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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,842,992
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with composite dielectric...
- Patent number 11,664,341
- Issue date May 30, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 11,648,750
- Issue date May 16, 2023
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor wafer and method of manufacturing the same
- Patent number 11,532,589
- Issue date Dec 20, 2022
- Kioxia Corporation
- Jun Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,456,270
- Issue date Sep 27, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Mingxing Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,393,734
- Issue date Jul 19, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,342,322
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite dielectric structure and method...
- Patent number 11,264,350
- Issue date Mar 1, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dam for three-dimensional integrated circuit
- Patent number 10,867,878
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 10,734,353
- Issue date Aug 4, 2020
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 10,727,218
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond materials with enhanced plasma resistant characteristics and a...
- Patent number 10,727,195
- Issue date Jul 28, 2020
- Technetics Group LLC
- Jason Wright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a directed self-assembled layer on a substrate
- Patent number 10,551,741
- Issue date Feb 4, 2020
- ASM IP Holding B.V.
- Werner Knaepen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 10,453,832
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding methods and wafer-bonded structures
- Patent number 10,446,519
- Issue date Oct 15, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jin Guang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 10,446,455
- Issue date Oct 15, 2019
- Amkor Technology, Inc.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
3D packaging method for semiconductor components
- Patent number 10,418,339
- Issue date Sep 17, 2019
- Imec VZW
- Fabrice Duval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 10,410,991
- Issue date Sep 10, 2019
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 10,297,515
- Issue date May 21, 2019
- Amkor Technology, Inc.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Laterally extended conductive bump buffer
- Patent number 10,276,530
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier and method thereof
- Patent number 10,163,820
- Issue date Dec 25, 2018
- Infineon Technologies AG
- Frank Pueschner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dam for three-dimensional integrated circuit
- Patent number 10,020,236
- Issue date Jul 10, 2018
- Taiwan Semiconductar Manufacturing Campany
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 9,537,056
- Issue date Jan 3, 2017
- LG Innotek Co., Ltd
- Jung Hyeok Bae
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Photosensitive adhesive composition, film-like adhesive, adhesive s...
- Patent number 9,309,446
- Issue date Apr 12, 2016
- Hitachi Chemical Company, Ltd.
- Kazuyuki Mitsukura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for fastening chips with a contact element onto a substrate...
- Patent number 9,245,869
- Issue date Jan 26, 2016
- EV Group E. Thallner GmbH
- Jurgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding layer structure and method for wafer to wafer bonding
- Patent number 8,686,571
- Issue date Apr 1, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Ting Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patternable adhesive composition, semiconductor package using the s...
- Patent number 8,558,388
- Issue date Oct 15, 2013
- Samsung Electronics Co., Ltd.
- Joon-Yong Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for processing a semiconductor wafer or die, and particle de...
- Patent number 8,338,317
- Issue date Dec 25, 2012
- Infineon Technologies AG
- Manfred Engelhardt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Detection device and method for manufacturing the same
- Patent number 8,174,118
- Issue date May 8, 2012
- Sumitomo Electric Industries, Ltd
- Youichi Nagai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARP...
- Publication number 20240404853
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dian-Hau CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD
- Publication number 20240136324
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih CHIOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POLYMER LAYER
- Publication number 20240071976
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20230191747
- Publication date Jun 22, 2023
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230084360
- Publication date Mar 16, 2023
- InnoLux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20230009679
- Publication date Jan 12, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220271000
- Publication date Aug 25, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Mingxing ZUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH COMPOSITE DIELECTRIC...
- Publication number 20220084976
- Publication date Mar 17, 2022
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE DIELECTRIC STRUCTURE AND METHOD...
- Publication number 20210296276
- Publication date Sep 23, 2021
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20200365552
- Publication date Nov 19, 2020
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20200219780
- Publication date Jul 9, 2020
- Amkor Technology, Inc.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20190341364
- Publication date Nov 7, 2019
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Application
SEAL RING STRUCTURES AND METHODS OF FORMING SAME
- Publication number 20190109125
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...
- Publication number 20190088613
- Publication date Mar 21, 2019
- TECHNETICS GROUP LLC
- Jason Wright
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Dam for Three-Dimensional Integrated Circuit
- Publication number 20180323118
- Publication date Nov 8, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR STRUCTURE
- Publication number 20180308823
- Publication date Oct 25, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHODS AND WAFER-BONDED STRUCTURES
- Publication number 20180269178
- Publication date Sep 20, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jin Guang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIER AND METHOD THEREOF
- Publication number 20180040573
- Publication date Feb 8, 2018
- INFINEON TECHNOLOGIES AG
- FRANK PUESCHNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD FOR MANUFACTURIN...
- Publication number 20170012022
- Publication date Jan 12, 2017
- FUJIFILM CORPORATION
- Kenta YOSHIDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMOCOMPRESSION BONDING WITH RAISED FEATURE
- Publication number 20160343684
- Publication date Nov 24, 2016
- Innovative Micro Technology
- Christopher S. GUDEMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150255367
- Publication date Sep 10, 2015
- Mitsubishi Electric Corporation
- Kenta NAKAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20140252394
- Publication date Sep 11, 2014
- LG Innotek Co., Ltd.
- Jung Hyeok BAE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BONDING LAYER STRUCTURE AND METHOD FOR WAFER TO WAFER BONDING
- Publication number 20140042625
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Ting Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR WAFER OR DIE, AND PARTICLE DE...
- Publication number 20120256323
- Publication date Oct 11, 2012
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE S...
- Publication number 20120248632
- Publication date Oct 4, 2012
- Kazuyuki Mitsukura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SEMICONDUCTOR DE...
- Publication number 20120199981
- Publication date Aug 9, 2012
- Se-young Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNABLE ADHESIVE COMPOSITION, SEMICONDUCTOR PACKAGE USING THE S...
- Publication number 20120181703
- Publication date Jul 19, 2012
- Samsung Electronics Co., Ltd.
- Joon-Yong PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF PREPARING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DIE FOR...
- Publication number 20120181686
- Publication date Jul 19, 2012
- Samsung Electronics Co., Ltd.
- Joon Yong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100171097
- Publication date Jul 8, 2010
- Sumitomo Electric Industries, Ltd.
- Youichi NAGAI
- H01 - BASIC ELECTRIC ELEMENTS

