using structural alignment aids

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B81C2203/054

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

Current Industry

B81C2203/054using structural alignment aids

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Laser-assisted material phase-change and expulsion micro-machining...
- Patent number 12,077,432
- Issue date Sep 3, 2024
- Massachusetts Institute of Technology
- Prashant Patil
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modular 3-D printed devices for sample delivery and method
- Patent number 11,485,632
- Issue date Nov 1, 2022
- Arizona Board of Regents on behalf of Arizona State University
- Alexandra Ros
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package with roughend interface
- Patent number 11,192,778
- Issue date Dec 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated package structure for MEMS element and ASIC chip and met...
- Patent number 11,130,674
- Issue date Sep 28, 2021
- J-METRICS TECHNOLOGY CO., LTD.
- Sheng-Lin Ma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Alignment mark and semiconductor device, and fabrication methods th...
- Patent number 11,049,816
- Issue date Jun 29, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for bonding wafers eutectically, and a wafer composite
- Patent number 10,927,004
- Issue date Feb 23, 2021
- Robert Bosch GmbH
- Axel Grosse
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of achieving universal interfacing using suspended and/or f...
- Patent number 10,807,864
- Issue date Oct 20, 2020
- The Regents of the University of Colorado, a Body Corporate
- Joseph J. Brown
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package with roughend interface
- Patent number 10,710,872
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Transfer head and method for transferring micro devices
- Patent number 10,593,582
- Issue date Mar 17, 2020
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and device for producing a microfluidic analysis cartridge
- Patent number 10,295,441
- Issue date May 21, 2019
- Robert Bosch GmbH
- Franz Laermer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfluidic device
- Patent number 10,160,145
- Issue date Dec 25, 2018
- STRATEC Consumables GmbH
- Gottfried Reiter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die bond design for medium pressure sensor
- Patent number 10,035,703
- Issue date Jul 31, 2018
- Continental Automotive Systems, Inc.
- Joe Pin Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Spatial light modulation element module, photolithographing apparat...
- Patent number 9,927,712
- Issue date Mar 27, 2018
- Nikon Corporation
- Yoshihiko Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Edge construction on optical devices
- Patent number 9,835,801
- Issue date Dec 5, 2017
- Mellanox Technologies Silicon Photonics Inc.
- Wei Qian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing substrate gap supporter
- Patent number 9,748,023
- Issue date Aug 29, 2017
- GNE TECH CO., LTD.
- Jae Ku Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for a seal ring structure
- Patent number 9,650,243
- Issue date May 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ying Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Component including two semiconductor elements, which are bonded to...
- Patent number 9,650,240
- Issue date May 16, 2017
- Robert Bosch GmbH
- Mirko Hattass
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Three dimensional assembly of diamagnetic materials using magnetic...
- Patent number 9,409,265
- Issue date Aug 9, 2016
- President and Fellows of Harvard College
- George M. Whitesides
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
MEMS micro-mirror assembly
- Patent number 9,405,116
- Issue date Aug 2, 2016
- Intel Corporation
- Faouzi Khechana
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a MEMS micro-mirror assembly
- Patent number 9,323,047
- Issue date Apr 26, 2016
- Intel Corporation
- Faouzi Khechana
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS anchor and spacer structure
- Patent number 9,213,181
- Issue date Dec 15, 2015
- Pixtronix, Inc.
- Timothy J. Brosnihan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Display device
- Patent number 9,206,036
- Issue date Dec 8, 2015
- Pixtronix, Inc.
- Jun Fujiyoshi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for improving alignment precision of parts in MEMS
- Patent number 9,055,701
- Issue date Jun 9, 2015
- International Business Machines Corporation
- Stefano S. Oggioni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method for a porous microneedle array and correspondi...
- Patent number 8,986,256
- Issue date Mar 24, 2015
- Robert Bosch GmbH
- Dick Scholten
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Angle control of multi-cavity molded components for MEMS and NEMS g...
- Patent number 8,877,071
- Issue date Nov 4, 2014
- Metadigm LLC
- Victor B. Kley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for improving alignment precision of parts in MEMS
- Patent number 8,707,553
- Issue date Apr 29, 2014
- International Business Machines Corporation
- Stefano S. Oggioni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabricating a micro-mechanical component
- Patent number 8,661,681
- Issue date Mar 4, 2014
- Nivarox-Far S.A.
- Alexandre Fussinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure having MEMS elements and fabrication method thereof
- Patent number 8,399,940
- Issue date Mar 19, 2013
- Siliconware Precision Industries Co., Ltd.
- Chen-Han Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,344,489
- Issue date Jan 1, 2013
- Yamaha Corporation
- Hiroshi Saitoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,646,092
- Issue date Jan 12, 2010
- Yamaha Corporation
- Hiroshi Saitoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL PROXIMITY SENSOR AND METHOD OF MAKING SAME
