Vacuum chamber

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CPC
H01L2224/75102

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75102Vacuum chamber

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding cavity structure and bonding method
- Patent number 11,916,040
- Issue date Feb 27, 2024
- Shanghai IC R&D Center Co., Ltd.
- Xinyu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extending life cycles of vacuum pumps used in manufacturing processes
- Patent number 11,905,955
- Issue date Feb 20, 2024
- Kashiyama Industries, Ltd.
- Yoshinori Christopher Dokko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,776,932
- Issue date Oct 3, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,626,383
- Issue date Apr 11, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Methods of bonding of semiconductor elements to substrates, and rel...
- Patent number 11,616,042
- Issue date Mar 28, 2023
- Kulicke and Soffa Industries, Inc.
- Adeel Ahmad Bajwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting system
- Patent number 11,587,804
- Issue date Feb 21, 2023
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch processing oven and method
- Patent number 11,444,053
- Issue date Sep 13, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonder
- Patent number 11,367,702
- Issue date Jun 21, 2022
- Tazmo Co., Ltd.
- Masaaki Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow oven for batch processing
- Patent number 11,335,662
- Issue date May 17, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of bonding of semiconductor elements to substrates, and rel...
- Patent number 11,205,633
- Issue date Dec 21, 2021
- Kulicke and Soffa Industries, Inc.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing perovskite solar cell module and perovskit...
- Patent number 11,114,252
- Issue date Sep 7, 2021
- CPC CORPORATION, TAIWAN
- Kuan-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding device
- Patent number 11,049,840
- Issue date Jun 29, 2021
- Osaka University
- Katsuaki Suganuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing soldered product
- Patent number 10,843,300
- Issue date Nov 24, 2020
- ORIGIN COMPANY, LIMITED
- Yukiko Hayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting device and circuit chip connecting method using connecti...
- Patent number 10,756,045
- Issue date Aug 25, 2020
- Samsung Display Co., Ltd.
- Seung Hwa Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for inhibiting bonding materials from contamina...
- Patent number 10,700,038
- Issue date Jun 30, 2020
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates together, and substrate bonding device
- Patent number 10,580,752
- Issue date Mar 3, 2020
- BONDTECH CO., LTD.
- Akira Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatuses for high temperature bonding controlled pro...
- Patent number 10,500,661
- Issue date Dec 10, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Hannes Martin Hinrich Greve
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding systems
- Patent number 10,340,248
- Issue date Jul 2, 2019
- Tokyo Electron Limited
- Masataka Matsunaga
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Vacuum-processing device and control method therefor, and vacuum so...
- Patent number 10,307,849
- Issue date Jun 4, 2019
- Senju Metal Industry Co., Ltd.
- Tomotake Kagaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D-joining of microelectronic components with conductively self-adj...
- Patent number 10,297,570
- Issue date May 21, 2019
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum drying apparatus and vacuum drying method using the same
- Patent number 9,927,172
- Issue date Mar 27, 2018
- BOE Technology Group Co., Ltd.
- Hao Wang
- F26 - DRYING
Information Patent Grant
Method of manufacturing an electronic device, and electronic device...
- Patent number 9,911,642
- Issue date Mar 6, 2018
- Fujitsu Limited
- Taiji Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a chip assembly with a die attach liquid
- Patent number 9,837,381
- Issue date Dec 5, 2017
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal compression bonding process cooling manifold
- Patent number 9,748,199
- Issue date Aug 29, 2017
- Intel Corporation
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Au-based solder die attachment semiconductor device and method for...
- Patent number 9,698,082
- Issue date Jul 4, 2017
- Nissan Motor Co., Ltd.
- Satoshi Tanimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a composite and a power semiconductor module
- Patent number 9,688,060
- Issue date Jun 27, 2017
- Infineon Technologies AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for chip-to-wafer integration
- Patent number 9,613,928
- Issue date Apr 4, 2017
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced expansion thermal compression bonding process bond head
- Patent number 9,548,284
- Issue date Jan 17, 2017
- Intel Corporation
- Pramod Malatkar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
COMPRESSION TYPE LASER REFLOW APPARATUS WITH VACUUM CHAMBER
- Publication number 20230387069
- Publication date Nov 30, 2023