using masks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fingerprint sensor and manufacturing method thereof

Seal ring structures and methods of forming same

Method for preparing semiconductor device with composite dielectric...

Adhesive bonding composition and method of use

Semiconductor wafer and method of manufacturing the same

Semiconductor structure and manufacturing method thereof

Fingerprint sensor and manufacturing method thereof

Seal ring structures and methods of forming same

Semiconductor device with composite dielectric structure and method...

Dam for three-dimensional integrated circuit

Adhesive bonding composition and method of use

Seal ring structures and methods of forming same

Bond materials with enhanced plasma resistant characteristics and a...

Method of forming a directed self-assembled layer on a substrate

Seal ring structures and methods of forming same

Wafer bonding methods and wafer-bonded structures

Fingerprint sensor and manufacturing method thereof

3D packaging method for semiconductor components

Adhesive bonding composition and method of use

Fingerprint sensor and manufacturing method thereof

Laterally extended conductive bump buffer

Chip carrier and method thereof

Dam for three-dimensional integrated circuit

Light emitting device

Photosensitive adhesive composition, film-like adhesive, adhesive s...

Method for fastening chips with a contact element onto a substrate...

Bonding layer structure and method for wafer to wafer bonding

Patternable adhesive composition, semiconductor package using the s...

Method for processing a semiconductor wafer or die, and particle de...

Detection device and method for manufacturing the same

Patents Applicationslast 30 patents

REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARP...

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MANUFACTURING METHOD

SEMICONDUCTOR DEVICE WITH A POLYMER LAYER

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH COMPOSITE DIELECTRIC...

SEMICONDUCTOR DEVICE WITH COMPOSITE DIELECTRIC STRUCTURE AND METHOD...

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

SEAL RING STRUCTURES AND METHODS OF FORMING SAME

BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...

Dam for Three-Dimensional Integrated Circuit

STACKED SEMICONDUCTOR STRUCTURE

WAFER BONDING METHODS AND WAFER-BONDED STRUCTURES

CHIP CARRIER AND METHOD THEREOF

PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD FOR MANUFACTURIN...

THERMOCOMPRESSION BONDING WITH RAISED FEATURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

LIGHT EMITTING DEVICE

BONDING LAYER STRUCTURE AND METHOD FOR WAFER TO WAFER BONDING

METHOD FOR PROCESSING A SEMICONDUCTOR WAFER OR DIE, AND PARTICLE DE...

PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE S...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SEMICONDUCTOR DE...

PATTERNABLE ADHESIVE COMPOSITION, SEMICONDUCTOR PACKAGE USING THE S...

METHOD OF PREPARING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DIE FOR...

DETECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME