using masks

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H01L21/32139

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/32139using masks

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of preparing semiconductor structure having low dielectric c...
- Patent number 12,205,825
- Issue date Jan 21, 2025
- NANYA TECHNOLOGY CORPORATION
- Yu-Kai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing fusible structures
- Patent number 12,205,891
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Ting Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact via formation
- Patent number 12,205,896
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Lin-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a gate electrode with a top peripheral...
- Patent number 12,204,232
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Shu Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for forming semiconductor device
- Patent number 12,189,284
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure including complemen...
- Patent number 12,183,585
- Issue date Dec 31, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kui Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin oxide mandrels in patterning
- Patent number 12,183,589
- Issue date Dec 31, 2024
- Lam Research Corporation
- Jengyi Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal oxide composite as etch stop layer
- Patent number 12,176,247
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor profile to decrease substrate warpage
- Patent number 12,176,387
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for forming silicon-containing resist underlayer film a...
- Patent number 12,174,541
- Issue date Dec 24, 2024
- Shin-Etsu Chemical Co., Ltd.
- Tsutomu Ogihara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor mask reshaping using a sacrificial layer
- Patent number 12,165,878
- Issue date Dec 10, 2024
- Lam Research Corporation
- Zhongkui Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor-on-insulator (SOI) substrate
- Patent number 12,165,911
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and a manufacturing method thereof
- Patent number 12,166,133
- Issue date Dec 10, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Qiang Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a gate terminal of a HEMT device, and HEMT...
- Patent number 12,165,871
- Issue date Dec 10, 2024
- STMicroelectronics S.r.l.
- Ferdinando Iucolano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure and semiconductor...
- Patent number 12,165,879
- Issue date Dec 10, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xinman Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for etching a material layer for semiconductor applications
- Patent number 12,165,877
- Issue date Dec 10, 2024
- Applied Materials, Inc.
- Zhigang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching method
- Patent number 12,154,792
- Issue date Nov 26, 2024
- Tokyo Electron Limited
- Takayuki Katsunuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,154,957
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tuning threshold voltage through meta stable plasma treatment
- Patent number 12,148,620
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Jyun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor memory structure
- Patent number 12,148,627
- Issue date Nov 19, 2024
- Winbond Electronics Corp.
- Hsin-Hung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming multi-layer vertical NOR-type memory string arrays
- Patent number 12,150,304
- Issue date Nov 19, 2024
- SUNRISE MEMORY CORPORATION
- Scott Brad Herner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method to pattern pitch lines
- Patent number 12,148,617
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor layout and a semiconductor st...
- Patent number 12,147,156
- Issue date Nov 19, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yifei Yan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of forming semiconductor device
- Patent number 12,142,628
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Ming Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-of-line interconnect structure having air gap and method of...
- Patent number 12,142,520
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imprint method
- Patent number 12,140,863
- Issue date Nov 12, 2024
- United Microelectronics Corp.
- Su-Yun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of modifying portions of layer stacks
- Patent number 12,142,487
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor devices
- Patent number 12,136,662
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 12,131,964
- Issue date Oct 29, 2024
- HITACHI HIGH-TECH CORPORATION
- Kousuke Fukuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 12,113,107
- Issue date Oct 8, 2024
- SK Hynix Inc.
- Dae Won Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL-RESISTANT PROTECTIVE FILM-FORMING COMPOSITION HAVING CATEC...
- Publication number 20250034427
- Publication date Jan 30, 2025
- NISSAN CHEMICAL CORPORATION
- Shun KUBODERA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR ADJUSTING LINEWIDTH DUE TO PATTERN LOAD EFFECT IN SADP M...
- Publication number 20250022717
- Publication date Jan 16, 2025
- Shanghai Huali Integrated Circuit Corporation
- Liyuan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING METAL LINE AND TOP VIA FORMED THRO...
- Publication number 20250022797
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Jaemyung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTORESIST COMPOSITIONS AND METHODS OF MANUFACTURING INTEGRATED CI...
- Publication number 20250020998
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Kyungoh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PREVENTING PATTERN COLLAPSE
- Publication number 20250013153
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- Lior HULI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Composition For Forming Organic Film, Method For Forming Organic Fi...
- Publication number 20250011623
- Publication date Jan 9, 2025
- Shin-Etsu Chemical Co., Ltd.
- Daisuke KORI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SINGLE-MASK STACK ETCHING METHODS FOR FORMING STAIRCASE STRUCTURES
- Publication number 20250006506
- Publication date Jan 2, 2025
- STMicroelectronics International N.V.
- Julien LADROUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR WITH CHANNEL-SYMMETRIC GATE
- Publication number 20250006810
- Publication date Jan 2, 2025
- Intel Corporation
- Shao-Ming Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM-UP GAP FILL PROCESSES FOR SEMICONDUCTOR SUBSTRATES
- Publication number 20250006552
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Liqi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING CRITICAL DIMENSION OF PATTERNS GENERATED USING...
- Publication number 20240429053
- Publication date Dec 26, 2024
- Silicon Laboratories Inc.
- Jiye Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Feature Through Heterogeneous Stacked Film and Methods of M...
- Publication number 20240429090
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jhen Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING ELEMENTAL METALS
- Publication number 20240429065
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jane P. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL ETCHING WITH REDUCED TILT ANGLE
- Publication number 20240429064
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPS AND METHOD OF MANUFACTURING THEREOF
- Publication number 20240413014
- Publication date Dec 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UPPER CONDUCTIVE STRUCTURE HAVING MULTILAYER STACK TO DECREASE FABR...
- Publication number 20240404975
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE
- Publication number 20240393677
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Min WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ETCH SELECTIVITY, LOW STRESS ASHABLE CARBON HARD MASK
- Publication number 20240395542
- Publication date Nov 28, 2024
- LAM RESEARCH CORPORATION
- Jun XUE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING MASK PATTERN INCLUDING SURFACE ENHANCEMENT LAYER...
- Publication number 20240395552
- Publication date Nov 28, 2024
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395701
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-CONTAINING RESIST UNDERLAYER FILM FORMING COMPOSITION, LAMI...
- Publication number 20240393693
- Publication date Nov 28, 2024
- NISSAN CHEMICAL CORPORATION
- Wataru SHIBAYAMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INTEGRATED CIRCUITS HAVING SIGNAL LINES FORMED WITH DOUBLE PATTERNING
- Publication number 20240395704
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Chieh YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20240395550
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Tien SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICES
- Publication number 20240387699
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF FORMING THE SAME AND METHOD OF MEAS...
- Publication number 20240387395
- Publication date Nov 21, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- JIANPENG LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240387665
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387175
- Publication date Nov 21, 2024
- WINBOND ELECTRONICS CORP.
- Chungchen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNING THRESHOLD VOLTAGE THROUGH META STABLE PLASMA TREATMENT
- Publication number 20240387178
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shao-Jyun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Semiconductor Device
- Publication number 20240379727
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chi-Ming LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARDMASK COMPOSITION, HARDMASK LAYER, AND METHOD OF FORMING PATTERNS
- Publication number 20240376342
- Publication date Nov 14, 2024
- Samsung SDI Co., Ltd.
- Seil CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARDMASK COMPOSITION, HARDMASK LAYER, AND METHOD OF FORMING PATTERNS
- Publication number 20240377746
- Publication date Nov 14, 2024
- Samsung SDI Co., Ltd.
- Seil CHOI
- H01 - BASIC ELECTRIC ELEMENTS

