using precipitation techniques to apply the conductive material

Industry

CPC
H05K3/18

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/18using precipitation techniques to apply the conductive material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board and method of manufacturing the same
- Patent number 11,979,983
- Issue date May 7, 2024
- Sumitomo Electric Industries, Ltd.
- Maki Ikebe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 11,979,990
- Issue date May 7, 2024
- Resonac Corporation
- Masaya Toba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for manufacturing electrical components using e...
- Patent number 11,970,783
- Issue date Apr 30, 2024
- FABRIC8LABS, INC.
- David Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electronics module with raceway and submodules
- Patent number 11,924,983
- Issue date Mar 5, 2024
- Honeywell Federal Manufacturing & Technologies, LLC
- Ryan J. Eickbush
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate and a manufacturing method of the multilayer s...
- Patent number 11,923,123
- Issue date Mar 5, 2024
- Murata Manufacturing Co., Ltd.
- Kazutaka Muraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board and method of producing the same
- Patent number 11,917,751
- Issue date Feb 27, 2024
- TOPPAN INC.
- Masao Aratani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device housings with patterned electrolytic plating layers
- Patent number 11,910,538
- Issue date Feb 20, 2024
- Hewlett-Packard Development Company, L.P.
- Yi-Chen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joined body of joining base material and metal layer
- Patent number 11,889,635
- Issue date Jan 30, 2024
- WORLD METAL CO., LTD
- Hidenori Hayashida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,889,634
- Issue date Jan 30, 2024
- LG Innotek Co., Ltd
- Jung Ho Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Catalyzed metal foil and uses thereof
- Patent number 11,877,404
- Issue date Jan 16, 2024
- AVERATEK CORPORATION
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board and method for producing the same
- Patent number 11,871,514
- Issue date Jan 9, 2024
- Sumitomo Electric Industries, Ltd.
- Kenji Takahashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Circuit board and method of manufacturing circuit board
- Patent number 11,871,526
- Issue date Jan 9, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Jun Dai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 11,859,302
- Issue date Jan 2, 2024
- Unimicron Technology Corp.
- Heng-Ming Nien
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed circuit board and method of manufacturing printed circuit b...
- Patent number 11,864,312
- Issue date Jan 2, 2024
- Sumitomo Electric Industries, Ltd.
- Hiroshi Ueda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating rotary equipment for a rotary wing, provided...
- Patent number 11,858,643
- Issue date Jan 2, 2024
- Airbus Helicopters
- Gauthier Gibert
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Plated metallization structures
- Patent number 11,862,518
- Issue date Jan 2, 2024
- Analog Devices International Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit substrate and method for manufacturing the same
- Patent number 11,856,694
- Issue date Dec 26, 2023
- National Taiwan University of Science and Technology
- Chen-Hao Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit formation method
- Patent number 11,849,545
- Issue date Dec 19, 2023
- FUJI CORPORATION
- Kenji Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional molded circuit component
- Patent number 11,839,023
- Issue date Dec 5, 2023
- MAXELL, LTD.
- Atsushi Yusa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of manufacturing ceramic electronic component
- Patent number 11,821,090
- Issue date Nov 21, 2023
- Murata Manufacturing Co., Ltd.
- Yoshinori Ueda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multilayer coil circuit substrate
- Patent number 11,810,703
- Issue date Nov 7, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board dielectric molding and electrolytic metalliza...
- Patent number 11,800,640
- Issue date Oct 24, 2023
- Infinitum Electric, Inc.
- Edward C. Carignan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Pattern forming method
- Patent number 11,800,648
- Issue date Oct 24, 2023
- Konica Minolta, Inc.
- Masayuki Ushiku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board, COF module and electronic device including...
- Patent number 11,800,639
- Issue date Oct 24, 2023
- LG Innotek Co., Ltd
- Jun Young Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, electronic device, and electronic module
- Patent number 11,792,930
- Issue date Oct 17, 2023
- Kyocera Corporation
- Yuki Takeshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring board
- Patent number 11,785,721
- Issue date Oct 10, 2023
- Toyota Jidosha Kabushiki Kaisha
- Haruki Kondoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Mounting substrate to which image sensor is mounted, sensor package...
- Patent number 11,778,293
- Issue date Oct 3, 2023
- Canon Kabushiki Kaisha
- Dai Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and wireless communication terminal
- Patent number 11,778,730
- Issue date Oct 3, 2023
- FCNT LIMITED
- Takahiro Shinojima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing insulated circuit board using a mask and parti...
- Patent number 11,761,108
- Issue date Sep 19, 2023
- Dowa Metaltech Co., Ltd.
