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CPC
H01L2924/40501

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/40501UV spectrum

Industries

Patents Grantslast 30 patents

Information Patent Grant
Laser processing method
- Patent number 11,114,341
- Issue date Sep 7, 2021
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser ashing of polyimide for semiconductor manufacturing
- Patent number 9,865,564
- Issue date Jan 9, 2018
- GLOBALFOUNDRIES Inc.
- Maxime Cadotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with embedded die and its methods of fabrication
- Patent number 9,780,054
- Issue date Oct 3, 2017
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip integration with through silicon via (TSV) die embedded i...
- Patent number 9,716,084
- Issue date Jul 25, 2017
- Intel Corporation
- Digvijay A. Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate manufacturing method, semiconductor element man...
- Patent number 9,455,229
- Issue date Sep 27, 2016
- Namiki Seimitsu Houseki Kabushiki Kaisha
- Hideo Aida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multichip integration with through silicon via (TSV) die embedded i...
- Patent number 9,397,079
- Issue date Jul 19, 2016
- Intel Corporation
- Digvijay A. Raorane
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LASER PROCESSING METHOD
- Publication number 20200135563
- Publication date Apr 30, 2020
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTICHIP INTEGRATION WITH THROUGH SILICON VIA (TSV) DIE EMBEDDED I...
- Publication number 20150171067
- Publication date Jun 18, 2015
- Intel Corporation
- Digvijay A. Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ASHING OF POLYIMIDE FOR SEMICONDUCTOR MANUFACTURING
- Publication number 20150162300
- Publication date Jun 11, 2015
- International Business Machines Corporation
- Maxime Cadotte
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPOSITE SUBSTRATE MANUFACTURING METHOD, SEMICONDUCTOR ELEMENT MAN...
- Publication number 20150076662
- Publication date Mar 19, 2015
- NAMIKI SEIMITSU HOUSEKI KABUSHIKIKAISHA
- Hideo Aida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION METHOD AND RECIPE FOR SACRIFICIAL MATERIAL PATTERNIN...
- Publication number 20150072515
- Publication date Mar 12, 2015
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EMBEDDED DIE AND ITS METHODS OF FABRICATION
- Publication number 20150050781
- Publication date Feb 19, 2015
- lintel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP INTEGRATION WITH THROUGH SILICON VIA (TSV) DIE EMBEDDED I...
- Publication number 20140332975
- Publication date Nov 13, 2014
- Digvijay A. Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ASHING OF POLYIMIDE FOR SEMICONDUCTOR MANUFACTURING
- Publication number 20120111496
- Publication date May 10, 2012
- International Business Machines Corporation
- Maxime Cadotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package with embedded die and its methods of fabrication
- Publication number 20110215464
- Publication date Sep 8, 2011
- Intel Corporation
- John Stephen Guzek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

UV spectrum

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Laser processing method

Laser ashing of polyimide for semiconductor manufacturing

Semiconductor package with embedded die and its methods of fabrication

Multichip integration with through silicon via (TSV) die embedded i...

Composite substrate manufacturing method, semiconductor element man...

Multichip integration with through silicon via (TSV) die embedded i...

Patents Applicationslast 30 patents

LASER PROCESSING METHOD

MULTICHIP INTEGRATION WITH THROUGH SILICON VIA (TSV) DIE EMBEDDED I...

LASER ASHING OF POLYIMIDE FOR SEMICONDUCTOR MANUFACTURING

COMPOSITE SUBSTRATE MANUFACTURING METHOD, SEMICONDUCTOR ELEMENT MAN...

LASER ABLATION METHOD AND RECIPE FOR SACRIFICIAL MATERIAL PATTERNIN...

SEMICONDUCTOR PACKAGE WITH EMBEDDED DIE AND ITS METHODS OF FABRICATION

MULTICHIP INTEGRATION WITH THROUGH SILICON VIA (TSV) DIE EMBEDDED I...

LASER ASHING OF POLYIMIDE FOR SEMICONDUCTOR MANUFACTURING

Semiconductor package with embedded die and its methods of fabrication