- Publication number 20250002333
- Publication date Jan 2, 2025
- STMicroelectronics International N.V.
- Eric SAUGIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE STACKING WITH CONTROLLED ANGULAR ALIGNMENT
- Publication number 20240425367
- Publication date Dec 26, 2024
- NXP USA, Inc.
- Chayathorn Saklang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT
- Publication number 20240425364
- Publication date Dec 26, 2024
- NXP USA, Inc.
- Chayathorn Saklang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH-PRECISION ALIGNMENT METHOD FOR PRODUCING A DEVICE, AND DEVICE
- Publication number 20240262683
- Publication date Aug 8, 2024
- ams-OSRAM International GmbH
- Nicole Berner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Anchor Structure
- Publication number 20240017987
- Publication date Jan 18, 2024
- SensorTek technology Corp.
- Shih-Wei Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
- Publication number 20230314197
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Arvinder Manmohan Singh Chadha
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210280527
- Publication date Sep 9, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Laser-Assisted Material Phase-Change and Expulsion Micro-Machining...
- Publication number 20210139321
- Publication date May 13, 2021
- Massachusetts Institute of Technology
- Prashant Patil
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMS PACKAGE WITH ROUGHEND INTERFACE
- Publication number 20200339413
- Publication date Oct 29, 2020
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED PACKAGE STRUCTURE FOR MEMS ELEMENT AND ASIC CHIP AND MET...
- Publication number 20200262700
- Publication date Aug 20, 2020
- J-METRICS TECHNOLOGY Co., Ltd.
- Sheng-Lin Ma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ALIGNMENT MARK AND SEMICONDUCTOR DEVICE, AND FABRICATION METHODS TH...
- Publication number 20200161251
- Publication date May 21, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TRANSFER HEAD AND METHOD FOR TRANSFERRING MICRO DEVICES
- Publication number 20190267272
- Publication date Aug 29, 2019
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR BONDING WAFERS EUTECTICALLY, AND A WAFER COMPOSITE
- Publication number 20190135617
- Publication date May 9, 2019
- ROBERT BOSCH GmbH
- Axel GROSSE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and Apparatus for a Seal Ring Structure
- Publication number 20160194199
- Publication date Jul 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ying Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE BOND DESIGN FOR MEDIUM PRESSURE SENSOR
- Publication number 20150091107
- Publication date Apr 2, 2015
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Joe Pin Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and Device for Producing a Microfluidic Analysis Cartridge
- Publication number 20140322100
- Publication date Oct 30, 2014
- ROBERT BOSCH GmbH
- Franz Laermer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and Apparatus for a Seal Ring Structure
- Publication number 20140217557
- Publication date Aug 7, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ying Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THREE DIMENSIONAL ASSEMBLY OF DIAMAGNETIC MATERIALS USING MAGNETIC...
- Publication number 20140123461
- Publication date May 8, 2014
- President and Fellows of Harvard College
- George M. Whitesids
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Nano/micro roller bearing having tolerance compensation function an...
- Publication number 20140003746
- Publication date Jan 2, 2014
- INDUSTRY-ACADEMIC COOPERATION FOUNDATION YONSEI UNIVERSITY
- Dae Eun Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR WAFER AND STRIP LEVEL BATCH DIE ATTACH ASSEMBLY
- Publication number 20130285259
- Publication date Oct 31, 2013
- Caleb C. Han
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and System for Improving Alignment Precision of Parts in MEMS
- Publication number 20130205588
- Publication date Aug 15, 2013
- International Business Machines Corporation
- Stefano S. Oggioni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ANGLE CONTROL OF MULTI-CAVITY MOLDED COMPONENTS FOR MEMS AND NEMS G...
- Publication number 20130098865
- Publication date Apr 25, 2013
- Metadigm LLC
- Victor B. Kley
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120300283
- Publication date Nov 29, 2012
- Hitachi Displays, Ltd.
- Jun FUJIYOSHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ANCHOR AND SPACER STRUCTURE
- Publication number 20120295058
- Publication date Nov 22, 2012
- Pixtronix, Inc.
- Timothy J. Brosnihan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE HAVING MEMS ELEMENTS AND FABRICATION METHOD THEREOF
- Publication number 20120292722
- Publication date Nov 22, 2012
- Siliconware Precision Industries Co., Ltd.
- Chen-Han Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURE INCLUDING HOLDER UNIT AND DEVICE UNIT AND FIXING METHOD F...
- Publication number 20120024453
- Publication date Feb 2, 2012
- Canon Kabushiki Kaisha
- Takahisa Kato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF FABRICATING A MICRO-MECHANICAL COMPONENT
- Publication number 20110225801
- Publication date Sep 22, 2011
- Nivarox-Far S.A.
- Alexandre Fussinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Manufacturing method for a porous microneedle array and correspondi...
- Publication number 20110137254
- Publication date Jun 9, 2011
- Dick Scholten
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100072564
- Publication date Mar 25, 2010
- Yamaha Corporation
- Hiroshi Saitoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR IMPROVING ALIGNMENT PRECISION OF PARTS IN MEMS
- Publication number 20090211087
- Publication date Aug 27, 2009
- International Business Machines Corporation
- Stefano S. Oggioni
- B81 - MICRO-STRUCTURAL TECHNOLOGY