- Masaaki Higo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Multiple in-mold electronics structure and method of manufacturing...
- Patent number 11,765,819
- Issue date Sep 19, 2023
- INTOPS.CO., LTD.
- Sung-hoon Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING TRANSFER PLATE, WIRING-EQUIPPED WIRING TRANSFER PLATE, WIRIN...
- Publication number 20240155774
- Publication date May 9, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Takayoshi NIRENGI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE WITH CONDUCTIVE PATTERN ATTACHED...
- Publication number 20240147627
- Publication date May 2, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Tomohiro FUKAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW-ROUGHNESS SURFACE-TREATED COPPER FOIL WITH LOW BENDING DEFORMAT...
- Publication number 20240121902
- Publication date Apr 11, 2024
- Lotte Energy Materials Corporation
- Chang Yol YANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEMS, METHODS, AND DEVICES FOR PRODUCING INTERCONNECTS ON DEFORM...
- Publication number 20240114630
- Publication date Apr 4, 2024
- Meta Platforms Technologies, LLC
- Cameron Elliot Glasscock
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING ELECTRONI...
- Publication number 20240090133
- Publication date Mar 14, 2024
- Murata Manufacturing Co., Ltd.
- Norikazu KUME
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE BOARD AND SEMICONDUCTOR MODULE HAVING THE SAME
- Publication number 20240074058
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- JAEKWANG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE RESIN MULTILAYER BODY AND METHOD FOR PRODUCING SAME
- Publication number 20240059803
- Publication date Feb 22, 2024
- Asahi Kasei Kabushiki Kaisha
- Kazuya NAITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240057253
- Publication date Feb 15, 2024
- LG Innotek Co., Ltd.
- Sang Myung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING BOARD, LAMINATE AND METHOD FOR PRODUCIN...
- Publication number 20240057263
- Publication date Feb 15, 2024
- Resonac Corporation
- Masaya TOBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD ASSEMBLY SHEET
- Publication number 20240040705
- Publication date Feb 1, 2024
- Nitto Denko Corporation
- Rihito FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING BOARD, AND WIRING BOARD
- Publication number 20240015889
- Publication date Jan 11, 2024
- Resonac Corporation
- Kei TOGASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240008191
- Publication date Jan 4, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20230422408
- Publication date Dec 28, 2023
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20230422406
- Publication date Dec 28, 2023
- IBIDEN CO., LTD.
- Takuya INISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...
- Publication number 20230413451
- Publication date Dec 21, 2023
- Sumitomo Electric Industries, Ltd.
- Shingo NAGATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR PRINTING METAL LINES AND PATTERNS AT HIGH R...
- Publication number 20230398802
- Publication date Dec 14, 2023
- Reophotonics Ltd.
- Michael Zenou
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20230403793
- Publication date Dec 14, 2023
- KYOCERA CORPORATION
- Yuki TAKESHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BASE MATERIAL FOR PRINTED CIRCUIT, PRINTED CIRCUIT, AND METHOD OF M...
- Publication number 20230371176
- Publication date Nov 16, 2023
- Sumitomo Electric Industries, Ltd.
- Takuto HIDANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20230369751
- Publication date Nov 16, 2023
- DAI NIPPON PRINTING CO., LTD.
- Koichi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Structure
- Publication number 20230354515
- Publication date Nov 2, 2023
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Articles and Structures with Laser Breakable and Platable Compounds
- Publication number 20230340226
- Publication date Oct 26, 2023
- SHPP Global Technologies B.V.
- Yunan CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20230337370
- Publication date Oct 19, 2023
- LG Innotek Co., Ltd.
- Yun Mi BAE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230337367
- Publication date Oct 19, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Mi Jeong JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230335479
- Publication date Oct 19, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Chan Hoon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE MANUFACTURING METHOD
- Publication number 20230326765
- Publication date Oct 12, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20230319987
- Publication date Oct 5, 2023
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING BOARD WITH ROUGHENED SURFACE AND METHOD FO...
- Publication number 20230302578
- Publication date Sep 28, 2023
- Toyota Jidosha Kabushiki Kaisha
- Hiroshi YANAGIMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD
- Publication number 20230309244
- Publication date Sep 28, 2023
- IBIDEN CO., LTD.
- Atsushi ISHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONICS MODULE WITH RACEWAY AND SUBMODULES
- Publication number 20230300996
- Publication date Sep 21, 2023
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Ryan J. Eickbush
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER CLAD LAMINATE AND METHOD FOR PRODUCING THE SAME
- Publication number 20230284393
- Publication date Sep 7, 2023
- TOYO KOHAN CO., LTD
- Nobuaki MUKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

