using the surface tension of fluid solder to align the elements

Industry

CPC
B81C2203/055

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

Current Industry

B81C2203/055using the surface tension of fluid solder to align the elements

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method for self-aligning solder-attached mems die to a mounting sur...
- Patent number 10,662,057
- Issue date May 26, 2020
- DunAn Microstaq, Inc.
- Wayne C. Long
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for self-aligning solder-attached MEMS die to a mounting sur...
- Patent number 10,189,706
- Issue date Jan 29, 2019
- DunAn Microstaq, Inc.
- Wayne C. Long
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die bond design for medium pressure sensor
- Patent number 10,035,703
- Issue date Jul 31, 2018
- Continental Automotive Systems, Inc.
- Joe Pin Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for improving alignment precision of parts in MEMS
- Patent number 8,707,553
- Issue date Apr 29, 2014
- International Business Machines Corporation
- Stefano S. Oggioni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for disposing a component
- Patent number 8,414,976
- Issue date Apr 9, 2013
- Panasonic Corporation
- Hidekazu Arase
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for aligning devices
- Patent number 7,427,527
- Issue date Sep 23, 2008
- Surfect Technologies, Inc.
- Gerard Minogue
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Method For Self-Aligning Solder-Attached Mems Die To A Mounting Sur...
- Publication number 20190092629
- Publication date Mar 28, 2019
- DunAn Microstaq, Inc.
- Wayne C. Long
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method For Self-Aligning Solder-Attached Mems Die To A Mounting Sur...
- Publication number 20190092630
- Publication date Mar 28, 2019
- DunAn Microstaq, Inc.
- Wayne C. Long
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method For Self-Aligning Solder-Attached Mems Die To A Mounting Sur...
- Publication number 20180127269
- Publication date May 10, 2018
- DunAn Microstaq, Inc.
- Wayne C. Long
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE BOND DESIGN FOR MEDIUM PRESSURE SENSOR
- Publication number 20150091107
- Publication date Apr 2, 2015
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Joe Pin Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR DISPOSING A COMPONENT
- Publication number 20120269971
- Publication date Oct 25, 2012
- PANASONIC CORPORATION
- Hidekazu ARASE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR IMPROVING ALIGNMENT PRECISION OF PARTS IN MEMS
- Publication number 20090211087
- Publication date Aug 27, 2009
- International Business Machines Corporation
- Stefano S. Oggioni
- B81 - MICRO-STRUCTURAL TECHNOLOGY

using the surface tension of fluid solder to align the elements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for self-aligning solder-attached mems die to a mounting sur...

Method for self-aligning solder-attached MEMS die to a mounting sur...

Die bond design for medium pressure sensor

Method and system for improving alignment precision of parts in MEMS

Method for disposing a component

Method for aligning devices

Patents Applicationslast 30 patents

Method For Self-Aligning Solder-Attached Mems Die To A Mounting Sur...

Method For Self-Aligning Solder-Attached Mems Die To A Mounting Sur...

Method For Self-Aligning Solder-Attached Mems Die To A Mounting Sur...

DIE BOND DESIGN FOR MEDIUM PRESSURE SENSOR

METHOD FOR DISPOSING A COMPONENT

METHOD AND SYSTEM FOR IMPROVING ALIGNMENT PRECISION OF PARTS IN MEMS