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H01L2224/82104

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/82104using screen printing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method for contacting and packetising a semiconductor chip
- Patent number 11,749,638
- Issue date Sep 5, 2023
- Technische Universität Chemnitz
- Johannes Rudolph
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aligning component carrier structure with known-good sections and c...
- Patent number 11,430,703
- Issue date Aug 30, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,380,862
- Issue date Jul 5, 2022
- Apple Inc.
- Andreas Bibi
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 10,964,900
- Issue date Mar 30, 2021
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming complex electronic circuits by interconnecting g...
- Patent number 10,964,665
- Issue date Mar 30, 2021
- Nthdegree Technologies Worldwide, Inc.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer frame over se...
- Patent number RE48408
- Issue date Jan 26, 2021
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Reza A. Pagaila
Information Patent Grant
Semiconductor device and method of forming interposer frame over se...
- Patent number RE48111
- Issue date Jul 21, 2020
- JCET Semiconductor (Shaoxing) Co. Ltd.
- Reza A. Pagaila
Information Patent Grant
System and method for the fluidic assembly of micro-LEDs utilizing...
- Patent number 10,535,640
- Issue date Jan 14, 2020
- eLux Inc.
- Jong-Jan Lee
- G02 - OPTICS
Information Patent Grant
Printing complex electronic circuits using a printable solution def...
- Patent number 10,499,499
- Issue date Dec 3, 2019
- NthDegree Technologies Worldwide Inc.
- William Johnstone Ray
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 10,411,210
- Issue date Sep 10, 2019
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure
- Patent number 10,334,733
- Issue date Jun 25, 2019
- Omron Corporation
- Wakahiro Kawai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor device and method of forming an embedded SoP fan-out...
- Patent number 10,217,702
- Issue date Feb 26, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing complex electronic circuits using a patterned hydrophobic...
- Patent number 9,913,371
- Issue date Mar 6, 2018
- NthDegree Technologies Worldwide Inc.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 9,865,832
- Issue date Jan 9, 2018
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Printing complex electronic circuits
- Patent number 9,572,249
- Issue date Feb 14, 2017
- Nthdegree Technologies Worldwide Inc.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate interconnect
- Patent number 9,536,753
- Issue date Jan 3, 2017
- Texas Instruments Incorporated
- Yohei Koto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip power semiconductor device
- Patent number 9,443,760
- Issue date Sep 13, 2016
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an embedded SOP fan-out...
- Patent number 9,385,006
- Issue date Jul 5, 2016
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for assembling electric components on a flexib...
- Patent number 9,338,894
- Issue date May 10, 2016
- Nederlandse Organisatie voor Toegepast-Natuurwetenschappelijk Onderzoek TNO
- Jeroen Van Den Brand
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a fan-out WLP with package
- Patent number 9,337,165
- Issue date May 10, 2016
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a polymer disposed on a carrier
- Patent number 9,318,473
- Issue date Apr 19, 2016
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-terminal printed devices interconnected as circuits
- Patent number 9,275,978
- Issue date Mar 1, 2016
- NthDegree Technologies Worldwide Inc.
- Richard Austin Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a light emitting diode display with integrate...
- Patent number 9,252,375
- Issue date Feb 2, 2016
- LuxVue Technology Corporation
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device and method of forming interposer frame over se...
- Patent number 9,240,380
- Issue date Jan 19, 2016
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-in-packages and methods of formation thereof
- Patent number 9,147,628
- Issue date Sep 29, 2015
- Infineon Technoloiges Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic module and an electronic module
- Patent number 9,129,959
- Issue date Sep 8, 2015
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-terminal printed devices interconnected as circuits
- Patent number 9,099,568
- Issue date Aug 4, 2015
- NthDegree Technologies Worldwide Inc.
- Richard Austin Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package and method of manufacturing the same
- Patent number 9,099,313
- Issue date Aug 4, 2015
- SK Hynix Inc.
- Sang Yong Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multichip power semiconductor device
- Patent number 8,916,968
- Issue date Dec 23, 2014
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20240008298
- Publication date Jan 4, 2024
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Circuits Including Micropatterns and Using Partial Curing to Adhere...
- Publication number 20220352108
- Publication date Nov 3, 2022
- 3M Innovative Properties Company
- Teresa M. Goeddel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20220293876
- Publication date Sep 15, 2022
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Method for Contacting and Packetising a Semiconductor Chip
- Publication number 20220181291
- Publication date Jun 9, 2022
- TECHNISCHE UNIVERSITAT CHEMNITZ
- Johannes Rudolph
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20210257572
- Publication date Aug 19, 2021
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Interconnect Structure for High Power GaN Module
- Publication number 20210175195
- Publication date Jun 10, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aligning Component Carrier Structure With Known-Good Sections and C...
- Publication number 20200357706
- Publication date Nov 12, 2020
- Marco Gavagnin
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20180102492
- Publication date Apr 12, 2018
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interposer Frame Over Se...
- Publication number 20140327145
- Publication date Nov 6, 2014
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTING COMPLEX ELECTRONIC CIRCUITS
- Publication number 20140268591
- Publication date Sep 18, 2014
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- William Johnstone Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A LIGHT EMITTING DIODE DISPLAY WITH INTEGRATE...
- Publication number 20140267683
- Publication date Sep 18, 2014
- LUXVUE TECHNOLOGY CORPORATION
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-TERMINAL PRINTED DEVICES INTERCONNECTED AS CIRCUITS
- Publication number 20140264460
- Publication date Sep 18, 2014
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- Richard Austin Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140167275
- Publication date Jun 19, 2014
- SK HYNIX INC.
- Sang Yong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE INCLUDING WIRE BOND AND ELECTRICALLY CON...
- Publication number 20140124962
- Publication date May 8, 2014
- Honeywell International Inc.
- David Scheid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ASSEMBLING ELECTRIC COMPONENTS ON A FLEXIB...
- Publication number 20140069697
- Publication date Mar 13, 2014
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETEN
- Jeroen Van Den Brand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing an Electronic Module and an Electronic Module
- Publication number 20140054780
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-In-Packages and Methods of Formation Thereof
- Publication number 20140001615
- Publication date Jan 2, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Embedded SOP Fan-Out...
- Publication number 20130341784
- Publication date Dec 26, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC ELEMENTS AND M...
- Publication number 20130300000
- Publication date Nov 14, 2013
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAKING ELECTRONIC STORAGE SYSTEM HAVING CODE CIRCUIT
- Publication number 20130283599
- Publication date Oct 31, 2013
- Ronald Steven Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing Method for Semiconductor Device and Semiconductor Device
- Publication number 20130277824
- Publication date Oct 24, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip Power Semiconductor Device
- Publication number 20130256856
- Publication date Oct 3, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDISTRIBUTING FUNCTIONAL ELEMENT
- Publication number 20130237055
- Publication date Sep 12, 2013
- IMEC
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT WRITE INTERCONNECTIONS AND METHOD OF MANUFACTURING THEREOF
- Publication number 20130154110
- Publication date Jun 20, 2013
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROAD-AREA LIGHTING SYSTEMS
- Publication number 20130111744
- Publication date May 9, 2013
- Michael A. Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROAD-AREA LIGHTING SYSTEMS
- Publication number 20130112989
- Publication date May 9, 2013
- COOLEDGE LIGHTING, INC.
- Michael Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interposer Frame Over Se...
- Publication number 20130105989
- Publication date May 2, 2013
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROAD-AREA LIGHTING SYSTEMS
- Publication number 20130056749
- Publication date Mar 7, 2013
- Michael Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC ELEMENTS AND M...
- Publication number 20130032944
- Publication date Feb 7, 2013
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WLP WITH PACKAGE
- Publication number 20120313253
- Publication date Dec 13, 2012
- Tessera, Inc.
- Yoshikuni Nakadaira
- H01 - BASIC ELECTRIC ELEMENTS