- LASERSSEL CO., LTD.
- Jae Joon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING CAVITY STRUCTURE AND BONDING METHOD
- Publication number 20220068875
- Publication date Mar 3, 2022
- Shanghai IC R&D Center Co., Ltd.
- Xinyu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND REL...
- Publication number 20210391297
- Publication date Dec 16, 2021
- KULICKE AND SOFFA INDUSTRIES, INC.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH PROCESSING OVEN AND METHOD
- Publication number 20210265301
- Publication date Aug 26, 2021
- Yield Engineering Systems, Inc.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COVALENTLY BONDED SEMICONDUCTOR INTERFACES
- Publication number 20210225803
- Publication date Jul 22, 2021
- G-ray Industries SA
- Hans VON KÄNEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING
- Publication number 20210104488
- Publication date Apr 8, 2021
- DANFOSS SILICON POWER GMBH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND REL...
- Publication number 20210098414
- Publication date Apr 1, 2021
- KULICKE AND SOFFA INDUSTRIES, INC.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT MOUNTING SYSTEM, RESIN SHAPING DEVICE, RESIN PLACING DEVI...
- Publication number 20200006099
- Publication date Jan 2, 2020
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
BONDER
- Publication number 20190393185
- Publication date Dec 26, 2019
- TAZMO CO., LTD.
- Masaaki TANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR INHIBITING BONDING MATERIALS FROM CONTAMINA...
- Publication number 20190067238
- Publication date Feb 28, 2019
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING DEVICE AND CIRCUIT CHIP CONNECTING METHOD USING CONNECTI...
- Publication number 20180211933
- Publication date Jul 26, 2018
- SAMSUNG DISPLAY CO., LTD.
- Seung Hwa HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR ESPECIALLY THERMALLY JOINING MICRO-ELECTROMECHANICAL...
- Publication number 20170243851
- Publication date Aug 24, 2017
- ATV TECHNOLOGIE GMBH
- Ventzeslav RANGELOV
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR BONDING SUBSTRATES TOGETHER, AND SUBSTRATE BONDING DEVICE
- Publication number 20170221856
- Publication date Aug 3, 2017
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods And Apparatuses For High Temperature Bonding Controlled Pro...
- Publication number 20170129031
- Publication date May 11, 2017
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Hannes Martin Hinrich Greve
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
REFLOW APPARATUS
- Publication number 20170005063
- Publication date Jan 5, 2017
- Samsung Electronics Co., Ltd.
- Tae-gyu KANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Chip-To-Wafer Integration
- Publication number 20160155720
- Publication date Jun 2, 2016
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Placing and Mounting Solder Balls on an In...
- Publication number 20150228613
- Publication date Aug 13, 2015
- Zen Voce Corporation
- Tu-Chen Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD
- Publication number 20150173209
- Publication date Jun 18, 2015
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCED EXPANSION THERMAL COMPRESSION BONDING PROCESS BOND HEAD
- Publication number 20150171047
- Publication date Jun 18, 2015
- Intel Corporation
- Pramod Malatkar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...
- Publication number 20140342504
- Publication date Nov 20, 2014
- FUJITSU LIMITED
- Taiji SAKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-WAFER PAIR ANODIC BONDING APPARATUS AND METHOD
- Publication number 20140322892
- Publication date Oct 30, 2014
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
Two-Step Direct Bonding Processes and Tools for Performing the Same
- Publication number 20140263583
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM THERMAL BONDING APPARATUS AND VACUUM THERMAL BONDING METHOD
- Publication number 20140033518
- Publication date Feb 6, 2014
- MIKADO TECHNOS CO., LTD.
- Takashi Ito
- B32 - LAYERED PRODUCTS
Information Patent Application
STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...
- Publication number 20130292168
- Publication date Nov 7, 2013
- ROBERT BOSCH GmbH
- Daniel Wolde-Giorgis
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Method for Producing a Composite and a Power Semiconductor Module
- Publication number 20130203218
- Publication date Aug 8, 2013
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...
- Publication number 20130187293
- Publication date Jul 25, 2013
- Fujitsu Limited
- Taiji SAKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP BONDING PROCESS
- Publication number 20120318851
- Publication date Dec 20, 2012
- WALSIN LIHWA CORPORATION
- Wei-Cheng LOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS
- Publication number 20120318850
- Publication date Dec 20, 2012
- WALSIN LIHWA CORPORATION
- Wei-Cheng LOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE INCLUDING A SINTERED JOINT BONDING A SEMICONDUCTOR CHIP TO A...
- Publication number 20120312864
- Publication date Dec 13, 2012
- INFINEON TECHNOLOGIES AG
- Karsten Guth
- H01 - BASIC ELECTRIC ELEMENTS