using masks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of preparing semiconductor structure having low dielectric c...

Methods of manufacturing fusible structures

Contact via formation

Semiconductor device having a gate electrode with a top peripheral...

Method for forming semiconductor device

Manufacturing method of semiconductor structure including complemen...

Tin oxide mandrels in patterning

Metal oxide composite as etch stop layer

Trench capacitor profile to decrease substrate warpage

Composition for forming silicon-containing resist underlayer film a...

Semiconductor mask reshaping using a sacrificial layer

Method for forming a semiconductor-on-insulator (SOI) substrate

Semiconductor structure and a manufacturing method thereof

Method for manufacturing a gate terminal of a HEMT device, and HEMT...

Method for manufacturing semiconductor structure and semiconductor...

Methods for etching a material layer for semiconductor applications

Plasma etching method

Semiconductor devices and methods of manufacture

Tuning threshold voltage through meta stable plasma treatment

Method for forming semiconductor memory structure

Methods for forming multi-layer vertical NOR-type memory string arrays

Structure and method to pattern pitch lines

Method of fabricating a semiconductor layout and a semiconductor st...

Method of forming semiconductor device

Middle-of-line interconnect structure having air gap and method of...

Imprint method

Methods of modifying portions of layer stacks

Methods of forming semiconductor devices

Plasma processing apparatus and plasma processing method

Method for fabricating semiconductor device

Patents Applicationslast 30 patents

CHEMICAL-RESISTANT PROTECTIVE FILM-FORMING COMPOSITION HAVING CATEC...

METHOD FOR ADJUSTING LINEWIDTH DUE TO PATTERN LOAD EFFECT IN SADP M...

INTERCONNECT STRUCTURE INCLUDING METAL LINE AND TOP VIA FORMED THRO...

PHOTORESIST COMPOSITIONS AND METHODS OF MANUFACTURING INTEGRATED CI...

METHOD OF PREVENTING PATTERN COLLAPSE

Composition For Forming Organic Film, Method For Forming Organic Fi...

SINGLE-MASK STACK ETCHING METHODS FOR FORMING STAIRCASE STRUCTURES

TRANSISTOR WITH CHANNEL-SYMMETRIC GATE

BOTTOM-UP GAP FILL PROCESSES FOR SEMICONDUCTOR SUBSTRATES

METHOD FOR REDUCING CRITICAL DIMENSION OF PATTERNS GENERATED USING...

Contact Feature Through Heterogeneous Stacked Film and Methods of M...

METHOD OF PATTERNING ELEMENTAL METALS

METAL ETCHING WITH REDUCED TILT ANGLE

SEMICONDUCTOR CHIPS AND METHOD OF MANUFACTURING THEREOF

UPPER CONDUCTIVE STRUCTURE HAVING MULTILAYER STACK TO DECREASE FABR...

METHOD FOR FORMING SEMICONDUCTOR DEVICE

HIGH ETCH SELECTIVITY, LOW STRESS ASHABLE CARBON HARD MASK

METHOD OF FORMING MASK PATTERN INCLUDING SURFACE ENHANCEMENT LAYER...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SILICON-CONTAINING RESIST UNDERLAYER FILM FORMING COMPOSITION, LAMI...

INTEGRATED CIRCUITS HAVING SIGNAL LINES FORMED WITH DOUBLE PATTERNING

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

METHODS OF FORMING SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE, METHOD OF FORMING THE SAME AND METHOD OF MEAS...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

TUNING THRESHOLD VOLTAGE THROUGH META STABLE PLASMA TREATMENT

Method of Forming Semiconductor Device

HARDMASK COMPOSITION, HARDMASK LAYER, AND METHOD OF FORMING PATTERNS

HARDMASK COMPOSITION, HARDMASK LAYER, AND METHOD OF FORMING PATTERNS