PO...

IMPRINT METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

RESIST UNDERLAYER FILM-FORMING COMPOSITION

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR FORMING PATTERNS WITH DIFFERENT CRITICAL DIMENSIONS

METHOD OF DEPOSITION IN HIGH ASPECT RATIO (HAR) FEATURES

CHEMICALLY SELECTIVE ADHESION AND STRENGTH PROMOTERS IN SEMICONDUCT...