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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68304using temporarily an auxiliary support

Industries

Patents Grantslast 30 patents

Information Patent Grant
Interbonded components, method for detaching components from interb...
- Patent number 12,059,881
- Issue date Aug 13, 2024
- Osram Opto Semiconductors GmbH
- Alexander Pfeuffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,996,401
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,948,808
- Issue date Apr 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Merged power pad for improving integrated circuit power delivery
- Patent number 11,688,704
- Issue date Jun 27, 2023
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,640,958
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar-last methods for forming semiconductor devices
- Patent number 11,631,630
- Issue date Apr 18, 2023
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support, adhesive sheet, laminated structure, semiconductor device,...
- Patent number 11,482,437
- Issue date Oct 25, 2022
- Ajinomoto Co., Inc.
- Masanori Ohkoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier structure and micro device structure
- Patent number 11,302,547
- Issue date Apr 12, 2022
- PlayNitride Display Co., Ltd.
- Pei-Hsin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing a substrate
- Patent number 11,260,646
- Issue date Mar 1, 2022
- Corning Incorporated
- Christina Sue Bennett
- B32 - LAYERED PRODUCTS
Information Patent Grant
Merged power pad for improving integrated circuit power delivery
- Patent number 11,233,025
- Issue date Jan 25, 2022
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,195,726
- Issue date Dec 7, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin optoelectronic modules with apertures and their manufacture
- Patent number 11,018,269
- Issue date May 25, 2021
- ams Sensor Singapore Pte. Ltd.
- Qichuan Yu
- G01 - MEASURING TESTING
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,004,838
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with protective member and method of manufact...
- Patent number 10,971,376
- Issue date Apr 6, 2021
- Samsung Electronics Co., Ltd.
- Jae Seon Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar electrode arrays and fabrication methods thereof
- Patent number 10,969,359
- Issue date Apr 6, 2021
- National Technology & Engineering Solutions of Sandia, LLC
- Eric John Schindelholz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pillar-last methods for forming semiconductor devices
- Patent number 10,957,625
- Issue date Mar 23, 2021
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,861,842
- Issue date Dec 8, 2020
- STMicroelectronics S.r.l.
- Alberto Pagani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Porous semiconductor handle substrate
- Patent number 10,784,348
- Issue date Sep 22, 2020
- QUALCOMM Incorporated
- Stephen Alan Fanelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a chip component
- Patent number 10,763,016
- Issue date Sep 1, 2020
- Rohm Co., Ltd.
- Hiroshi Tamagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,707,111
- Issue date Jul 7, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making fully molded peripheral package on package device
- Patent number 10,672,624
- Issue date Jun 2, 2020
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-scale synthesis of large-area black phosphorus material heter...
- Patent number 10,636,654
- Issue date Apr 28, 2020
- Yale University
- Fengnian Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interconnect substrate f...
- Patent number 10,607,946
- Issue date Mar 31, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,553,451
- Issue date Feb 4, 2020
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 10,490,470
- Issue date Nov 26, 2019
- Infineon Technologies AG
- Hock Heng Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of probe testing
- Patent number 10,461,000
- Issue date Oct 29, 2019
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined structure of flexible semiconductor device package and met...
- Patent number 10,453,671
- Issue date Oct 22, 2019
- Samsung Electronics Co., Ltd.
- Maohua Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,453,833
- Issue date Oct 22, 2019
- STMicroelectonics S.R.L.
- Alberto Pagani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332032
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN
- Publication number 20210249399
- Publication date Aug 12, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLAR-LAST METHODS FOR FORMING SEMICONDUCTOR DEVICES
- Publication number 20210166996
- Publication date Jun 3, 2021
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOVEABLE EDGE RING DESIGNS
- Publication number 20200020565
- Publication date Jan 16, 2020
- LAM RESEARCH CORPORATION
- Hiran Rajitha RATHNASINGHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PROCESSING A SUBSTRATE
- Publication number 20190275782
- Publication date Sep 12, 2019
- Corning Incorporated
- Christina Sue Bennett
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor Packages and Methods of Forming the Same
- Publication number 20180374836
- Publication date Dec 27, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
- Publication number 20180330966
- Publication date Nov 15, 2018
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180308712
- Publication date Oct 25, 2018
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND A...
- Publication number 20180301609
- Publication date Oct 18, 2018
- EPISTAR CORPORATION
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods for Bidirectional Device Fabrication
- Publication number 20180226254
- Publication date Aug 9, 2018
- IDEAL POWER INC.
- Richard A. Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...
- Publication number 20180174881
- Publication date Jun 21, 2018
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20180130784
- Publication date May 10, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20180102353
- Publication date Apr 12, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO
- Publication number 20180096962
- Publication date Apr 5, 2018
- EV GROUP E. THALLNER GMBH
- Andreas FEHKUHRER
- B32 - LAYERED PRODUCTS
Information Patent Application
ATTACHING DEVICE AND ATTACHING METHOD
- Publication number 20150262858
- Publication date Sep 17, 2015
- Tokyo Ohka Kogyo Co., Ltd.
- Yoshihiro Inao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BIDIRECTIONAL DEVICE FABRICATION
- Publication number 20150214055
- Publication date Jul 30, 2015
- IDEAL POWER INC.
- Richard A. Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM PROCESSING DEVICE
- Publication number 20140216658
- Publication date Aug 7, 2014
- Shigeharu Minami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20140203387
- Publication date Jul 24, 2014
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS
- Publication number 20140138818
- Publication date May 22, 2014
- Alexsandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING METHOD OF EMBEDDED PACKAGE STRUCTURE
- Publication number 20140033526
- Publication date Feb 6, 2014
- Unimicron Technology Corp.
- Tsung-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140017854
- Publication date Jan 16, 2014
- Xintec Inc.
- Ching-Yu NI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20130299961
- Publication date Nov 14, 2013
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20130241025
- Publication date Sep 19, 2013
- STMicroelectronics S.r. I.
- Alberto PAGANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDISTRIBUTING FUNCTIONAL ELEMENT
- Publication number 20130237055
- Publication date Sep 12, 2013
- IMEC
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STACK STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20130168868
- Publication date Jul 4, 2013
- Xintec Inc.
- Yeh-Shih Ho
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MISALIGNMENT CORRECTION FOR EMBEDDED MICROELECTRONIC DIE APPLICATIONS
- Publication number 20130119046
- Publication date May 16, 2013
- Grant A. Crawford
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL RING STRUCTURE WITH A METAL PAD
- Publication number 20130082346
- Publication date Apr 4, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interconnect Substration...
- Publication number 20130075936
- Publication date Mar 28, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductor Structural Element and Method for Producing a Conductor S...
- Publication number 20120320549
- Publication date Dec 20, 2012
- Schweizer Electronic AG
- Thomas Gottwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING OF CHIPS ON WAFERS
- Publication number 20120184069
- Publication date Jul 19, 2012
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS

