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Diaphragm and MEMS sensor using same
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Patent number 12,126,959
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Issue date Oct 22, 2024
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AAC Acoustic Technologies (Shenzhen) Co., Ltd.
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Linlin Wang
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H04 - ELECTRIC COMMUNICATION TECHNIQUE
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Vibration transducer
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Patent number 12,126,961
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Issue date Oct 22, 2024
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AAC Acoustic Technologies (Shenzhen) Co., Ltd.
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Zhenkui Meng
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H04 - ELECTRIC COMMUNICATION TECHNIQUE
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MEMS microphone
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Patent number 11,974,094
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Issue date Apr 30, 2024
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Goertek, Inc.
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Junkai Zhan
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H04 - ELECTRIC COMMUNICATION TECHNIQUE
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Sound production device
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Patent number 11,950,070
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Issue date Apr 2, 2024
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AAC KAITAI TECHNOLOGIES (WUHAN) CO., LTD
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Qiang Dan
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G10 - MUSICAL INSTRUMENTS ACOUSTICS
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MEMS microphone
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Patent number 11,889,248
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Issue date Jan 30, 2024
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AAC Acoustic Technologies (Shenzhen) Co., Ltd.
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Zhenkui Meng
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H04 - ELECTRIC COMMUNICATION TECHNIQUE
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MEMS device
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Patent number 11,863,933
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Issue date Jan 2, 2024
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Infineon Technologies AG
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Niccoló De Milleri
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B81 - MICRO-STRUCTURAL TECHNOLOGY
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Microphone
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Patent number 11,825,267
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Issue date Nov 21, 2023
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Denso Corporation
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Tomoki Tanemura
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H03 - BASIC ELECTRONIC CIRCUITRY
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Composite structures
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Patent number 11,814,284
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Issue date Nov 14, 2023
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Cirrus Logic Inc.
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Roberto Brioschi
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B81 - MICRO-STRUCTURAL TECHNOLOGY
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Micromechanical sound transducer
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Patent number 11,750,982
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Issue date Sep 5, 2023
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Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
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Bert Kaiser
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H04 - ELECTRIC COMMUNICATION TECHNIQUE
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Robust MEMS microphone
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Patent number 11,696,078
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Issue date Jul 4, 2023
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QUALCOMM Incorporated
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Craig Core
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B81 - MICRO-STRUCTURAL TECHNOLOGY
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Structure for integrated microphone
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Patent number 11,678,133
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Issue date Jun 13, 2023
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Jung-Huei Peng
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B81 - MICRO-STRUCTURAL TECHNOLOGY
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