Vacuum chamber

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding cavity structure and bonding method

Extending life cycles of vacuum pumps used in manufacturing processes

Process and device for low-temperature pressure sintering

Process and device for low-temperature pressure sintering

Methods of bonding of semiconductor elements to substrates, and rel...

Component mounting system

Chip assembly

Batch processing oven and method

Bonder

Solder reflow oven for batch processing

Methods of bonding of semiconductor elements to substrates, and rel...

Method for manufacturing perovskite solar cell module and perovskit...

Bonding device

Method for producing soldered product

Connecting device and circuit chip connecting method using connecti...

Methods and systems for inhibiting bonding materials from contamina...

Chip assembly

Method for bonding substrates together, and substrate bonding device

Methods and apparatuses for high temperature bonding controlled pro...

Bonding systems

Vacuum-processing device and control method therefor, and vacuum so...

3D-joining of microelectronic components with conductively self-adj...

Vacuum drying apparatus and vacuum drying method using the same

Method of manufacturing an electronic device, and electronic device...

Method of forming a chip assembly with a die attach liquid

Thermal compression bonding process cooling manifold

Au-based solder die attachment semiconductor device and method for...

Method for producing a composite and a power semiconductor module

Method and apparatus for chip-to-wafer integration

Reduced expansion thermal compression bonding process bond head

Patents Applicationslast 30 patents

COMPRESSION TYPE LASER REFLOW APPARATUS WITH VACUUM CHAMBER

BONDING CAVITY STRUCTURE AND BONDING METHOD

METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND REL...

BATCH PROCESSING OVEN AND METHOD

COVALENTLY BONDED SEMICONDUCTOR INTERFACES

PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING

METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND REL...

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

COMPONENT MOUNTING SYSTEM, RESIN SHAPING DEVICE, RESIN PLACING DEVI...

BONDER

METHODS AND SYSTEMS FOR INHIBITING BONDING MATERIALS FROM CONTAMINA...

CONNECTING DEVICE AND CIRCUIT CHIP CONNECTING METHOD USING CONNECTI...

APPARATUS FOR ESPECIALLY THERMALLY JOINING MICRO-ELECTROMECHANICAL...

METHOD FOR BONDING SUBSTRATES TOGETHER, AND SUBSTRATE BONDING DEVICE

Methods And Apparatuses For High Temperature Bonding Controlled Pro...

REFLOW APPARATUS

Method and Apparatus for Chip-To-Wafer Integration

Apparatus and Method for Placing and Mounting Solder Balls on an In...

THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD

REDUCED EXPANSION THERMAL COMPRESSION BONDING PROCESS BOND HEAD

ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...

MULTI-WAFER PAIR ANODIC BONDING APPARATUS AND METHOD

Two-Step Direct Bonding Processes and Tools for Performing the Same

VACUUM THERMAL BONDING APPARATUS AND VACUUM THERMAL BONDING METHOD

STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...

Method for Producing a Composite and a Power Semiconductor Module

ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...

CHIP BONDING PROCESS

CHIP BONDING APPARATUS

MODULE INCLUDING A SINTERED JOINT BONDING A SEMICONDUCTOR CHIP TO A...