using means for applying energy being within the device

Industry

CPC
H01L2224/83234

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83234using means for applying energy being within the device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,545
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,547
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,546
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,302
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,306
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,476,216
- Issue date Oct 18, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier for an optoelectronic component, method of producing a carr...
- Patent number 10,991,853
- Issue date Apr 27, 2021
- OSRAM OLED GmbH
- Christoph Walter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond chucks having individually-controllable regions, and associate...
- Patent number 10,770,422
- Issue date Sep 8, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond chucks having individually-controllable regions, and associate...
- Patent number 10,770,421
- Issue date Sep 8, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro LED transferring method, micro LED display panel and micro LE...
- Patent number 10,741,739
- Issue date Aug 11, 2020
- Zeshang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slotted configuration for optimized placement of micro-components u...
- Patent number 10,175,448
- Issue date Jan 8, 2019
- Cisco Technology, Inc.
- Mary Nadeau
- G02 - OPTICS
Information Patent Grant
Mounted substrate, mounted-substrate production method, and mounted...
- Patent number 10,136,570
- Issue date Nov 20, 2018
- Sharp Kabushiki Kaisha
- Katsuhiro Yamaguchi
- G02 - OPTICS
Information Patent Grant
Use of RFID chip as assembly facilitator
- Patent number 9,373,070
- Issue date Jun 21, 2016
- Avery Dennison Corporation
- Ian James Forster
- B32 - LAYERED PRODUCTS
Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
- Patent number 9,142,532
- Issue date Sep 22, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Slotted configuration for optimized placement of micro-components u...
- Patent number 8,836,100
- Issue date Sep 16, 2014
- Cisco Technology, Inc.
- Mary Nadeau
- G02 - OPTICS
Information Patent Grant
Resonating conductive traces and methods of using same for bonding...
- Patent number 7,901,536
- Issue date Mar 8, 2011
- Lambda Technologies, Inc.
- Zakaryae Fathi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for attaching chips in a flip-chip arrangement
- Patent number 7,564,138
- Issue date Jul 21, 2009
- Alcatel-Lucent USA Inc.
- Flavio Pardo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for electrically and mechanically connecting microstructures...
- Patent number 6,893,885
- Issue date May 17, 2005
- The Regents of the University of Michigan
- David F. Lemmerhirt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Circuit and method for heating an adhesive to package or rework a s...
- Patent number 6,696,669
- Issue date Feb 24, 2004
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit and method for heating an adhesive to package or rework a s...
- Patent number 6,426,484
- Issue date Jul 30, 2002
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit and method for heating an adhesive to package or rework a s...
- Patent number 6,339,210
- Issue date Jan 15, 2002
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit and method for heating an adhesive to package or rework a s...
- Patent number 6,111,220
- Issue date Aug 29, 2000
- Micron Technology, Inc.
- David R. Hambree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, a module and a method for fastening components of the mo...
- Patent number 5,954,978
- Issue date Sep 21, 1999
- Adlas Lasertechnik GmbH & Co., KG
- Wolf Seelert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit and method for heating an adhesive to package or rework a s...
- Patent number 5,938,956
- Issue date Aug 17, 1999
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self regulating temperature heater as an integral part of a printed...
- Patent number 5,010,233
- Issue date Apr 23, 1991
- AMP Incorporated
- Homer E. Henschen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package with integral heating circuit
- Patent number 4,561,006
- Issue date Dec 24, 1985
- Sperry Corporation
- Thomas P. Currie
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20250015030
- Publication date Jan 9, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF TRANSFERRING A DIE FROM A CARRIER TO A RECEIVE SUBSTRATE...
- Publication number 20230107245
- Publication date Apr 6, 2023
- KULICKE & SOFFA NETHERLANDS B.V.
- Val R. Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220254745
- Publication date Aug 11, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139856
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139857
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220130783
- Publication date Apr 28, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20210327739
- Publication date Oct 21, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20210327740
- Publication date Oct 21, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20210243894
- Publication date Aug 5, 2021
- VueReal Inc.
- Gholamreza Chaji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20200350281
- Publication date Nov 5, 2020
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...
- Publication number 20200212002
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- B32 - LAYERED PRODUCTS
Information Patent Application
BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...
- Publication number 20200212003
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- B32 - LAYERED PRODUCTS
Information Patent Application
MICRO LED TRANSFERRING METHOD, MICRO LED DISPLAY PANEL AND MICRO LE...
- Publication number 20190148611
- Publication date May 16, 2019
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Zeshang HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-WAFER BONDING METHOD AND BONDING DEVICE, AND STRUCTURE COMP...
- Publication number 20150048523
- Publication date Feb 19, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SLOTTED CONFIGURATION FOR OPTIMIZED PLACEMENT OF MICRO-COMPONENTS U...
- Publication number 20140362457
- Publication date Dec 11, 2014
- Mary NADEAU
- G02 - OPTICS
Information Patent Application
ADHESIVE BONDING METHOD
- Publication number 20110198014
- Publication date Aug 18, 2011
- SAE MAGNETICS (H. K) LTD.
- Wingkeung Mak
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Slotted Configuration for Optimized Placement of Micro-Components u...
- Publication number 20110127633
- Publication date Jun 2, 2011
- LIGHTWIRE, INC.
- Mary Nadeau
- G02 - OPTICS
Information Patent Application
MULTI-CHIP HYBRID-MOUNTED DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100309643
- Publication date Dec 9, 2010
- Rene Todt
- G02 - OPTICS
Information Patent Application
Adhesive bonding method
- Publication number 20100200147
- Publication date Aug 12, 2010
- SAE MAGNETICS (H. K) LTD.
- Wingkeung Mak
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Resonating conductive traces and methods of using same for bonding...
- Publication number 20070284034
- Publication date Dec 13, 2007
- Lambda Technologies, Inc.
- Zakaryae Fathi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method for attaching chips in a flip-chip arrangement
- Publication number 20060138605
- Publication date Jun 29, 2006
- Flavio Pardo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Thermally controlled fluidic self-assembly method and support
- Publication number 20060051517
- Publication date Mar 9, 2006
- Eastman Kodak Company
- Daniel D. Haas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for locally connecting microstructures and device...
- Publication number 20030178403
- Publication date Sep 25, 2003
- David F. Lemmerhirt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Circuit and method for heating an adhesive to package or rework a s...
- Publication number 20020175153
- Publication date Nov 28, 2002
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit and method for heating an adhesive to package or rework a s...
- Publication number 20020108940
- Publication date Aug 15, 2002
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS

using means for applying energy being within the device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Selective micro device transfer to receiver substrate

Selective transfer of micro devices

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Carrier for an optoelectronic component, method of producing a carr...

Bond chucks having individually-controllable regions, and associate...

Bond chucks having individually-controllable regions, and associate...

Micro LED transferring method, micro LED display panel and micro LE...

Slotted configuration for optimized placement of micro-components u...

Mounted substrate, mounted-substrate production method, and mounted...

Use of RFID chip as assembly facilitator

Chip-on-wafer bonding method and bonding device, and structure comp...

Slotted configuration for optimized placement of micro-components u...

Resonating conductive traces and methods of using same for bonding...

Method for attaching chips in a flip-chip arrangement

Method for electrically and mechanically connecting microstructures...

Circuit and method for heating an adhesive to package or rework a s...

Circuit and method for heating an adhesive to package or rework a s...

Circuit and method for heating an adhesive to package or rework a s...

Circuit and method for heating an adhesive to package or rework a s...

Substrate, a module and a method for fastening components of the mo...

Circuit and method for heating an adhesive to package or rework a s...

Self regulating temperature heater as an integral part of a printed...

Integrated circuit package with integral heating circuit

Patents Applicationslast 30 patents

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE TRANSFER OF MICRO DEVICES

METHODS OF TRANSFERRING A DIE FROM A CARRIER TO A RECEIVE SUBSTRATE...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE TRANSFER OF MICRO DEVICES

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...

BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...

MICRO LED TRANSFERRING METHOD, MICRO LED DISPLAY PANEL AND MICRO LE...

CHIP-ON-WAFER BONDING METHOD AND BONDING DEVICE, AND STRUCTURE COMP...

SLOTTED CONFIGURATION FOR OPTIMIZED PLACEMENT OF MICRO-COMPONENTS U...

ADHESIVE BONDING METHOD

Slotted Configuration for Optimized Placement of Micro-Components u...

MULTI-CHIP HYBRID-MOUNTED DEVICE AND METHOD OF MANUFACTURING THE SAME

Adhesive bonding method

Resonating conductive traces and methods of using same for bonding...

Method for attaching chips in a flip-chip arrangement

Thermally controlled fluidic self-assembly method and support

Method and system for locally connecting microstructures and device...

Circuit and method for heating an adhesive to package or rework a s...

Circuit and method for heating an adhesive to package or rework a s...