using structural alignment aids

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Laser-assisted material phase-change and expulsion micro-machining...

Modular 3-D printed devices for sample delivery and method

MEMS package with roughend interface

Integrated package structure for MEMS element and ASIC chip and met...

Alignment mark and semiconductor device, and fabrication methods th...

Method for bonding wafers eutectically, and a wafer composite

Methods of achieving universal interfacing using suspended and/or f...

MEMS package with roughend interface

Transfer head and method for transferring micro devices

Method and device for producing a microfluidic analysis cartridge

Microfluidic device

Die bond design for medium pressure sensor

Spatial light modulation element module, photolithographing apparat...

Edge construction on optical devices

Method for manufacturing substrate gap supporter

Method and apparatus for a seal ring structure

Component including two semiconductor elements, which are bonded to...

Three dimensional assembly of diamagnetic materials using magnetic...

MEMS micro-mirror assembly

Method of manufacturing a MEMS micro-mirror assembly

MEMS anchor and spacer structure

Display device

Method and system for improving alignment precision of parts in MEMS

Manufacturing method for a porous microneedle array and correspondi...

Angle control of multi-cavity molded components for MEMS and NEMS g...

Method and system for improving alignment precision of parts in MEMS

Method of fabricating a micro-mechanical component

Package structure having MEMS elements and fabrication method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

WAFER LEVEL PROXIMITY SENSOR AND METHOD OF MAKING SAME

DIE STACKING WITH CONTROLLED ANGULAR ALIGNMENT

DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT

HIGH-PRECISION ALIGNMENT METHOD FOR PRODUCING A DEVICE, AND DEVICE

Anchor Structure

PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE

Laser-Assisted Material Phase-Change and Expulsion Micro-Machining...

MEMS PACKAGE WITH ROUGHEND INTERFACE

INTEGRATED PACKAGE STRUCTURE FOR MEMS ELEMENT AND ASIC CHIP AND MET...

ALIGNMENT MARK AND SEMICONDUCTOR DEVICE, AND FABRICATION METHODS TH...

TRANSFER HEAD AND METHOD FOR TRANSFERRING MICRO DEVICES

METHOD FOR BONDING WAFERS EUTECTICALLY, AND A WAFER COMPOSITE

Method and Apparatus for a Seal Ring Structure

DIE BOND DESIGN FOR MEDIUM PRESSURE SENSOR

Method and Device for Producing a Microfluidic Analysis Cartridge

Method and Apparatus for a Seal Ring Structure

THREE DIMENSIONAL ASSEMBLY OF DIAMAGNETIC MATERIALS USING MAGNETIC...

Nano/micro roller bearing having tolerance compensation function an...

METHOD AND SYSTEM FOR WAFER AND STRIP LEVEL BATCH DIE ATTACH ASSEMBLY

Method and System for Improving Alignment Precision of Parts in MEMS

ANGLE CONTROL OF MULTI-CAVITY MOLDED COMPONENTS FOR MEMS AND NEMS G...

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

MEMS ANCHOR AND SPACER STRUCTURE

PACKAGE STRUCTURE HAVING MEMS ELEMENTS AND FABRICATION METHOD THEREOF

STRUCTURE INCLUDING HOLDER UNIT AND DEVICE UNIT AND FIXING METHOD F...

METHOD OF FABRICATING A MICRO-MECHANICAL COMPONENT

Manufacturing method for a porous microneedle array and correspondi...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD AND SYSTEM FOR IMPROVING ALIGNMENT PRECISION OF PARTS IN MEMS