using screen printing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light emitting diode display with redundancy scheme

Method for contacting and packetising a semiconductor chip

Aligning component carrier structure with known-good sections and c...

Light emitting diode display with redundancy scheme

Light emitting diode display with redundancy scheme

Method for forming complex electronic circuits by interconnecting g...

Semiconductor device and method of forming interposer frame over se...

Semiconductor device and method of forming interposer frame over se...

System and method for the fluidic assembly of micro-LEDs utilizing...

Printing complex electronic circuits using a printable solution def...

Light emitting diode display with redundancy scheme

Circuit structure

Semiconductor device and method of forming an embedded SoP fan-out...

Printing complex electronic circuits using a patterned hydrophobic...

Light emitting diode display with redundancy scheme

Printing complex electronic circuits

Circuit substrate interconnect

Multichip power semiconductor device

Semiconductor device and method of forming an embedded SOP fan-out...

Method and apparatus for assembling electric components on a flexib...

Method for manufacturing a fan-out WLP with package

Semiconductor device including a polymer disposed on a carrier

Three-terminal printed devices interconnected as circuits

Method of fabricating a light emitting diode display with integrate...

Semiconductor device and method of forming interposer frame over se...

Package-in-packages and methods of formation thereof

Method for manufacturing an electronic module and an electronic module

Three-terminal printed devices interconnected as circuits

Embedded package and method of manufacturing the same

Multichip power semiconductor device

Patents Applicationslast 30 patents

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

Circuits Including Micropatterns and Using Partial Curing to Adhere...

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

Method for Contacting and Packetising a Semiconductor Chip

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

Interconnect Structure for High Power GaN Module

Aligning Component Carrier Structure With Known-Good Sections and C...

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

Semiconductor Device and Method of Forming Interposer Frame Over Se...

PRINTING COMPLEX ELECTRONIC CIRCUITS

METHOD OF FABRICATING A LIGHT EMITTING DIODE DISPLAY WITH INTEGRATE...

THREE-TERMINAL PRINTED DEVICES INTERCONNECTED AS CIRCUITS

EMBEDDED PACKAGE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT PACKAGE INCLUDING WIRE BOND AND ELECTRICALLY CON...

METHOD AND APPARATUS FOR ASSEMBLING ELECTRIC COMPONENTS ON A FLEXIB...

Method for Manufacturing an Electronic Module and an Electronic Module

Package-In-Packages and Methods of Formation Thereof

Semiconductor Device and Method of Forming an Embedded SOP Fan-Out...

MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC ELEMENTS AND M...

MAKING ELECTRONIC STORAGE SYSTEM HAVING CODE CIRCUIT

Manufacturing Method for Semiconductor Device and Semiconductor Device

Multichip Power Semiconductor Device

METHOD OF REDISTRIBUTING FUNCTIONAL ELEMENT

DIRECT WRITE INTERCONNECTIONS AND METHOD OF MANUFACTURING THEREOF

BROAD-AREA LIGHTING SYSTEMS

BROAD-AREA LIGHTING SYSTEMS

Semiconductor Device and Method of Forming Interposer Frame Over Se...

BROAD-AREA LIGHTING SYSTEMS

MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC ELEMENTS AND M...

FAN-OUT WLP WITH PACKAGE