using temporarily an auxiliary support

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interbonded components, method for detaching components from interb...

Packaged die and RDL with bonding structures therebetween

Semiconductor device and manufacturing method thereof

Merged power pad for improving integrated circuit power delivery

Packaged die and RDL with bonding structures therebetween

Pillar-last methods for forming semiconductor devices

Support, adhesive sheet, laminated structure, semiconductor device,...

Carrier structure and micro device structure

Methods for processing a substrate

Merged power pad for improving integrated circuit power delivery

Semiconductor device and manufacturing method thereof

Thin optoelectronic modules with apertures and their manufacture

Packaged die and RDL with bonding structures therebetween

Printed circuit board with protective member and method of manufact...

Planar electrode arrays and fabrication methods thereof

Pillar-last methods for forming semiconductor devices

Electronic system having increased coupling by using horizontal and...

Porous semiconductor handle substrate

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Method of manufacturing a chip component

Wafer level flat no-lead semiconductor packages and methods of manu...

Method of making fully molded peripheral package on package device

Wafer-scale synthesis of large-area black phosphorus material heter...

Semiconductor device and method of forming interconnect substrate f...

Semiconductor device and manufacturing method thereof

Semiconductor package and method for fabricating a semiconductor pa...

Semiconductor wafer and method of probe testing

Combined structure of flexible semiconductor device package and met...

Electronic system having increased coupling by using horizontal and...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN

PILLAR-LAST METHODS FOR FORMING SEMICONDUCTOR DEVICES

MOVEABLE EDGE RING DESIGNS

METHODS FOR PROCESSING A SUBSTRATE

Semiconductor Packages and Methods of Forming the Same

FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND A...

Systems and Methods for Bidirectional Device Fabrication

WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO

ATTACHING DEVICE AND ATTACHING METHOD

SYSTEMS AND METHODS FOR BIDIRECTIONAL DEVICE FABRICATION

VACUUM PROCESSING DEVICE

SEMICONDUCTOR CHIP PACKAGE AND METHOD FOR MANUFACTURING THEREOF

ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS

FABRICATING METHOD OF EMBEDDED PACKAGE STRUCTURE

CHIP PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

METHOD OF REDISTRIBUTING FUNCTIONAL ELEMENT

SEMICONDUCTOR STACK STRUCTURE AND FABRICATION METHOD THEREOF

MISALIGNMENT CORRECTION FOR EMBEDDED MICROELECTRONIC DIE APPLICATIONS

SEAL RING STRUCTURE WITH A METAL PAD

Semiconductor Device and Method of Forming Interconnect Substration...

Conductor Structural Element and Method for Producing a Conductor S...

METHOD FOR BONDING OF CHIPS ON WAFERS