using precipitation techniques to apply the conductive material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed wiring board and method of manufacturing the same

Wiring board and method for manufacturing the same

Systems and methods for manufacturing electrical components using e...

Electronics module with raceway and submodules

Multilayer substrate and a manufacturing method of the multilayer s...

Multilayer wiring board and method of producing the same

Electronic device housings with patterned electrolytic plating layers

Joined body of joining base material and metal layer

Printed circuit board and method of manufacturing the same

Catalyzed metal foil and uses thereof

Flexible printed circuit board and method for producing the same

Circuit board and method of manufacturing circuit board

Electroplating apparatus and electroplating method

Printed circuit board and method of manufacturing printed circuit b...

Method of fabricating rotary equipment for a rotary wing, provided...

Plated metallization structures

Circuit substrate and method for manufacturing the same

Circuit formation method

Three-dimensional molded circuit component

Method of manufacturing ceramic electronic component

Multilayer coil circuit substrate

Printed circuit board dielectric molding and electrolytic metalliza...

Pattern forming method

Flexible circuit board, COF module and electronic device including...

Wiring substrate, electronic device, and electronic module

Method for manufacturing wiring board

Mounting substrate to which image sensor is mounted, sensor package...

Printed circuit board and wireless communication terminal

Method for producing insulated circuit board using a mask and parti...

Multiple in-mold electronics structure and method of manufacturing...

Patents Applicationslast 30 patents

WIRING TRANSFER PLATE, WIRING-EQUIPPED WIRING TRANSFER PLATE, WIRIN...

METHOD FOR MANUFACTURING SUBSTRATE WITH CONDUCTIVE PATTERN ATTACHED...

LOW-ROUGHNESS SURFACE-TREATED COPPER FOIL WITH LOW BENDING DEFORMAT...

SYSTEMS, METHODS, AND DEVICES FOR PRODUCING INTERCONNECTS ON DEFORM...

ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING ELECTRONI...

MODULE BOARD AND SEMICONDUCTOR MODULE HAVING THE SAME

PHOTOSENSITIVE RESIN MULTILAYER BODY AND METHOD FOR PRODUCING SAME

CIRCUIT BOARD

METHOD FOR PRODUCING WIRING BOARD, LAMINATE AND METHOD FOR PRODUCIN...

WIRING CIRCUIT BOARD ASSEMBLY SHEET

METHOD FOR PRODUCING WIRING BOARD, AND WIRING BOARD

WIRING SUBSTRATE

PRINTED WIRING BOARD

PRINTED WIRING BOARD

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...

SYSTEMS AND METHODS FOR PRINTING METAL LINES AND PATTERNS AT HIGH R...

WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

BASE MATERIAL FOR PRINTED CIRCUIT, PRINTED CIRCUIT, AND METHOD OF M...

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

Circuit Structure

Articles and Structures with Laser Breakable and Platable Compounds

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD

PACKAGE SUBSTRATE MANUFACTURING METHOD

PRINTED WIRING BOARD

METHOD FOR MANUFACTURING BOARD WITH ROUGHENED SURFACE AND METHOD FO...

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD

ELECTRONICS MODULE WITH RACEWAY AND SUBMODULES

COPPER CLAD LAMINATE AND METHOD FOR PRODUCING THE SAME